390088-2 TEC | Alldatasheet

Document overview

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Technical content

Features

  • Halogen-Free
  • RoHS compliant
  • Foldbak technology for superior clamping factor
  • Glass passivated junction
  • Bi-directional
  • Ultra compact: Less than one-tenth the size of traditional discrete solutions
  • Very low clamping voltage
  • Sharp breakdown voltage
  • Low slope resistance Agency Approvals

Electrical Characteristics

Note: Using 8 x 20µS wave shape as defined in IEC 61000-4-5. Part Numbers Standoff Voltage (VSO) Volts Max. Reverse Leakage (IR) @VSO µA Reverse Breakdown Voltage (VBR) @ IT Test Current IT Max. Clamping Voltage VCL @ Ipp Peak Pulse Current (IPP) (Note 1) Max. Temp Coefficient OF VBR Max. Capacitance

0 Bias 10kHz

Min Volts Max Volts (mA) VCL Volts IPP Amps (%/OC) (nF) AK3 - 030C 30 20 32 37 10 90 3,000 0.1 11 X AK3 - 058C 58 20 64 70 10 110 3,000 0.1 6 X AK3 - 066C 66 20 72 80 10 120 3,000 0.1 6 X AK3 - 076C 76 20 85 95 10 140 3,000 0.1 6 X AK3 - 380C 380 20 401 443 10 520 3,000 0.1 2 X AK3 - 430C 430 20 440 490 10 625 3,000 0.1 2 X RoHS AGENCY AGENCY FILE NUMBER E128662 Maximum Ratings and Thermal Characteristics A=25OC unless otherwise noted) Parameter Symbol Value Unit Operating Storage Temperature Range TSTG (-)55 to 150 °C Operating Junction Temperature Range T J (-)55 to 125 ºC Current Rating1 IPP 3 kA Note: 1 . Rated IPP measured with 8 x 20μs pulse. AK3 Series Pb

Revision: October 19, 2011, 16:35 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. T ransient Voltage Suppression Diodes 134 Axial Leaded – 3kA > AK3 series AK3 Series Please refer to http://www.Littelfuse.com/series/AK3.html for current information. Flow/Wave Soldering (Solder Dipping) Peak T emperature : 265OC Dipping Time : 10 seconds Soldering : 1 time Temperature (T Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Physical Specifications Weight Contact manufacturer Case Epoxy encapsulated T erminal Silver plated leads, solderable per MIL -STD-202 Method 208 Soldering Parameters Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C 100 120 02 55 07 51 00 1251 50 AMBIENT TEMPERATURE (°C) Percent of Rated Value Ratings and Characteristic Curves (TA=25°C unless otherwise noted) Peak Power Derating

Revision: October 19, 2011, 16:35 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. T ransient Voltage Suppression Diodes 135 Axial Leaded – 3kA > AK3 series AK3 Series Please refer to http://www.Littelfuse.com/series/AK3.html for current information. L2 L1 A G D E F CB Dimensions Part Marking System AK3-XXXX AK3-XXXX DC AK3-380C/430C Part Numbering System AK3 - XXXX Series Type Stand Off Voltage (Please Refer to Electrical Characteristics Chart) Inches Millimeters C -030C/-058C D 0.433 max. 11 .0 max. F 0.37 4 max. 9.50 max. G -058C/-066C -058C/-066C L2 = A - (G+L1) tolerance +/- 0.047 inch (+/- 1 .20 mm)