42510ESDA-TR1 COOPER | Alldatasheet
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Technical content
Features
Halogen free, lead free and RoHS compliant for global applications Ultra-low capacitance (0.1pF typical) ideally suited for protecting high speed data applications Provides ESD protection with fast response time (<1ns) allowing equipment to pass the IEC 61000-4-2 Level 4 test Four (4) channel array Zero signal distortion Low leakage current (<0.01µA typical) Pb HALOGEN HFFREE * Note, Capacitance measured with 1Vrms Surface Mount Device Electrical Specifications Characteristic Value/Range Rated Voltage (max) 12V Leakage Current (max @ 12Vdc) 0.01 μA Trigger Voltage (Vt) 300V Typical Clamping Voltage (Vc) 30V Typical Capacitance (Cp) @1MHz* 0.1pF Typical Response Time <1ns ESD Voltage Capability, IEC 61000-4-2 8kV Contact Discharge Mode ESD Voltage Capability, IEC 61000-4-2 15kV Air Discharge Mode ESD Withstand Pulses 100 Times Minimal Catalog Number Description 42510ESDA-TR1 5000 suppressors in paper tape on a 7 inch (178mm) reel Environmental Specifications Characteristic Value Load Humidity +85°C/90%RH with rated voltage for 1000 hrs Thermal Shock -40°C to +85°C, 30 minute cycle, 5 cycles Moisture Resistance Test J-STD-020 Standard: Level 2 (1 year floor life under 30°C/65%RH conditions Operating Temperature Range -40°C to +85°C (-40°F to 185°F) Storage Temperature Range -55°C to +125°C (-67°F to +257°F)
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0810 BU-SB10816 Page 2 of 2 Data Sheet 4378
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. Al l other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Soldering Recommendations Compatible with lead and lead-free solder reflow processes Hand soldering - soldering tip should not directly touch part - 280°C max for 3 sec. max Peak reflow temperatures and durations: - IR Reflow = 260°C max for 20 sec. max - Wave Solder = 260°C max for 10 sec. max Recommended IR Reflow Profile Tape and Reel Packaging Specifications - mm Dimensions - mm Recommended Pad Layout - mm GP P 1 XX 1 YY 1 Z Note: Print solder 0.01~0.015mm thick. BC D E L T W 7RS7DSH Unit: mm AB C D E F LW Design Considerations Follow the soldering recommendations to avoid deforming product Do not use high temperature, high humidity or corrosive atmospheres (sulfide and chloride gas) that could damage the solderability Moisture Sensitivity Level (MSL) according to J-STD-020 standard: Level 2 (Floor Life 1 year under <30°C/65%RH conditions) Solderability requirement according to IPC/JEDEC J-STD-002C, Test D, Test B1 Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5 or equivalent. Circuit Schematic