450-0118C LSTD | Alldatasheet
Document overview
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Technical content
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 1 of 35 Integrated 802.11 b/g/n WLAN Module
FEATURES
- IEEE 802.11 b/g/n (single stream n)
- Typical WLAN Transmit Power: o +19.0 dBm, 1 Mbps, CCK (b) o +15.8 dBm, 54 Mbps, OFDM (g) o +15.0 dBm, HT20 MCS7 (n)
- Typical WLAN Sensitivity: o -90 dBm, 8% PER,11 Mbps (b) o -73 dBm, 10% PER, 54 Mbps (g) o -71 dBm, 10% PER, MCS7 (n)
- Miniature footprint: 10.5 mm x 10.5 mm
- Low height profile: 1.4 mm
- Operating voltage: 3.13V to 3.46V
- Operating temperature: -40 to +85o C
- Compact design based on Broadcom BCM4390 SoC
- Integrated ARM Cortex-M3 apps processor
- Wireless Security WEP, WPA Personal, WPA2 Personal
- Transmit and receive antenna diversity
- UART serial host interface
- Simple integration with microcontrollers and microprocessors
- Worldwide acceptance: FCC (USA), IC (Canada), and CE (Europe)
- Modular certification allows reuse of LSR FCC ID and ETSI certification without repeating the expensive testing on your end product
- RoHS compliant
- Streamlined development with LSR Design Services
APPLICATIONS
- Thermostats, appliances, HVAC controller, and remote displays, Smart Energy
- Home entertainment control
- Sensor Networks
- Medical
- Home Monitoring
- Toys
DESCRIPTION
The TiWi-C-W is a high performance 2.4 GHz WLAN module that contains an IP networking stack in a pre- certified footprint that simplifies the process of implementing internet connectivity. The module includes the necessary PHY, MAC, and network layers to support WLAN applications on the integrated applications processor, or through a simple host interface. Need to get to market quickly? Not an expert in 802.11. Need a custom antenna? Would you like to own the design? Would you like a custom design? Not quite sure what you need? Do you need help with your host board? LSR Design Services will be happy to develop custom hardware or software, or assist with integrating the design. Contact us at sales@lsr.com or call us at 262- 375-4400.
- Home automation
- Home Network aggregators
- Remote appliance diagnostics/support
- Home security
- Remote storage devices
- Home network appliance
- Cameras and video surveillance
- Fitness
- Cable replacement for medical and personal healthcare
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 2 of 35
ORDERING INFORMATION
450-0118C TiWi-C-W Module (Cut Tape) 450-0118R TiWi-C-W Module (Tape and Reel, SPQ = 2000) 450-0137 TiWi-C-W Evaluation Platform 450-0143 TiWi-C-W Development Kit featuring TiWiConnect 450-0164 TiWi-C-W Serial-to-WiFi Development Kit Table 1 Orderable TiWi-C-W Part Numbers MODULE ACCESSORIES Order Number Description 001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm 001-0014 2.4 GHz FlexPIFA Antenna 001-0030 2.4 GHz Metal FlexPIFA Antenna w/U.FL Cable, 100 mm Table 2 Module Accessories APPLICABLE DOCUMENTS
- TiWi-C-W Module Application Guide (330-0158)
- TiWi-C-W Evaluation Platform User Guide (330-0159
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 3 of 35 TABLE OF CONTENTS
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 4 of 35
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 5 of 35 BLOCK DIAGRAM TiWi-C-W Module BCM4390 ANT 1VCC UART I2S GPIO 32.768 kHz Oscillator Low Pass Filter TX/RX Switch
37.4 MHz
VCC_OSC Figure 1 TiWi-C-W Module Block Diagram – Top Level FUNCTIONAL BLOCK FEATURES WLAN Features
- IEEE802.11b/g/n 1x1 2.4 GHz Radio
- Single Transmit and Single or Dual Receive Antenna Support
- Media Access Controller (MAC)
- Baseband Processor
- Standards o IEEE 802.11b, 802.11g, 802.11n o IEEE 802.11 d/i (regulatory domains and WPA2) o IEEE 802.11r (fast roaming between Aps) o IEEE 802.11w (secure management frames)
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 6 of 35 Network Stack Supported Protocols
- Transport layer: o TCP o UDP
- Network layer: o IPv4, IPv6 o Ping o DHCP o HTTP o NTP o DNS Client
- Link layer: o ARP Wireless Security System Features
- Supported modes: o Open (no security) o WEP o WPA Personal o WPA2 Personal
- Supported encryption types: o Open o WEP o AES (hardware accelerator) o TKIP (hardware accelerator)
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 7 of 35 TIWI-C-W MODULE FOOTPRINT AND PIN DEFINITIONS To apply the TiWi-C-W module, it is important to use the module pins in your application as they are designated below, and in the corresponding pin definition table found on pages 8 and 9. Not all the pins on the TiWi-C-W module may be used, as some are reserved. Figure 2 TiWi-C-W Pinout (Top View)
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 8 of 35 PIN DESCRIPTIONS Module Pin Name I/O Type Description
1 GND GND GROUND
2 VCC PI POWER TO MODULE (3.13-3.46 VDC)
3 GND GND GROUND
4 RESET_N DI ACTIVE LOW RESET INPUT. MUST BE PULLED UP TO VCC WITH A 10k OHM RESISTOR.
5 GPIO_A11 DIO GPIO A11
6 FLASH_OVERIDE DIO
INTERNAL FLASH PROGRAMMING OVERIDE. CAN BE USED TO ASSIST IN A FORCED FLASH ERASE. SHOULD BE BROUGHT TO AND EXTERNAL PAD OR PIN. 7 OSC_32K_OUT DO 32.768 kHz OSCILLATOR OUTPUT 8 VCC_OSC PI POWER TO 32.768 kHz OSCILLATOR (3.13-3.46 VDC)
9 GND GND GROUND
10 ANTENNA 1 RF ANTENNA 1, 50 OHMS, SECONDARY RX ANTENNA
11 GND GND GROUND
12 GPIO_A10 DIO GPIO A10
13 GND GND GROUND
14 ANTENNA 0 RF ANTENNA 0, 50 OHMS, TX AND PRIMARY RX ANTENNA
15 GND GND GROUND
16 I2S_WS_UART2_TXD_A7 DIO UART2 TRANSMIT DATA OUTPUT / GPIO A7
17 I2S_WS_UART2_RXD_A9 DIO UART 2 RECEIVE DATA INPUT / GPIO A9
18 GPIO_A8 DIO GPIO A8
19 GPIO_A6 DIO GPIO A6
20 GND GND GROUND
21 UART1_CTS_N_A1 DIO UART 1 ACTIVE LOW CLEAR-TO-SEND / GPIO A1
22 UART1_RXD DI UART 1 RECEIVE DATA INPUT
23 UART1_RTS_N_A0 DIO UART 1 ACTIVE LOW REQUEST-TO-SEND / GPIO A0
24 UART1_TXD DO UART 1 TRANSMIT DATA OUTPUT
25 GND GND GROUND
26 VCC PI POWER TO MODULE (3.13-3.46 VDC)
27 GND GND GROUND
28 JTAG_TCK_A3 DIO APPS JTAG TCK / GPIO A3
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 9 of 35 Module Pin Name I/O Type Description
29 JTAG_TD0_A5 DIO APPS JTAG TDO / GPIO A5
30 JTAG_TMS_A2 DIO APPS JTAG TMS / GPIO A2
31 JTAG_TDI_A4 DIO APPS JTAG TDI / GPIO A4
32 WRF_GPIO_OUT DIO
33 UART4_TXD DO UART 4 TRANSMIT DATA OUTPUT
34 UART4_RXD DI UART 4 RECEIVE DATA INPUT
35 NC - NO CONNECT (DO NOT CONNECT)
36 NC - NO CONNECT (DO NOT CONNECT)
37 CLK_IN - UNUSED CLOCK IN. CONNECT TO GND THROUGH 1k OHM RESISTOR.
38 NC - NO CONNECT (DO NOT CONNECT)
39 NC - NO CONNECT (DO NOT CONNECT)
40 NC - NO CONNECT (DO NOT CONNECT)
41 GPIO_B2 DIO GPIO B2
42 GPIO_B3 DIO GPIO B3
43 GPIO_B5 DIO GPIO B5
44 GPIO_B6 DIO GPIO B6
45 GPIO_B4 DIO GPIO B4
46 GND GND GROUND
47 VCC PI POWER TO MODULE (3.13-3.46 VDC)
48 GND GND GROUND
49 GPIO_B0 DIO GPIO B0
50 GPIO_B1 DIO GPIO B1
51 GPIO_B9 DIO GPIO B9
52 GPIO_B10 DIO GPIO B10
53 GPIO_B11 DIO GPIO B11
54 GPIO_B8 DIO GPIO B8
55 GPIO_B7 DIO GPIO B7
56 GND GND GROUND
57 GND GND GROUND
PI = Power Input DI = Digital Input DO = Digital Output DIO = Bi-directional Digital Port RF = Bi-directional RF Port GND=Ground Table 3 TiWi-C-W Module Pin Descriptions
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 10 of 35 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VCC) 0 3.46 V Oscillator power supply voltage (VCC_OSC) 0 3.46 V Power supply voltage ripple -2 +2 % Voltage on digital pins -0.5 VCC + 0.5 V RF input power, antenna port +10 dBm Operating temperature -40 +85 ºC Storage temperature -40 +85 ºC Table 4 Absolute Maximum Ratings Recommended Operating Conditions Parameter Min Typical Max Unit VCC 3.13 3.30 3.46 V VCC_OSC 3.13 3.30 3.46 V Voltage on digital pins 0 3.3 VCC V Ambient temperature range -40 25 85 ºC Table 5 Recommended Operating Conditions
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 11 of 35 General Characteristics DC Characteristics – General Purpose I/O Parameter Test Conditions Min Typical Max Unit Logic input low, VIL 0 - 0.8 V Logic input high, VIH 2.0 - VCC V Logic output low, VOL 12mA 0 - 0.8 V Logic output high, VOH 12mA 2.3 - VCC V Table 6 DC Characteristics General Purpose I/O RF Characteristics Parameter Min Typical Max Unit RF frequency range 2412 2472 MHz RF data rate 1 802.11 b/g/n rates supported 54 Mbps Table 7 RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 12 of 35 Power Consumption Parameter Test Conditions Min Typical Max Unit 11b TX Current 11 Mbps, Tamb = +25°C, 3.3V - 310 360 mA 11g TX Current 6 Mbps, Tamb = +25°C, 3.3V - 280 320 mA 11g TX Current 54 Mbps, Tamb = +25°C, 3.3V - 230 280 mA 11n TX Current MCS0, Tamb = +25°C, 3.3V - 260 310 mA 11n TX Current MCS7, Tamb = +25°C, 3.3V - 220 270 mA 11b RX Current 11 Mbps, Tamb = +25°C, 3.3V - 65 - mA 11g RX Current 54 Mbps, Tamb = +25°C, 3.3V - 65 - mA 11n RX Current MCS7, Tamb = +25°C, 3.3V 65 mA Power Down Mode - - uA Table 8 WLAN Power Consumption
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 14 of 35 RF Characteristics WLAN Transmitter Characteristics (TA = +25°C, VCC = 3.3 V) Parameter Test Conditions Min Typ Max Unit 1 Mbps DSSS (b) TX Output Power 1 Mbps BPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 2 Mbps DSSS (b) TX Output Power 2 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 5.5 Mbps DSSS (b) TX Output Power 5.5 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 11 Mbps DSSS (b) TX Output Power 11 Mbps CCK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 6 Mbps OFDM (g) TX Output Power 6 Mbps BPSK 802.11(g) Mask Compliance -5 dB EVM RMS power over TX packet - 17.5 - dBm 9 Mbps OFDM (g) TX Output Power 9 Mbps BPSK 802.11(g) Mask Compliance -8 dB EVM RMS power over TX packet - 17.5 - dBm 12 Mbps OFDM (g) TX Output Power 12 Mbps QPSK 802.11(g) Mask Compliance -10 dB EVM RMS power over TX packet - 17.5 - dBm 18 Mbps OFDM (g) TX Output Power 18 Mbps QPSK 802.11(g) Mask Compliance -13 dB EVM RMS power over TX packet - 17.5 - dBm 24 Mbps OFDM (g) TX Output Power 24 Mbps 16-QAM 802.11(g) Mask Compliance -16 dB EVM RMS power over TX packet - 15.8 - dBm 36 Mbps OFDM (g) TX Output Power 36 Mbps 16-QAM 802.11(g) Mask Compliance -19 dB EVM RMS power over TX packet - 15.8 - dBm 48 Mbps OFDM (g) TX Output Power 48 Mbps 64-QAM 802.11(g) Mask Compliance -22 dB EVM RMS power over TX packet - 15.8 - dBm 54 Mbps OFDM (g) TX Output Power 54 Mbps 64-QAM 802.11(g) Mask Compliance -25 dB EVM RMS power over TX packet - 15.8 - dBm MCS0 OFDM (n) TX Output Power 6.5 Mbps BPSK 802.11(n) Mask Compliance -5 dB EVM RMS power over TX packet - 15.5 - dBm MCS1 OFDM (n) TX Output Power 13 Mbps QPSK 802.11(n) Mask Compliance -10 dB EVM RMS power over TX packet - 15.5 - dBm MCS2 OFDM (n) TX Output Power 19.5 Mbps QPSK 802.11(n) Mask Compliance -13 dB EVM RMS power over TX packet - 15.5 - dBm MCS3 OFDM (n) TX Output Power 26 Mbps 16-QAM 802.11(n) Mask Compliance -16 dB EVM RMS power over TX packet - 15.0 - dBm MCS4 OFDM (n) TX Output Power 39 Mbps 16-QAM 802.11(n) Mask Compliance -19 dB EVM RMS power over TX packet - 15.0 - dBm MCS5 OFDM (n) TX Output Power 52 Mbps 64-QAM 802.11(n) Mask Compliance -22 dB EVM RMS power over TX packet - 15.0 - dBm MCS6 OFDM (n) TX Output Power 58.5 Mbps 64-QAM 802.11(n) Mask Compliance -25 dB EVM RMS power over TX packet - 15.0 - dBm MCS7 OFDM (n) TX Output Power 65 Mbps 64-QAM 802.11(n) Mask Compliance -27 dB EVM RMS power over TX packet - 15.0 - dBm Table 10 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 15 of 35 WLAN Transmitter Characteristics (TA = +85°C, VCC = 3.3 V) Parameter Test Conditions Min Typ Max Unit 1 Mbps DSSS (b) TX Output Power 1 Mbps BPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 2 Mbps DSSS (b) TX Output Power 2 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 5.5 Mbps DSSS (b) TX Output Power 5.5 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 11 Mbps DSSS (b) TX Output Power 11 Mbps CCK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 19.0 - dBm 6 Mbps OFDM (g) TX Output Power 6 Mbps BPSK 802.11(g) Mask Compliance -5 dB EVM RMS power over TX packet - 17.6 - dBm 9 Mbps OFDM (g) TX Output Power 9 Mbps BPSK 802.11(g) Mask Compliance -8 dB EVM RMS power over TX packet - 17.6 - dBm 12 Mbps OFDM (g) TX Output Power 12 Mbps QPSK 802.11(g) Mask Compliance -10 dB EVM RMS power over TX packet - 17.6 - dBm 18 Mbps OFDM (g) TX Output Power 18 Mbps QPSK 802.11(g) Mask Compliance -13 dB EVM RMS power over TX packet - 17.6 - dBm 24 Mbps OFDM (g) TX Output Power 24 Mbps 16-QAM 802.11(g) Mask Compliance -16 dB EVM RMS power over TX packet - 15.8 - dBm 36 Mbps OFDM (g) TX Output Power 36 Mbps 16-QAM 802.11(g) Mask Compliance -19 dB EVM RMS power over TX packet - 15.8 - dBm 48 Mbps OFDM (g) TX Output Power 48 Mbps 64-QAM 802.11(g) Mask Compliance -22 dB EVM RMS power over TX packet - 15.8 - dBm 54 Mbps OFDM (g) TX Output Power 54 Mbps 64-QAM 802.11(g) Mask Compliance -25 dB EVM RMS power over TX packet - 15.8 - dBm MCS0 OFDM (n) TX Output Power 6.5 Mbps BPSK 802.11(n) Mask Compliance -5 dB EVM RMS power over TX packet - 15.5 - dBm MCS1 OFDM (n) TX Output Power 13 Mbps QPSK 802.11(n) Mask Compliance -10 dB EVM RMS power over TX packet - 15.5 - dBm MCS2 OFDM (n) TX Output Power 19.5 Mbps QPSK 802.11(n) Mask Compliance -13 dB EVM RMS power over TX packet - 15.5 - dBm MCS3 OFDM (n) TX Output Power 26 Mbps 16-QAM 802.11(n) Mask Compliance -16 dB EVM RMS power over TX packet - 15.0 - dBm MCS4 OFDM (n) TX Output Power 39 Mbps 16-QAM 802.11(n) Mask Compliance -19 dB EVM RMS power over TX packet - 15.0 - dBm MCS5 OFDM (n) TX Output Power 52 Mbps 64-QAM 802.11(n) Mask Compliance -22 dB EVM RMS power over TX packet - 15.0 - dBm MCS6 OFDM (n) TX Output Power 58.5 Mbps 64-QAM 802.11(n) Mask Compliance -25 dB EVM RMS power over TX packet - 15.0 - dBm MCS7 OFDM (n) TX Output Power 65 Mbps 64-QAM 802.11(n) Mask Compliance -27 dB EVM RMS power over TX packet - 15.0 - dBm Table 11 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 16 of 35 WLAN Transmitter Characteristics (TA = -40°C, VCC = 3.3 V) Parameter Test Conditions Min Typ Max Unit 1 Mbps DSSS (b) TX Output Power 1 Mbps BPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 18.6 - dBm 2 Mbps DSSS (b) TX Output Power 2 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 18.6 - dBm 5.5 Mbps DSSS (b) TX Output Power 5.5 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 18.6 - dBm 11 Mbps DSSS (b) TX Output Power 11 Mbps CCK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet - 18.6 - dBm 6 Mbps OFDM (g) TX Output Power 6 Mbps BPSK 802.11(g) Mask Compliance -5 dB EVM RMS power over TX packet - 17.0 - dBm 9 Mbps OFDM (g) TX Output Power 9 Mbps BPSK 802.11(g) Mask Compliance -8 dB EVM RMS power over TX packet - 17.0 - dBm 12 Mbps OFDM (g) TX Output Power 12 Mbps QPSK 802.11(g) Mask Compliance -10 dB EVM RMS power over TX packet - 17.0 - dBm 18 Mbps OFDM (g) TX Output Power 18 Mbps QPSK 802.11(g) Mask Compliance -13 dB EVM RMS power over TX packet - 17.0 - dBm 24 Mbps OFDM (g) TX Output Power 24 Mbps 16-QAM 802.11(g) Mask Compliance -16 dB EVM RMS power over TX packet - 15.5 - dBm 36 Mbps OFDM (g) TX Output Power 36 Mbps 16-QAM 802.11(g) Mask Compliance -19 dB EVM RMS power over TX packet - 15.5 - dBm 48 Mbps OFDM (g) TX Output Power 48 Mbps 64-QAM 802.11(g) Mask Compliance -22 dB EVM RMS power over TX packet - 15.5 - dBm 54 Mbps OFDM (g) TX Output Power 54 Mbps 64-QAM 802.11(g) Mask Compliance -25 dB EVM RMS power over TX packet - 15.5 - dBm MCS0 OFDM (n) TX Output Power 6.5 Mbps BPSK 802.11(n) Mask Compliance -5 dB EVM RMS power over TX packet - 15.0 - dBm MCS1 OFDM (n) TX Output Power 13 Mbps QPSK 802.11(n) Mask Compliance -10 dB EVM RMS power over TX packet - 15.0 - dBm MCS2 OFDM (n) TX Output Power 19.5 Mbps QPSK 802.11(n) Mask Compliance -13 dB EVM RMS power over TX packet - 15.0 - dBm MCS3 OFDM (n) TX Output Power 26 Mbps 16-QAM 802.11(n) Mask Compliance -16 dB EVM RMS power over TX packet - 14.7 - dBm MCS4 OFDM (n) TX Output Power 39 Mbps 16-QAM 802.11(n) Mask Compliance -19 dB EVM RMS power over TX packet - 14.7 - dBm MCS5 OFDM (n) TX Output Power 52 Mbps 64-QAM 802.11(n) Mask Compliance -22 dB EVM RMS power over TX packet - 14.7 - dBm MCS6 OFDM (n) TX Output Power 58.5 Mbps 64-QAM 802.11(n) Mask Compliance -25 dB EVM RMS power over TX packet - 14.7 - dBm MCS7 OFDM (n) TX Output Power 65 Mbps 64-QAM 802.11(n) Mask Compliance -27 dB EVM RMS power over TX packet - 14.7 - dBm Table 12 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 17 of 35 WLAN Receiver Characteristics Parameter Test Conditions Min Typ Max Unit
1 Mbps DSSS (b) RX Sensitivity 8% PER - -90 - dBm
2 Mbps DSSS (b) RX Sensitivity 8% PER - -90 - dBm
5.5 Mbps DSSS (b) RX Sensitivity 8% PER - -89 - dBm
11 Mbps DSSS (b) RX Sensitivity 8% PER - -87 - dBm
6 Mbps OFDM (g) RX Sensitivity 10% PER - -90 - dBm
9 Mbps OFDM (g) RX Sensitivity 10% PER - -89 - dBm
12 Mbps OFDM (g) RX Sensitivity 10% PER - -85 - dBm
18 Mbps OFDM (g) RX Sensitivity 10% PER - -84.5 - dBm
24 Mbps OFDM (g) RX Sensitivity 10% PER - -82 - dBm
36 Mbps OFDM (g) RX Sensitivity 10% PER - -79 - dBm
48 Mbps OFDM (g) RX Sensitivity 10% PER - -75 - dBm
54 Mbps OFDM (g) RX Sensitivity 10% PER - -73 - dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -90 - dBm MCS1 (13 Mbps) OFDM (n) RX Sensitivity 10% PER - -87 - dBm MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -85 - dBm MCS3 26 Mbps OFDM (n) RX Sensitivity 10% PER - -82 - dBm MCS4 39 Mbps OFDM (n) RX Sensitivity 10% PER - -79 - dBm MCS5 52 Mbps OFDM (n) RX Sensitivity 10% PER - -74 - dBm MCS6 58.5 Mbps OFDM (n) RX Sensitivity 10% PER - -73 - dBm MCS7 65 Mbps OFDM (n) RX Sensitivity 10% PER - -71 - dBm 11b RX Overload Level 8% PER, 11 Mbps -10 - - dBm 11g RX Overload Level 10% PER, 54 Mbps -20 - - dBm 11n RX Overload Level 10% PER, MCS7 -20 - - dBm Table 13 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 18 of 35 WLAN Receiver Characteristics Parameter Test Conditions Min Typ Max Unit
1 Mbps DSSS (b) RX Sensitivity 8% PER - -89 - dBm
2 Mbps DSSS (b) RX Sensitivity 8% PER - -89 - dBm
5.5 Mbps DSSS (b) RX Sensitivity 8% PER - -88 - dBm
11 Mbps DSSS (b) RX Sensitivity 8% PER - -86 - dBm
6 Mbps OFDM (g) RX Sensitivity 10% PER - -89 - dBm
9 Mbps OFDM (g) RX Sensitivity 10% PER - -88 - dBm
12 Mbps OFDM (g) RX Sensitivity 10% PER - -84 - dBm
18 Mbps OFDM (g) RX Sensitivity 10% PER - -83.5 - dBm
36 Mbps OFDM (g) RX Sensitivity 10% PER - -78 - dBm
48 Mbps OFDM (g) RX Sensitivity 10% PER - -74 - dBm
54 Mbps OFDM (g) RX Sensitivity 10% PER - -72 - dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -89 - dBm MCS1 (13 Mbps) OFDM (n) RX Sensitivity 10% PER - -86 - dBm MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -84 - dBm MCS3 26 Mbps OFDM (n) RX Sensitivity 10% PER - -81 - dBm MCS4 39 Mbps OFDM (n) RX Sensitivity 10% PER - -78 - dBm MCS5 52 Mbps OFDM (n) RX Sensitivity 10% PER - -73 - dBm MCS6 58.5 Mbps OFDM (n) RX Sensitivity 10% PER - -72 - dBm MCS7 65 Mbps OFDM (n) RX Sensitivity 10% PER - -70 - dBm 11b RX Overload Level 8% PER, 11 Mbps -10 - - dBm 11g RX Overload Level 10% PER, 54 Mbps -20 - - dBm 11n RX Overload Level 10% PER, MCS7 -20 - - dBm Table 14 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 19 of 35 WLAN Receiver Characteristics Parameter Test Conditions Min Typ Max Unit
1 Mbps DSSS (b) RX Sensitivity 8% PER - -91 - dBm
2 Mbps DSSS (b) RX Sensitivity 8% PER - -91 - dBm
5.5 Mbps DSSS (b) RX Sensitivity 8% PER - -90 - dBm
11 Mbps DSSS (b) RX Sensitivity 8% PER - -88 - dBm
6 Mbps OFDM (g) RX Sensitivity 10% PER - -91 - dBm
9 Mbps OFDM (g) RX Sensitivity 10% PER - -90 - dBm
12 Mbps OFDM (g) RX Sensitivity 10% PER - -86 - dBm
18 Mbps OFDM (g) RX Sensitivity 10% PER - -85.5 - dBm
24 Mbps OFDM (g) RX Sensitivity 10% PER - -83 - dBm
36 Mbps OFDM (g) RX Sensitivity 10% PER - -80 - dBm
48 Mbps OFDM (g) RX Sensitivity 10% PER - -76 - dBm
54 Mbps OFDM (g) RX Sensitivity 10% PER - -74 - dBm
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -91 - dBm MCS1 (13 Mbps) OFDM (n) RX Sensitivity 10% PER - -88 - dBm MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity 10% PER - -86 - dBm MCS3 26 Mbps OFDM (n) RX Sensitivity 10% PER - -83 - dBm MCS4 39 Mbps OFDM (n) RX Sensitivity 10% PER - -80 - dBm MCS5 52 Mbps OFDM (n) RX Sensitivity 10% PER - -75 - dBm MCS6 58.5 Mbps OFDM (n) RX Sensitivity 10% PER - -74 - dBm MCS7 65 Mbps OFDM (n) RX Sensitivity 10% PER - -72 - dBm 11b RX Overload Level 8% PER, 11 Mbps -10 - - dBm 11g RX Overload Level 10% PER, 54 Mbps -20 - - dBm 11n RX Overload Level 10% PER, MCS7 -20 - - dBm Table 15 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 21 of 35 Soldering Recommendations Reflow for Lead Free Solder Paste
- Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an overall process development.
- It is important to provide a solder reflow profile that matches the solder paste supplier's recommendations.
- Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor solderability.
- All solder paste suppliers recommend an ideal reflow profile to give the best solderability . Recommended Reflow Profile for Lead Free Solder Figure 6 Recommended Soldering Profile Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification . See IPC -A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.” 2000c 2170c 2450c 1500c Pre-Heat Soldering 1500c to 2000c in 90~120 sec 60~90 sec Temperature Time
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 22 of 35 CLEANING In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.
- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
- Ultrasonic cleaning could damage the module permanently. OPTICAL INSPECTION After soldering the Module to the host board, consider optical inspection to check the following:
- Proper alignment and centering of the module over the pads.
- Proper solder joints on all pads.
- Excessive solder or contacts to neighboring pads, or vias. REWORK The TiWi-C-W module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. SHIPPING, HANDLING, AND STORAGE Shipping Bulk orders of the TiWi-C-W modules are delivered in reels of 2000. Handling The TiWi-C-W modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may damage the module permanently. Moisture Sensitivity Level (MSL) Per J-STD-020, devices rated as MSL 3 and not stored in a sealed bag with desiccant pack should be baked prior to use. Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required. If baking is required, refer to J-STD-033 for bake procedure. Storage Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40ºC and <90% room humidity (RH). Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight. The product should not be subject to excessive mechanical shock.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 23 of 35 Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 24 of 35 AGENCY CERTIFICATIONS FCC ID: TFB-1001, 15.247 IC ID: 5969A-1001, RSS 210 CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION : Any changes or modifications not expressly approved by the par ty responsible for compliance could void the user's authority to operate this equipment.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 25 of 35 Industry Canada Statements This Device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the This device has been designed to operate with the antenna(s) listed below and having a maximum gain of 2.0 dBi (LSR Dipole), 2.0 dBi (LSR FlexPIFA), 2.0 dBi (LSR mFlexPIFA), and 0.5dBi (Johanson Chip). Antennas not included in this list or having a gain greater than 2.0 dBi, 2.0 dBi, 2.0 dBi, and 0.5dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter 1) LSR 001-0001 2.4 GHz center-fed dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector cable. 2) LSR 001-0014 2.4 GHz FlexPIFA antenna. 3) LSR 001-0030 2.4 GHz Metal FlexPIFA (mFlexPIFA) antenna. 4) Johanson 2450AT18A100 chip antenna. Cet appareil est conforme avec Industrie Canada , exempts de licence standard RSS (s). L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie. Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0 dBi (LSR Dipole), 2.0 dBi (LSR FlexPIFA), 2.0 dBi (LSR mFlexPIFA), et 0.5dBi (Johanson Chip). Antennes pas inclus dans cette liste ou présentant un gain supérieure à 2,0 dBi, 2.0 dBi, 2.0 dBi, et 0.5dBi sont strictement interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 1) Antenne LSR 001-0001 2.4 GHz de centre-dipôle alimenté et LSR 080-0001 U.FL inverser câble connecteur SMA à polarité. 2) LSR 001-0014 antenne FlexPIFA 2,4 GHz. 3) LSR 001-0030 antenne Métal FlexPIFA (mFlexPIFA) 2,4 GHz. 4) Antenne de puce Johanson 2450AT18A100.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 26 of 35 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi-C-W Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co - location with another tr ansmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re -evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. Le module de TiWi-C-W a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit. Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co -implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de ce rtification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 27 of 35 OEM LABELING REQUIREMENTS FOR END-PRODUCT The TiWi-C-W module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: TFB-1001” “Contains Transmitter Module IC: 5969A-1001” or “Contains FCC ID: TFB-1001” “Contains IC: 5969A-1001” The OEM of the TiWi-C-W Module must only use the approved antenna(s) listed above, which have been certified with this module. Le module de TiWi-C-W est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant: “Contient Module émetteur FCC ID: TFB-1001" “Contient Module émetteur IC: 5969A-1001" ou “Contient FCC ID: TFB-1001" “Contient IC: 5969A-1001" Les OEM du module TiWi-C-W ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 28 of 35 OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. Other user manual statements may apply. L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en vue: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procédures produit. Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 29 of 35 EUROPE CE Notice This device has been tested and certified for use in the European Union. See the Declaration of Conformity (DOC) for specifics. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and Telecommunications Terminal Equipment (R&TTE) Directive. The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. Declaration of Conformity (DOC) This DOC can be downloaded from the LSR Wiki.
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 30 of 35 MECHANICAL DATA Figure 7 Module Mechanical Dimensions (Maximum Module Height = 1.40mm)
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 31 of 35 PCB FOOTPRINT Figure 8 TiWi-C-W Footprint (Top View) Note: Three Pad Sizes Solder Mask Type A - 0.42 x 0.42 mm 0.52 x 0.52 mm Type B - 0.35 x 0.40 mm 0.45 x 0.50mm (Not Centered on Type A pads) Type C - 5.0 x 5.0 mm 5.1 x 5.1 mm
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 32 of 35 RECOMMENDED SOLDER STENCIL Figure 9 - Recommended Solder Stencil (Top View)
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 33 of 35 TAPE AND REEL PACKAGING (MODULE MUST BE IN THIS ORIENTATION WHEN FEEDING) Figure 10 Tape and Reel Specification
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 34 of 35 DEVICE MARKINGS Rev 1 Devices Where R1 = Revision 1 Manufacturer Code: 50C0D0001 Model: TiWi-C-W LSR P/N: 450-0118-R1 FCC ID: TFB-1001 IC: 5969A-1001 50C0D0001 Rev 3 Devices Where R3 = Revisi on 3 Manufacturer Code: 50C0D0001 Mo del: TiWi-C-W LSR P/N: 450-01 18-R3 FCC ID: TFB-10 01 IC: 59 69A-10 01
50 C0 D0 00 1
*Skipped Rev 2 to align Internal MRP System*
The information in this document is subject to change without notice. 330-0129-R4.5 Copyright © 2015-2018 LSR Page 35 of 35 CONTACTING LSR Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: (262) 375-4400 Fax: (262) 375-4248 Website www.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com © Copyright 2018 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potentia l uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents s hall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird Limited due to the acquisition by Advent or one or more subsidiaries of Laird Limited. LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.