3804

3804L RENESAS | Alldatasheet

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©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 8-bit MICROCOMPUTER 38000 Series -- Differences Between The 3804L Group/3804H Group/3804 Group Differences Between The 3804L Group/3804H Group/3804 Group --

3804L/3804H/3804 Groups Products3804L/3804H/3804 Groups Products

3804 Gr oup Part Number ROM

M 38047M 8-XXXSP/FP/HP 32 K M 38049MC-XXXSP/FP/HP 48 K M 38049M F-XXXSP/FP/HP 60 K M38049F FSP/FP/ H P (Note) 60 K 2048 M 38044M 4-XXXSP/FP/HP 640 M 38047M 6-XXXSP/FP/HP 1024 3804H Group Part Number ROM size RAM size M38049F F H SP/FP/ HP/KP (Note) 60 K 2048 * 3804L fea t ures - R e duced cu rren t consu m ption in 32 kHz (low-speed) wait m ode (Flash memory version) - R e duced EMI (unwante d radia tion) noise leve l Mask ROM ver. Fl ash Memory ve r

60 KM38049F FL SP/HP/KP/WG 2048

size3804L Group* Part NumberFl ash Memory ve r Note: Recommended to replace. Ple ase con s ider a replacement with 3804L G r oup. Fl ash Memory ve r

P20(LED0) P01/AN9 P02/AN10 P03/AN11 P04/AN12 P05/AN13 P06/AN14 P07/AN15 P10/INT 41 P11/INT 01 P12 P13 P14 P15 P16 P17 P21(LED1) P22(LED2) P23(LED3) P24(LED4) P25(LED5) P26(LED6) P27(LED7) P32/SDA P33/SCL P36/SCLK3 P37/SRDY3 VCC VREF AVSS P67/AN7 P66/AN6 P64/AN4 P63/AN3 P62/AN2 P61/AN1 P60/AN0 P57/I NT3 P56/PWM P55/CNT R1 P54/CNT R0 P52/SCLK2 P51/SOUT 2 P50/SIN2 P46/SCLK1 P45/TXD1 P44/RXD1 P4 3/I NT2 P4 2/I NT1 CNVSS P40/I NT40 /XCOUT XIN XOUT VSS RESET P53/SRDY2 P65/AN5 P41/I NT00/XCIN P47/SRDY1 /CNTR2 VPP Outli n e S P : PRDP0064BA-A (64P4B) (1.78 m m pitch) M3804XMX-XXXSP M38049FFHSP M38049FFLSP M38049FFSP Co mpletely Pin Co m patible Co mpletely Pin Co m patible 3804L/3804H/3804 Groups Pin Configuration (SP)3804L/3804H/3804 Groups Pin Configuration (SP)

Outli n e KP :PLQP0064GA-A (6 4P6U-A) (0 .8mm pitc h, 14mm s q uare, 1.7 m m mount in g hei g ht) FP : PRQP006 GA-A (64P6 N (0.8 mm pitch, 14mm square , 3.05mm mou n ti n g heig ht) HP : PLQP006 KB -A (64P6Q-A) (0.5 m m pitc h, 10mm square, 1.7m m mounti ng height) M3804XMX-XXX FP/H P M38049FFHFP/ H P/K P M38049FFLHP/ K P M38049FFFP/H P P20(LED0) VSS XOUT RES E T CNVSS P40/INT40/XCOUT VPP P21(LED1) P27(LED7) P22(LED2) P23(LED3) P24(LED4) P25(LED5) P26(LED6) XIN P41/INT00/XCIN P42/INT1 P42/INT2 P44/RXD1 P45/TXD1 P46/SCLK1 P50/SIN2 P51/SOUT2 P52/SCLK2 P47/SRDY1/CNTR2 P53/SRDY2 P54/CNTR0 P55/CNTR1 P56/PWM P57/INT3 P62/AN2 P60/AN0 P61/AN1 P63/AN3 P64/AN4 P65/AN5 P66/AN6 P67/AN7 VCC AVSS VREF P30/DA1 P31/DA2 SDA/P32 SCL/P 33 P34/RXD3 P35/TXD3 P36/SCLK3 P37/SRDY3 P17 P16 P15 P11/INT01 P13 P14 P12 P10/INT41 P00/AN8 P05/AN13 P02/AN10 P01/AN9 P04/AN12 P03/AN11 P07/AN15 P06/AN14 Co mpletely Pin Co m patible Co mpletely Pin Co m patible 3804L/3804H/3804 Groups Pin Configuration (FP/HP/KP)3804L/3804H/3804 Groups Pin Configuration (FP/HP/KP) Note: KP for 38 04 H/3 8 0 4 L Gro u p s only. FP for 3 8 0 4 /3 8 04H Gr ou p s only.

Outli ne W G : PT L G 0064J A-A (64F0G) (6mm F L G A package, 1.05mm heig ht) 2 3 6 9 11 15 16 18 62 63 5 8 10 13 17 19 60 61 4 7 12 14 21 20 1 64 58 59 57 24 22 23 56 55 54 49 33 36 35 34 53 52 48 43 38 37 26 25 51 47 45 42 39 27 29 28 50 46 44 41 40 32 31 30 P61/A N1 P65/A N5 P67/A N7 P62/A N2 P30/D A1 P33/SCL P35/T x D3 P36/SCL K 3 P60/A N0 P64/A N4 P66/A N6 P63/A N3 P31/D A2 P34/R xD3 P01/A N9 P02/A N10 P55/CNTR1 P56/P WM P57/I N T3 VRE F P32/SDA P00/A N8 P03/A N11 P04/A N12 P07/A N15 P06/A N14 P05/A N13 P37/SRD Y3 AVss P54/CNTR0 P53/SRD Y2 P52/SCL K 2 P50/SIN2 P51/SOUT 2 P47/SRD Y 1/CNT R2 VCC P17 P12 P11/I N T01 P10/I N T41 P44/R xD1 P46/SCL K 1 P45/T x D1 VSS P14 P13 P25( LE D5) P25( LE D0) P21( LE D1) P23( LE D3) P26( LE D6) P15 XIN XOUT P16 P27( LE D7) P24( LE D4) P22( LE D2) P43/I N T2 P42/I N T1 P40/IN T40/XCOUT P41/IN T40/XCI N CNVSS RES E T A B C D E F G H A B C D E F G H M38049FFLWG P22( LE D2) Co mpletely Pin Co m patible Co mpletely Pin Co m patible (TO P view ) 3804L Groups Pin Configu r ation (WG)3804L Groups Pin Configu r ation (WG) The pin number corresp o nd s to the flat package. Package to p view

3804L Gro u p 3804 H Gro u p 3804 Gro u p Flash Memory v e r. F l ash memor y 60K/2K SP, HP, KP, WG 2.7 to 5.5 V Addresses F F D 4 to F F D Ah Address F F D Bh F l ash Memor y control reg i ster s 0 to 2 Addresses 0F E0h to 0F E2h Singl e po w e r source (Vcc = 2.7 to 5.5 V) CPU Re w r ite Mode Parallel I/O Mode Standard ser i al I/O Mode T i me until F l ash Memor y c an Operate after Returni ng from Stop Mode Need ed: 100 μ sec Need ed: 100 μ sec Not need ed Not need ed Po w e r Sourc e Circuit Ch aract e ristics Internal Po w e r Source Stabl e T i me at Pow e r-on : td (P-R) Need ed Need ed Not need ed Not need ed Electrical C har acteristics Recomme nde d Operating Cond itions T he po w e r so u r ce current of the F l ash mem o r y vers ion d i ffers bet w e e n the Groups. Also , the operating conditi ons diffe rs accordi ng to different operati ng volta ges. F o r details, refer to the correspond ing d a tas heet. Mask ROM v e r. Flash Memory v e r. Mask ROM F l ash memor y 60K/2K SP, FP, HP 4.0 to 5.5V F l ash Memor y control reg i ster Address 0F F E h F l ash comman d register Ad d r e ss 0 FFFh Program/Erase Po w e r Sourc e Singl e po w e r source (Vcc = 2.7 to 5.5 V) – Dual p o w e r so urce (Vcc = 5 V

0.5 V, Vpp =

11.7 to 12.6 V) Program/Erase Mode CPU Re w r ite Mode Parallel I/O Mode Standard ser i al I/O Mode – CPU Re w r ite Mode Parallel I/O Mode Standard ser i al I/O Mode 16K/640, 24K/ 1 K, 32K/1K, 48K/2K, 60K/2 K SP, FP, HP 2.7 to 5.5 V Flash Memory v e r. Program Mem o r y F l ash memor y Program Mem o r y /RAM siz e 60K/2K Package SP, FP, HP, K P Operating Po wer Source Volt age 2.7 to 5.5V F l ash Memor y ID Code Addresses F F D 4 to F F D Ah F l ash Memor y ROM Code Pr otect Address F F D Bh F l ash Memor y Control R egist er F l ash Memor y control reg i ster s 0 to 2 Addresses 0F E0h to 0F E2h Differences Between 3804L/3804H/3804 GroupsDifferences Between 3804L/3804H/3804 Groups

16.8 MHz

12.5 MHz

f(X i n ) 5.5 V4.0 V2.7 V Vcc4.5 V

8.4 MHz

5.5 V4.0 V2.7 V f(X i n ) Vcc4.5 V

3804 Group

5.5 V4.0 V2.7 V f(X i n ) Vcc4.5 V 5.5 V4.0 V2.7 V f(X i n ) Vcc4.5 V Improvemen t in 3804L(H)/3804 Groups Op eratin g Frequency CharacteristicsImprovemen t in 3804L(H)/3804 Groups Op eratin g Frequency Characteristics Mask version Flash memory version Middle-speed mode Middle-speed mode Hig h -speed mo de High-speed mode

3804L, 3804H Group Flash memory ve rsio n 38 04 Grou p SFR ar e a Not used SFR (inc l. Re ser vation) Not used ID code Prot ect ad dress Interrupt vecto r ar e a Reserv ed ROM ar e a SFR ar e a Not used SFR area Not used Interrupt vecto r ar e a Reserv ed ROM ar e a 000016 004016 010016 08 3F16 0FF016 0FF F16 100016 ZZZZ16 FF0 016 FFD 416 FFD A16 FFD B16 FFD C16 FFFE16 FFFF16 000016 004016 010016 083F16 0FE016 0FF616 100016 ZZZZ16 FF0 016 FFD 416 FFD A16 FFD B16 FFD C16 FFFE16 FFFF16 RAM Reserv ed ROM ar e a Interrupt vecto r ar e a Rese rv ed ROM area Not used SFR (inc l. Re ser vation) Not used SFR ar e a000016 004016 010016 XXXX16 0FE016 0FF616 YYYY16 ZZZZ16 FF0 016 FFD 416 FFD A16 FFD B16 FFD C16 FFFE16 FFFF16 Zero page Specia l page RAM size XXXX 640 02BF 1024 043F 2048 083F ROM size YYYY ZZZZ 1638 4 C000 A000 3276 8 8000 8080 4915 2 4000 4080 1000 C080 2457 6 A080 6144 0 1080 Differences Between Memory Ma ps of 3804L/3804H/3804 GroupsDifferences Between Memory Ma ps of 3804L/3804H/3804 Groups Mask ROM versio n

Accordi n g to the differences in the specifications shown in P. 6, the follo win g n o tes a r e su gg este d. Pleas e als o r e fer to P.6. 1. Program Memory Dependi ng on the memory type, program/er ase specifi c ations as we ll as applicable programm ers and adaptors differ. Confi rm the progra mmer applicabl e fo r your product. 2. Packages T he W G -package product is avai la bl e only in the 3804L Group. I n the 3804L Group, the FP package product is not avail a bl e, but the thin KP packa ge prod uct i s avail a ble for 0.8 mm-pitch. As a 0.8 mm-pitch, the KP package has better excell ence in thi n ness, heat radiati o n, and stress char acteristics than FP package Confi rm the mounti ng pad design standards of FP package and K P package on R ene sas Surface Mount Package User's Manual (D ocument No.: REJ11K 0001) 3. Operatin g Pow e r So urce Vo ltage T he operating power source volt age for the 3804 Group Mask R O M versi on and the 38 04H/3804L Groups ranges from 2.7 to 5.5V. It ranges from 4.0 to 5.5 V fo r 3804 Group Flash memory versi on. Confi rm the operati ng pow er so u r ce voltag e for you r prod uct. 4. Flash Memory ID Co de and ROM Code Protect In the 3804H/3804L Groups Flash memory version, ID c odes are assigned to addresses F F D4 to F F DA16, and ROM code protect is assigned to address FFDB16. Please note that these addresses are incl uded i n the user ROM area. The data of these addresses must b e se t to pro g r a mmin g data before programmi ng. 5. Flash Memory Co ntrol Reg i sters I n t he 3804H/ 3804L G r oup F las h m e m o r y v e r s ion, F las h Memory c ont rol r e gis t e r s 0 t o are as s i gned t o addr es ses F E0 t o E216. I n the 3804 Group Flash memory version, Flash Memo ry control register is assigned to address 0FFE16 and Flash command register is assign ed to address 0FF F16. I n the Mask ROM versions, nothi ng is all oca ted to these addresse s, so writing can be p e rfo rme d to them. Whe n re ad, th ei r valu e s are undefined. Replacemen t Notes (1)Replacemen t Notes (1)

1. Program/Eras e Pow e r Source, Progra m /Eras e Mode The program/erase power source vo ltage as well as the abs ol ute maximum ratings of the pins differ betw ee n 3 Gro up Flash mem o ry versi on and 3804H/3804L Groups. Fu rther more, the program s pecification (pin used, program al go rithm, etc) differs, to o. Make s ure to connect the specified programmer with your product to prevent a voltage that exceeds the rati ngs from bei ng appl ied to the pi ns 7. Sto p M o de In the 3804H and 3804 L Groups , waiting time (more than 100 μ sec) until Flash memory can operate afte r return in g fro m stop mo de is necessary. Use osci llation stabi lization time setting functi on after the STP instruction is rel e ased to set it. 8. Internal Pow e r So urce Stable Time at Pow e r-on In the 3804H and 3804 L Groups, internal po wer source stabl e time at po we r-on (td (P-R ): max 2msec) is n e c e ssary. Set Vcc to m ore than 2.7 V an d reset i n p u t “L” t o td(P-R) + XIN16 cycl es or mo re. 9. Oscillation Circuit Constants The oscill ation ci rcuit structure differs between the 3804, 3804H , and 3804L Groups. The XIN-XOUT and XCIN-XCO UT oscill ation circuit constants diffe r from p r o d u c t to pro d u c t. Contact the osci ll ator m a n u fac t ure r to sel e ct an appropriate oscillator a nd oscillation circuit constants so that the product used for mass production will obtain an stable oper ating cl ock with your system and conditi ons. Additi onal consi d erati on is requi r ed w hen the vo ltage range or the temp erature range is wide. Also, we recommend consi d eri ng the wiri n g pa tterns of the feed ba ck resisto r s, the da mpi ng resist ors, and the l oad capacity befo rehand when des i gning c i r c uits 10. Differences betw een Mask ROM and Flash Memory Versio ns The Flash memory and Mask ROM versi ons di ffer i n their manufacturi ng pr oce sses an d mask pattern s be cause of the different ROM types used. Because of these diffe rences, characteristi cs values, operation margi n s, noise i m munity, noise radiati o n, and oscil lation circuit co nstants may vary. When developing appli c ation produ cts, perform careful system eval uati ons for eac h product. Additional care is required w h en rep laci n g pro d u cts (for exampl e repl aci ng a Mask ROM versi on with a Flash m e m ory versi o n . Carefu l syste m eval u a tio n s sho u l d b e pe rforme d with repl acement products befor e the mass production phase of appl icati on products. Replacemen t Notes (2)Replacemen t Notes (2)

Detai l s about a program are descr ibed as foll ows regarding w h ethe r the same program can be used without change when repl aci n g b et ween standards, Spec. H and Spec. L of the 3804 Group. Please make sure to check there are some differ ences of memory size in every product. Ref e r to t h e datasheet s and t e chnical updat e s of t he 3804 G r oup f o r det a iled specif icat ions of pr oduct s Conf irm t h e operat ion usi ng replaced product. Note: Progra m chec k s um When calculati n g the checksum of ROM area by a program, make sure to check the differen ce of areas for calculati on. When the unused area and reserved ROM area are i ncl uded i n target areas of repl ac ed products, the read val u es are undefi n ed and calculated values of the c hecksum are also undefi ned. (1) Standard flash m e mory ve r s ion Æ Sp ec. L flash memory version 1. When usi n g the addresses F FD4h to FFDAh, check the followings: The codes written i n these addresses are the ID codes of the Spec. L flash memory vers i on w hen using a serial programmer. To in put this cod e is necess a ry as the ID c o d e fo r flas h me mory repro g ra mming by a serial prog ra mme r. Che ck the a bov e on ly wh e n usi ng a seri al programmer because the addresse s can be executed as an instructi o 2. The bits 7 to 2 of the addr ess F FDBh are the protect set bits of the Spec. L flash memory vers ion wh en us ing a pa ralle l p r og r ammer. When the set conditi on is not unexpected, to change a program is necessary. Since the protect set bits do not affect when using a s e r i al pr ogram mer t her e is no problem This address can be executed as an i n structi o n same as th e addresses F F D4h to F F DAh. 3. When accessing the addresses 0FE0h to 0FEFh, to c hange a program not to access th ese addresses is necessary. 4. Nothi ng is assig n ed o n the ad dre sses 0FFEh an d 0FFFh of Spec. L f lash me mory versi on. To cha n g e a p r o g ram is n o t n e cessary even if programmi ng i n standard flash memory version is performed. 5. To change a program is necessary when the oscill atio n stabil i zati o n time after the ST P in struction is released is less than 1 00 μ sec in stop mode. Set 100 μ sec or more by the oscillation stabilizat ion time setting function after the STP instru ction which uses timer 1 is rel eased. 6. When usi n g CPU rew r ite mode, to change general processes regardi ng CPU re write mode is necessary. (2) Spec. H flash memory versio n Æ Spec. L flash memory version To change a program i s not necessary. Program change at replacingProgram change at replacing

SDA (P44/RXD1) SCLK (P46/SCLK1) OE (P37/SRDY3) BUSY (P47/SRDY1 /CNTR2) TXD (P45/TXD1) VPP (CNVSS) RESET(RESET) Vss M38049FF (Stand a rd s e ri al I / O Mode ) T_VDD T_TXD T_RXD T_SCLK T_PGM/O E /MD T_BUSY T_VPP T_RESET USER RST GND Reference: M38049FF and M38049FFH (L) Serial Rewriting Circuit when Using a Suisei Electronics System Serial Unit Reference: M38049FF and M38049FFH (L) Serial Rewriting Circuit when Using a Suisei Electronics System Serial Unit The pin number indicate s the flat package version. N o te : T_VPP is no t nee ded . N.C. XIN X O UT Perform the same pin proc ess i ng as in si ngl e chip mode. M38049FFH M38049FFL (Stand a rd s e ri al I / O Mode 1) Vcc RXD (P44/RXD1) SCLK (P46/SCLK1) BUSY (P47/SRDY1/CNT R2) TXD (P45/TXD1) CNVSS RESET(RESET) Vss T_VDD T_TXD T_SCLK T_BUSY T_RXD T_PGM/OE/MD T_RESET USER RST GND XIN XO UT Perform the same pin proc ess i ng as in si ngl e chip mode. Differe nc esNote: z As program ming specifications dif fe r for each p r oduct , spe c ify the pa r t number be fo r e prog ramm ing. z As the MCU prog ramming pins a r e common, writing can be perfo rmed o n the same board in the QzROM/Fla s h memory versions. *1: For the standard version, connect bo th the ser i al unit’s T_T XD and T_ RXD to SDA (RxD p i n), and leave TxD pin open. *2: Supply t he power so urce voltage (Vcc) from t he use r so t hat it wi ll meet the Vcc o f the ou tput b uf fer u s ed o n the prog ra mme *3: The VDD po wer so urce is supplie d f r om the prog ramme r When the user power consumption is high (20 mA or mo re for o ther tha n the MCU), supply the VDD from th e use r

Development Suppor t Tool Part Number Assembl e r pack a g e M3T-SRA74 (Simul ator debugger i ncl . Inte gra t ed Dev e l o pme n t Envi ron m e n t wi th HEW) Compiler Package M3T-ICC740 (Simul ator debugger i ncl . Inte gra t ed Dev e l o pme n t Envi ron m e n t wi th HEW) On-chi p D e bugging Emul ator (3804L Group) E8a (incl. HEW, 740 E8a emul at or debugger, M3T-SRA74 free eval uati on versi on, M3T-ICC740 free evaluati o n version, FDT fr ee eval uati on versi o n, and m ore) Compact Emul ator M38000T2-CPE (incl. 740 C ompact emulator debu gg er, M3T- ICC74 i t h HEW), and M3T-SRA74 with HEW) ) Compact Emulator System Emulator MCU M38 49R L SS Sim u lat o r Debugger M3T-SRA74, M3T-ICC74 o r M3T- PD38SIM accessory (disco nti n ue Accessory Pin processing board M 38007T-ADS (pin p r ocessing board for E m ul ator MCU) PC4701 Emulator System (Discontinue d Product) Packag e C onv erte r ( Refe r to th e nex t pa g e ) Emulator D e bugger

740 PC4701 emul

38 (discontinued) Emulator PC4701U (emulator de bugger licen se bundled) Emulati o n Pod M 38000TL2-FPD (low voltag e ope r a t i on s u ppor te d isc ont inued) Emulator MCU M 38049R LSS Renesas 3804L/3804H/3804 Groups Development Support Tools Renesas 3804L/3804H/3804 Groups Development Support Tools Except programm e rs and on-chi p debugging emulators, developm ent support tools are common to th e Grou ps.

F P package : HQPACK064SA ( S o l d Sepa rate ly ) *4 KP package : HQPACK064 SA160 ( S o l d Sepa ra te ly ) *4 Emul ati o n P o d M38000TL2 PD d iscontinued M3T- P -WT M38007T P RB M3T- 4DI DMS T -64LC C Q S D in 5 mm p i tch Q F P H P package 64-pin SDIP socket SP package) M3T-DUMMY64 in 8 mm p i tch Q F P F P pac kage) RSS ty p e em ul at or MCU M38049RLSS Com p a c t emul at or M38000T C PE M3T-F L X-64 NSA 64p in mm pit c h QFP/ L Q FP F P/KP package F P /KP package board - mo u n t e d ev al u a ti o n M3T- 2 8 D P -WS *1 HP package version HQPACK064S D (Sol d S e p a ra t e l y ) *4 in 5 mm p i tch Q F P H P package T -64LC C Q S D YQSOCKET 064SDF 2 (Sol d S e p a ra t e l y ) *4 YQPACK064S D (Sol d S e p a ra t e l y ) *4 NQPACK064S D-ND ( S o l d Sepa ra te ly ) *4 PC4701 Sys t e m (d iscontinued ) Connecting Emulator and Target SystemConnecting Emulator and Target System * E mu la to r Pod Probe type in na r r o w p i tch connecto r x 1 F P /KP package version H P package sa mp le Boa r d mounted e v a l ua tion *1. This con v erter is included in Emulator Pod Package. *2. These 3 part s are as one se t . *3. These 4 part s are as one se t . *4. Avai lab l e f r om Tokyo Eletech Cor poration. * The z mar k indicates t he location of No.1 pin . Com p a c t emul at or sy st em

Suisei Electronics System Flash Memory Programmers 3804H/3804L Groups Suisei Electronics System Flash Memory Programmers Serial/Parallel U nit On-b oa rd r e pr o g r a mm ing Off-boa r d r e pr o g r a mm ing M38049FF H M38049FF L Flash memory ve rsio n (Seri a l p r o g ra mmi n g ) M38049FF H M38049FF L Flash memory ve rsio n (Parall el programmi ng) EF1SRP-01US2EF P-S2V EF P-S2 in common EF1CNT-96P EF1SRP-01U EF1CNT-96P + Par a llel un it EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) EF P-I E F1SRP-01U Paral l el uni t EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) Mai n u n it EF1CNT-96P: Connector converter unit Eac h unit f o r EF P- I c a n be connec t ed t o EF P- S2 or EF P- S2V by EF 1CNT - 96P. As a Renesas Flash memory /QzROM pr og ram m er, th e Flash Developmen t Toolkit (FDT) and t he E8 ca n be used together for on-board programmin g. (IC socket boards are required fo r the QzROM on oa rd pro g rammi ng.)

PCA4738H F-64 (for 0.5 mm-pitch LQFP package) PCA4738FF-64 (for 0.8 mm-pitch QF P package) RENESAS Programmi ng Adapter PCA4738S F-64 (for 1.77 8 mm-pitch SDIP package) EFP-I for Seria l Interface Availabl e from Suisei El ectronics System Co., Ltd. R4945, R4945A for Para ll el Inte r f ace Availabl e from ADVANTEST Corp. (RENESAS Programming Adapter required) AF9709, AF9708, AF9723 for Stan dard Parall el Interface Availabl e from Flash S upport Group, Inc. (RENESAS Programming Adapter required) Flash Memory Pro g ra mme r

3804 Group Programmers3804 Group Programmers

Rev . Da t e P a g e S u mmary 1 . 00 Aug . 04 , 200 8 F ir s t ed ition is sued REVI SIO N HI STO R Y

©2008. Renesas Technology Corp., All rights reserved.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1 st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

1. All information included in this document is current as of th e date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part . 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ship s, etc.); traffic control systems; anti-disaster systems; anti- crime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Fur ther, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any fo rm, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority- owned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.