370-SERIES EDAC | Alldatasheet

Document overview

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  • PDF pages: 1

Technical content

Features: www.edac.net customerservice@edac.net High Speed Card Edge Connectors Specifications: Insulator Material High Temperature Thermoplastic UL-94V-0 Contact Material & Shield Material Copper Alloy Contact Plating Gold Flash Plating Current Rating 3.1 amps/Pin Contact Resistance Initial: 15 milliohms maximum After Test: ΔR 5 milliohms Dielectric Withstanding Voltage 750 V AC for 60s Insulation Resistance 1000 megaohms minimum Operating Temperature -55°C to +125°C Insertion Force 0.63 N / Per Pair maximum Withdrawal Force 0.06 N / Per Pair minimum High Speed Card Edge Connectors 370/371 SERIES

  • SMT 0.8mm Pitch
  • High density for space saving
  • Insertion Loss : Differential pair signaling 21Gbps@<-3dB
  • Available in 20, 100, 180 & 200 contacts
  • Height : 7.8 mm
  • SAS 3.0 & PCIe 3.0 compliant
  • Application : IPC, Server, Data Storage Part Number: No. of Contacts: Photo: Key: Latch: 370-020-229-102 20 No No 370-100-229-002 100 Yes No 371-100-529-002 100 Yes Yes 371-180-529-002 180 Yes Yes 370-200-229-002 200 Yes No