3580 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
DESCRIPTION
FEATURES
.HIGH OUTPUT SWINGS, up to j::145V (35821 .LARGE LOAD CURRENTS, up to j::6OmA (35801 .DIFFICUL T TO DAMAGE, automatic thermal shutoff .REDUCES SOURCE LOADING, 1 O 11 n Input Z .PRESERVES SYSTEM ACCURACY, 11OdB CM R 2OpA bias current The 3580 series is the first family of I ntegrated Circuit operational amplifiers which will provide output voltage swings of up to ::t 145V . The monolithic F--ET input stage has low bias currents (20pA) which minimizes the offset voltages caused by the bias current and the large resistance normally associated with high voltage circuits. The 3580 series is packaged in a TO-3 package which will dissipate over 3W of power without a heat sink and 4.5W with a suitable heat sink. The input stage is protected against overvoltages and the output stage is protected against short-circuits- to-ground. A special thermal sensing circuit prevents damage to the amplifier by automatically shutting the amplifier down when too much power is being dissipated. Printed in U.S.A. May, 1987 PDS-313D @ 1975 Burr-Brown Corporation SBOS166
illustrates a typical application. the amplifier circuits operating in a linear manner. FIGURE 3. Operation from a Single Supply. as the common-mode voltage changes.
Typical at TCASE = -: 25°C max unless otherwise note~ MODELS I POWER SUPPLY I Voltage. :!:Vcc 3580J 3581J 3582J ISVDC to c3SVDC J::10mA :32VDC ta :!:75VDC :!:8mA !:70VDC to :!:150VDC :!:65mA I Quiescent Current. max i RATED OUTPUT I Voltage. :!:'iVCCI -5 \\,- - DC,min IOVDC to :30VDC J:60mA :100mA :27VDC to :!:7OVDC :!:3OmA :!:SOmA 1OnF ;:65VDC to :!:145VDC :!:15mA :!:25mA Current, min Current, Short Circuit ~pacitance, max i OPEN-LOO~ 106dB 86dB 112dB 94dB 118dB 100dB No Load. DC Rated Load. DC. min FREOUENCYRESPONSE Unity Gain Bandwidth. Small Signal Full Power Bandwidth Slew Rate SettlinqTime.O.1% SMHz. min 60kHz 20V/!ls 12!ls 100kHz 15V/IJs 30kHz 20V/,,5 ~ INPUT OFFSET VOl TAGE Initial at TCASE = +25°C. max Drift vs Temp, max Drift vs Supply Voltage Drift vs Time :!:10mV :!:30IJV/OC 100IJV/V 100IJV/mc :!:3mV :!:25IJV/OC 20IJVN 50IJV/mo :t3mV 12S}lV/OC 20}lV/V SO}lV/mo I INPUT BIAS CURRENT -50pA I -20pA doubles every 10°C 02pA/V 20pA Initial at ICASE = +25°C. max Drift vs Temp Drift vs Supply Voltage O.5pA/\\t 02pA/v rlNPUT OFFSET CURRENT I :!:20pA doubles every 10oC 02pA/V OSpA/V 02pA/V Initial at TCASE = +25°C. max Drift vs Temp Drift vs Supply Voltage INPUT IMPEDANCE Differential Common-mode INPUT NOISE Voltage 001 Hz to 10Hz. p-p 10Hzto1kHz. rms Current 001Hz to 10Hz. p-p INPUT VOlTAGE RANGE Max Safe Differential Voltage(1) Max Safe Common-mode Voltage Common-mode Voltage. Linear Operation Common-mode Rejection TEMPERATURE Case Specification Operating Storage 1011!110pF 101111 SIJV 17IJV 03pA 17IJV 03pA 1!JV 1pA -vcc ;0 -VCr: -VD +V{ Vcc -10 v 110dB Vcc -10 110dB Vcc -!1 v 86dB 0°C to 70°C .55°C to +125°C 55°C to +150°C NOTE.
1 On Models 3581 and 3582 the inputs may be damaged by pulses at pins 5 or 6 with
dV /dt?1 V /nsl. Any possible damage can be eliminated by limiting the input current to 150mA with external resistors in series with those pins. No external protection is needed for slower voltage The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
TYPICAL PERFORMANCE CURVES TCASE = +25°C and :tVcc max unless otherwise noted -50 -25 0 25 50 75 100 125 Case Temperature roC I OPEN-LOOP GAIN VS SUPPL y VOL T AGE A T MAX LOAD MAXIMUM POWER DISSIPATION 11) ta (!J O O 0)c. O 10 100 1k 10k 100k 1M 10M Frequency iHzi 40 50 60 70 80 90 100 110 Power Supply 1% of maxi 75 100 Temperature ,0( 125 150 TOTAL INPUT NOISE VOLTAGE VS SOURCE RESISTANCE TOTALLOWFREOUENCYINPUT NOISE VS SOURCE RESISTANCE -25 O 25 50 75100 125 Temperature (oGI 103 104 105 106 10; Source Resistance (01 108 COMMON-MODE REJECTION VS FREQUENCY POWER SUPPL Y REJECTION VSFREOUENCY ~ -Vcc =:t75V - ~-VCC=:t150V m <.) -~! -j~t-Vcc = :!:35\\i I 100 1k 10k 100k 1/1.1 Frequency (HZi 130 110! 901 101
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 3581J NRND TO-3 LMF 8 TBD Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 3-Aug-2009 Addendum-Page 1
(TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for
applications
design. Customers are responsible for their products and components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP Products www.dlp.com Broadband www.ti.com/broadband DSP dsp.ti.com Digital Control www.ti.com/digitalcontrol Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Military www.ti.com/military Logic logic.ti.com Optical Networking www.ti.com/opticalnetwork Power Mgmt power.ti.com Security www.ti.com/security Microcontrollers microcontroller.ti.com Telephony www.ti.com/telephony RFID www.ti-rfid.com Video Imaging www.ti.com/video RF/IF and ZigBee Solutions www.ti.com/lprf Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2009, Texas Instruments Incorporated