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Document overview
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Technical content
Features
n Guaranteed 150 mA output current n Smallest possible size (micro SMD) n Requires minimum external components n Stable with low-ESR output capacitor n <1 µA quiescent current when shut down n Low ground pin current at all loads n Output voltage accuracy 1% (A Grade) n High peak current capability n Wide supply voltage range (16V max) n Low ZOUT: 0.3Ω typical (10 Hz to 1 MHz) n Overtemperature/overcurrent protection n −40˚C to +125˚C junction temperature range n Custom voltages available
Applications
n Personal Digital Assistant (PDA) n Camcorder, Personal Stereo, Camera Block Diagram 10129501 VIP™ is a trademark of National Semiconductor Corporation. June 2004 LP2985LV Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications with Output Voltages≤2.3V © 2005 National Semiconductor Corporation DS101295 www.national.com
*ON/OFF input must be actively terminated. Tie to V IN if this function is not to be used. Minimum capacitance is shown to ensure stability (may be increased without limit). Ceramic capacitor required for output (see Application Hints) . *Reduces output noise (may be omitted if application is not noise critical). Use ceramic or film type with very low leakage current (see Application Hints). Connection Diagrams 5-Lead Small Outline Package (M5) micro SMD, 5 Bump Package (BPA05 & BLA05) 10129503 Top View See NS Package Number MF05A For ordering information see Table 1 10129523 Note: The actual physical placement of the package marking will vary from part to part. Package marking contains date code and lot traceability information, and will vary considerably. Package marking does not correlate to device type. Top View See NS Package Number BPA05 & BLA05 Pin Descrption Name Pin Number Function SOT-23 micro SMD VIN 1 C3 Input Voltage GND 2 A1 Common Ground (device substrate) ON/OFF 3 A3 Logic high enable input BYPASS 4 B2 Bypass capacitor for low noise operation VOUT 5 C1 Regulated output voltage LP2985LV www.national.com 2
Ordering Information
TABLE 1. Package Marking and Ordering Information
1.35 A LP2985AIM5X-135 LF7A 3000 Units on Tape and Reel
1.35 A LP2985AIM5-135 LF7A 1000 Units on Tape and Reel
1.35 STD LP2985IM5X-135 LF7B 3000 Units on Tape and Reel
1.35 STD LP2985IM5-135 LF7B 1000 Units on Tape and Reel
Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Range −65˚C to +150˚C Operating Junction Temperature Range −40˚C to +125˚C Lead Temp. (Soldering, 5 sec.) 260˚C ESD Rating (Note 2) 2 kV Power Dissipation (Note 3) Internally Limited Input Supply Voltage (Survival) −0.3V to +16V Input Supply Voltage (Operating) 2.2V to +16V Shutdown Input Voltage (Survival) −0.3V to +16V Output Voltage (Survival, (Note 4)) −0.3V to +9V I OUT (Survival) Short Circuit Protected Input-Output Voltage (Survival, −0.3V to +16V (Note 5)) Electrical Characteristics (Note 10) Limits in standard typeface are for T J = 25˚C. and limits in boldface type apply over the full operating temperature range. Un- less otherwise specified: V IN =V O(NOM) + 1V, I L = 1 mA, C IN = 1 µF, C OUT = 4.7 µF, V ON/OFF = 2V. Symbol Parameter Conditions Typ LP2985AI-X.X LP2985I-X.X Units(Note 6) (Note 6) Min Max Min Max ∆VO Output Voltage Tolerance %VNOM 1m A ≤ IL ≤ 50 mA −1.5 1.5 −2.5 2.5 −2.5 2.5 −3.5 3.5 1m A ≤ IL ≤ 150 mA −2.5 2.5 −3.0 3.0 −3.5 3.5 −4.0 4.0 Output Voltage V O(NOM)+1V ≤ VIN ≤ 16V 0.007 0.014 0.014 %/VLine Regulation 0.032 0.032 IGND Ground Pin Current I L = 0 65 95 95 µA 125 125 IL = 1 mA 75 110 110 170 170 IL = 10 mA 120 220 220 400 400 IL = 50 mA 300 500 500 900 900 IL = 150 mA 825 1200 1200 2000 2000 VON/OFF < 0.3V 0.01 0.8 0.8 VON/OFF < 0.15V 0.05 2 2 VIN(min) Minimum Input Voltage Required To maintain Output Regulation (Note 9) 2.05 2.20 2.20 V V IN -V OUT Dropout Voltage (Note 9) IL = 50mA 120 150 250 150 250 mVIL = 150mA 280 350 600 350 600 VON/OFF ON/OFF Input Voltage (Note 7) ION/OFF ON/OFF Input Current V ON/OFF = 0 0.01 −2 −2 µAVON/OFF =5 V 5 15 15 en Output Noise BW = 300 Hz to 50 kHz, Voltage (RMS) C OUT =1 0µ F 3 0 µ V CBYPASS =1 0n F VOUT = 1.8V LP2985LV www.national.com 4
Electrical Characteristics (Note 10) (Continued) Limits in standard typeface are for T J = 25˚C. and limits in boldface type apply over the full operating temperature range. Un- less otherwise specified: V IN =V O(NOM) + 1V, I L = 1 mA, C IN = 1 µF, C OUT = 4.7 µF, V ON/OFF = 2V. Symbol Parameter Conditions Typ LP2985AI-X.X LP2985I-X.X Units(Note 6) (Note 6) Min Max Min Max Ripple Rejection f = 1 kHz, C BYPASS =1 0n F 45 dBCOUT =1 0µ F IO(SC) Short Circuit Current R L = 0 (Steady State) 400 mA(Note 8) IO(PK) Peak Output Current V OUT ≥ Vo(NOM) −5% 350 mA Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. Note 2: The ESD rating of pins 3 and 4 for the SOT-23 package, or pins 5 and 2 for the micro SMD package, is 1 kV. Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, T J(MAX), the junction-to-ambient thermal resistance, θJ-A, and the ambient temperature, T A. The maximum allowable power dissipation at any ambient temperture is calculated using: Where the value of θJ-A for the SOT-23 package is 220˚C/W in a typical PC board mounting. Exceeding the maximum allowable dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Note 4: If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2985LV output must be diode-clamped to ground. Note 5: The output PNP structure contains a diode between the VIN to VOUT terminals that is normally reverse-biased. Reversing the polarity from VIN to VOUT will turn on this diode, and possibly damage the device (See Application Hints). Note 6: Limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate National’s Average Outgoing Quality Level (AOQL). Note 7: The ON/OFF input must be properly driven to prevent possible misoperation. For details, refer to Application Hints. Note 8: The LP2985LV has foldback current limiting which allows a high peak current when V OUT > 0.5V, and then reduces the maximum output current as VOUT is forced to ground (see Typical Performance Characteristics curves). Note 9: VIN must be the greater of 2.2V or VOUT(nom) + Dropout Voltage to maintain output regulation. Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below ther value measured with a 1V differential. Note 10: Exposing the micro SMD device to direct sunlight will cause misoperation. See Application Hints for additional information. LP2985LV www.national.com5
Typical Performance Characteristics Unless otherwise specified: C IN = 1µF, C OUT = 4.7µF, VIN =V OUT(NOM) +1, VOUT = 1.8V, T A = 25˚C, ON/OFF pin is tied to V IN VOUT vs Temperature Short-Circuit Current 10129507 10129516 Short-Circuit Current Short-Circuit Current vs Output Voltage 10129517 10129518 Ripple Rejection COUT = 4.7µF, Bypass = 10nF Ripple Rejection COUT = 4.7µF, No Bypass 10129525 10129526 LP2985LV www.national.com 6
Typical Performance Characteristics Unless otherwise specified: C IN = 1µF, C OUT = 4.7µF, VIN =V OUT(NOM) +1, VOUT = 1.8V, T A = 25˚C, ON/OFF pin is tied to V IN (Continued) Output Impedance vs Frequency Output Impedance vs Frequency 10129527 10129532 Noise Density Noise Density 10129533 10129537 Ground Pin vs Load Current Minimum Input Voltage vs Temperature 10129513 10129509 LP2985LV www.national.com7
Typical Performance Characteristics Unless otherwise specified: C IN = 1µF, C OUT = 4.7µF, VIN =V OUT(NOM) +1, VOUT = 1.8V, T A = 25˚C, ON/OFF pin is tied to V IN (Continued) Minimum Input Voltage vs Temperature Input Current vs V IN 10129541 10129510 Input Current vs V IN Input Current vs V IN 10129511 10129512 Ground Pin Current vs Temperature Instantaneous Short Circuit Current 10129514 10129515 LP2985LV www.national.com 8
Typical Performance Characteristics Unless otherwise specified: C IN = 1µF, C OUT = 4.7µF, VIN =V OUT(NOM) +1, VOUT = 1.8V, T A = 25˚C, ON/OFF pin is tied to V IN (Continued) Output Characteristics Load Transient 10129508 10129542 Load Transient Load Transient 10129543 10129544 Line Transient Line Transient 10129545 10129546 LP2985LV www.national.com9
Typical Performance Characteristics Unless otherwise specified: C IN = 1µF, C OUT = 4.7µF, VIN =V OUT(NOM) +1, VOUT = 1.8V, T A = 25˚C, ON/OFF pin is tied to V IN (Continued) Line Transient Line Transient 10129547 10129548 Turn-On Time Turn-On Time 10129549 10129552 Turn-On Time Turn-On Time 10129550 10129551 LP2985LV www.national.com 10
Application Hints (Continued) One disadvantage of ceramic capacitors is that their capaci- tance can vary with temperature. Most large value ceramic capacitors (≥ 2.2 µF) are manufactured with the Z5U or Y5V temperature characteristic, which results in the capacitance dropping by more than 50% as the temperature goes from 25˚C to 85˚C. This could cause problems if a 2.2 µF capacitor were used on the output since it will drop down to approximately 1 µF at high ambient temperatures (which could cause the LP2985LV to oscillate). If Z5U or Y5V capacitors are used on the output, a minimum capacitance value of 4.7 µF must be observed. A better choice for temperature coefficient in ceramic capaci- tors is X7R, which holds the capacitance within ±15%. Un- fortunately, the larger values of capacitance are not offered by all manufacturers in the X7R dielectric. Tantalum Tantalum capacitors are less desirable than ceramics for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 1 µF to 4.7 µF range. Another important consideration is that Tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a Tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical Tantalum will increase about 2:1 as the temperature goes from 25˚C down to −40˚C, so some guard band must be allowed. On/off Input Operation The LP2985LV is shut off by driving the ON/OFF input low, and turned on by pulling it high. If this feature is not to be used, the ON/OFF input should be tied to V IN to keep the regulator output on at all times. To assure proper operation, the signal source used to drive the ON/OFF input must be able to swing above and below the specified turn-on/turn-off voltage thresholds listed in the Electrical Characteristics section under V ON/OFF. To prevent mis-operation, the turn-on (and turn-off) voltage signals ap- plied to the ON/OFF input must have a slew rate which is ≥ 40 mV/µs. Caution: the regulator output voltage can not be guaranteed if a slow-moving AC (or DC) signal is applied that is in the range between the specified turn-on and turn-off voltages listed under the electrical specification V ON/OFF (see Electri- cal Characteristics). REVERSE INPUT-OUTPUT VOLTAGE The PNP power transistor used as the pass element in the LP2985LV has an inherent diode connected between the regulator output and input. During normal operation (where the input voltage is higher than the output) this diode is reverse-biased. However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator output. In such cases, a parasitic SCR can latch which will allow a high current to flow into V IN (and out the ground pin), which can damage the part. In any application where the output may be pulled above the input, an external Schottky diode must be connected from V IN to VOUT (cathode on V IN, anode on V OUT), to limit the reverse voltage across the LP2985LV to 0.3V (see Absolute Maximum Ratings). MICRO SMD MOUNTING The micro SMD package requires specific mounting tech- niques which are detailed in National Semiconductor Appli- cation Note # 1112. Referring to the section Surface Mount Technology (SMT) Assembly Considerations, it should be noted that the pad style which must be used with the 5-pin package is the NSMD (non-solder mask defined) type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. MICRO SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct sunlight will cause misoperation of the device. Light sources such as Halogen lamps can also affect electrical performance if brought near to the device. The wavelenghts which have the most detrimental effect are reds and infra-reds, which means that the fluorescent light- ing used inside most buildings has very little effect on per- formance. A micro SMD test board was brought to within 1 cm of a fluorescent desk lamp and the effect on the regu- lated output voltage was negligible, showing a deviation of less than 0.1% from nominal. LP2985LV www.national.com 12
Physical Dimensions inches (millimeters) unless otherwise noted 5-Lead Small Outline Package (M5) For Order Numbers, refer to Table 1in the “Ordering Information” section of this document. LP2985LV www.national.com13
Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER CLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6.NO JEDEC REGISTRATION AS OF AUG.1999. micro SMD, 5 Bump, Package (BPA05 - 170 µm ball) For Order Numbers, refer to Table 1“Ordering Information” section of this document. The dimensions for X1, X2 and X3 are as given: LP2985LV www.national.com 14
Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER CLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6.NO JEDEC REGISTRATION AS OF AUG.1999. micro SMD, 5 Bump, Package (BLA05 - 300 µm ball) For Order Numbers, refer to Table 1“Ordering Information” section of this document. The dimensions for X1, X2 and X3 are as given: LP2985LV www.national.com15
Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER CLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6.NO JEDEC REGISTRATION AS OF AUG.1999. micro SMD, 5 Bump, Package (TPA05 - 170 µm ball) For Order Numbers, refer to Table 1“Ordering Information” section of this document. The dimensions for X1, X2 and X3 are as given: LP2985LV www.national.com 16
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LP2985LV Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications with Output Voltages≤2.3V