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HCC4027B STMICROELECTRONICS | Alldatasheet

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DUAL-J-K MASTER-SLAVE FLIP-FLOP

DESCRIPTION

.SET-RESE T CAPABILITY .STATIC FLIP-FLOP OPERATION - RETAINS STATE INDEFINITELY WITH CLOCK LEVEL EITHER ”HIGH” OR ”LOW” .MEDIUM SPEED OPERATION - 16MHz (typ. clock toggle rate at 10V) .STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS .QUIESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE .INPUT CURRENT OF 100nA AT 18V AND 25°C FOR HCC DEVICE .100% TESTED FOR QUIESCENT CURRENT .MEETS ALL REQUIREMENTS OF JEDECTEN- TATIVE STANDARD N 0. 13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF ”B” SERIES CMOS DEVICES”. June 1989 The HCC4027B (extended temperature range) and HCF4027B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF4027B is a single monolithic chip in- tegrated circuit containing two identical complemen- tary-symmetry J-K master-slave flip-flops. Each flip-flop has provisions for individual J, K, Set, Reset, and Clock input signals, Buffered Q and Q signals are provided as outputs. This input-output arrange- ment provides for compatible operation with the HCC/HCF4013B dual D-type flip-flop. The HCC/HCF4027B is useful in performing control, register, and toggle functions. Logic levels present at the J and K inputs along with internal self-steering control the state of each flip-flop ; changes in the flip- flop state are synchronous with the positive-going transition of the clock pulse. Set and reset functions are indepen dent of the clock and are initiated when a high level signal is present at either the Set or Reset input. EY (Plastic Package) F (Ceramic Frit Seal Package) ORDER CODES : HCC4027BF HCF4027BM1 HCF4027BEY HCF4027BC1 PIN CONNECTIONS (Micro Package) (Plastic Chip Carrier)

Symbol Parameter Value Unit V DD * Supply Voltage :HCC Types HCF Types – 0.5 to + 20 – 0.5 to + 18 V V V i Input Voltage – 0.5 to V DD + 0.5 V II DC Input Current (any one input) ± 10 mA P tot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package-temperature Range 200 100 mW mW T op Operating Temperature :HCC Types HCF Types – 55 to + 125 –4 0t o+8 5 T stg Storage Temperature – 65 to + 150 °C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage :HCC Types HCF Types 3t o1 8 3t o1 5 V V V I Input Voltage 0 to V DD V T op Operating Temperature :HCC Types HCF Types – 55 to + 125 –4 0t o+8 5 Stresses abov e those listed unde r ”Absolute Maximum Ratings” may caus e perma nent dama ge to the device. This is a stress rating only and functional operation of the device at these or any other cond itions abov e those indicated in the opera tional sections of this specification is not implied. Exposure to abso lute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to V SS pin voltage . HCC/HCF4027B

LOGIC DIAGRAM AND TRUTH TABLE Present State Next State Inputs Output CL Δ Outputs JKSR Q Q Q IX O O O –/– IO XOOO I –/– IO OXOO O –/– OI XIO O I –/– OI XXOO X –\\– ← No Change XX IO X X I O XXO I X X O I XX I I X X I I ONE OF TWO IDENTICAL J-K FLIP-FLOPS LOGIC I = HIGH LEVEL LOGIC O = LOW LEVEL Δ - LEVEL CHANGE X - DON’T CARE TRUTH TABLE HCC/HCF4027B

STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Value V I V O |IO |V DD T Low * 25 °CT High *Symbol Parameter Unit IL Quiescent Current HCC Types 0/ 5 5 1 0.02 1 30 µA 0/10 10 2 0.02 2 60 0/15 15 4 0.02 4 120 0/20 20 20 0.04 20 600 HCF Types 0/ 5 5 4 0.02 4 30 0/10 10 8 0.02 8 60 0/15 15 16 0.02 16 120 V OH Output High Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 V OL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 V IH Input High Voltage V1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 V IL Input Low Voltage V9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 IOH Output Drive Current HCC Types mA HCF Types IOL Output Sink Current HCC Types 0/ 5 0.4 5 0.64 0.51 1 0.36 mA HCF Types 0/ 5 0.4 5 0.52 0.44 1 0.36 IIH,IIL Input Leakage Current HCC Types 0/18 Any Input µA HCF Types 0/15 15 ± 0.3 ±10–5 ± 0.3 ± 1 C I Input Capacitance Any Input 5 7.5 pF *T Low=–5 5 °Cf o rHCC device : – 40°C forHCF device. *T High= + 125°C forHCC device : + 85°C forHCF device. HCC/HCF4027B

DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =2 5°C, CL = 50pF, RL = 200kΩ , typical temperature coefficient for all VDD = 0.3%/°C values, all input rise and fall time = 20ns) ValueSymbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit tPLH ,tPHL Propagation Delay Time Clock to Q or Q Outputs 51 5 0 3 0 0 ns10 65 130 15 45 90 tPLH Propagation Delay Time Set to Q or Reset to Q 51 5 0 3 0 0 ns 10 65 130 15 45 90 tPHL Propagation Delay Time Set to Q or Reset to Q 52 0 0 4 0 0 10 85 170 15 60 120 tTHL ,tTLH Transition Time 5 100 200 ns10 50 100 15 40 80 tW Pulse Width Clock 5 140 70 ns 10 60 30 15 40 20 tW Pulse Width Set or Reset 5 180 90 10 80 40 15 50 25 tr,tf Clock Input Rise or Fall Time 51 5 µs10 4 15 1 tsetup Setup Time Data 5 200 100 ns10 75 35 15 50 25 fmax Maximum Clock Input Frequency * Toggle Mode 5 3.5 7 MHz10 8 16 15 12 24 * Input tr, tf = 5ns. HCC/HCF4027B

Typical Output Low (sink) Current Characteristics. Minimum Output Low (sink) Current Characteristics. Typical Output High (source) Current Charac- teristics. Minimum Output High (source) Current Charac- teristics. Typical Propagation Delay Time vs. Load Capacit- ance (SET to Q or RESET to Q). Typical Propagation Delay Time vs.Load Capacit- ance (CLOCK or SET to Q, CLOCK or RESET to Q). HCC/HCF4027B

Typical Maximum Clock Frequency vs. Supply Voltage (Toggle Mode). Typical Dynamic Power Dissipation/ Per Device vs.Frequency. Input Leakage Current. Input Voltage. TEST CIRCUITS Quiescent Device Current. HCC/HCF4027B

Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch a1 0.51 0.020 B 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 P001C HCC/HCF4027B

Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015 e3 17.78 0.700 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406 P 7.8 8.05 0.307 0.317 Q 5.08 0.200 P053D HCC/HCF4027B

SO16 (Narrow) MECHANICAL DATA DIM. mm inch A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45 ° (typ.) D 9.8 10 0.385 0.393 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.62 0.024 S8 ° (max.) P013H HCC/HCF4027B

DIM. mm inch A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF4027B

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HCF4027B