47457-8001 MOLEX | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

FEATURES AND SPECIFICATIONS SPECIIFICATIONS 1.30mm (.051") Pitch miniSD Memory Card Connector 47457 Top Mount Push-push SMT 48050 Bottom Mount Push-Push SMT Molex offers 2 more miniSD card connector to its existing range Small and compact, the miniSD connector is about 30% smaller than the original Secure Digital (SD*) connector. This reduction in size allows the design of smaller applications with SD architecture interface. The miniSD card is backward compatible with the SD connector via a card an adaptor which provides user the flexibility of having a miniSD card for both SD and miniSD applications. Some of the design features include molded spring for strong card retention, effective metal shielding against EMI, RFI and ESD. A detect switch is deployed to ensure the connectivity of card to connector. The push-push feature aids user in inserting and extracting the card. Molex miniSD card connector comes in standard and reverse mount versions. Please refer to Molex's Website and the Miniature Memory Card Catalog available in Literature Central for Molex's full range of miniSD connectors. *miniSD and SD is a registered trademark of Secure Digital Association Features Benefits Card detect switch  Confirms card presence Read/Write protection switch  Provides protection of content in the SD Card Low profile, compact size  Space savings Metal shield  EMI/RFI and ESD protection Solder tabs  Strong retention of connector to PCB Beveled spring terminal design  Secure mating of card to connector Reference Information Packaging: Embossed Tape on Reel UL File No.: CSA File No.: Uses With: miniSD memory card Designed In: mm Electrical Current: 0.5A Voltage: 10V max Contact Resistance: 40 milliohms max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 milliohms min Mechanical Insertion Force: 5±1.5 N (0.51±0.15 kgf) Unmating kgf) Durability: 10,000 cycles Physical Housing: Thermoplastic, High Temperature, UL 94V-0 Contact: Copper (Cu) Alloy Plating: Contact Area — Gold (Au) Solder Tail Area — T in (Sn) Underplating — N ickel (Ni) PCB Thickness: 1.2mm (.045") Operating Temperature: -25°C to +90°C

ORDERING INFORMATION

Visit our Web site at http://www.molex.com Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 MARKETS AND APPLICATIONS Order No. SNG-074 ©2007, Molex Markets and Applications Mobile phones PDA Digital Still Camera Digital Video Camera Portable digital audio player GPS 1.30mm (.051") Pitch miniSD Memory Card Connector 47457 Top Mount Push-push SMT 48050 Bottom Mount Push-Push SMT Mobile phone Portable audio player PDA DVC DSC Description Lead free Order No. Remarks 1.30mm (.051") Pitch miniSD Memory Card Connector, Top Mount Type 47457-8001 With post 47457-8002 Without post 1.30mm (.051") Pitch miniSD Memory Card Connector, Reverse Mount Type 48050-0001 __