412D02F-09PC003SV MULTICOMP | Alldatasheet
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www.element14.com www.farnell.com www.newark.com Page <1> V1.016/11/12 SD Card Receptacle Specifications: Insulator Material : LCP Contact Material : Copper Alloy Current Rating : 0.5A AC/DC Contact Plating : 1 (micro) µ" Gold flash over 50µ" Ni underplate Solder Tail Plating : 100µ"min. Sn plated DWV : 500V AC for 1 minute Insulation Resistance : 1,000MΩ min. @ 500V DC Contact Resistance : 40mΩ Max. Operating Temperature : -20°C to +60°C Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012. Description Part Number Receptacle, SD Card, SMT 412D02F-09PC003SV Part Number Table Dimensions : Millimetres