354000 ARIES | Alldatasheet
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- C onvenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS
- S OCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp
- P CB: FR-4, 0.062 [1.58] thick
- MALE ADAPTER PIN : Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- M ALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290
- FEMALE CONTACT PIN : Brass 360 1/2-hard per UNS C36000, ASTM B16/ B16M
- F EMALE PIN PLATING: 10µ [0.254µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290
- 4 -FINGER COLLET CONTACT: BeCu per UNS C17200, ASTM B194-08
- FEMALE CONTACT PLATING : 10µ [0.254µ] Au per MIL-G-45204 over 50µ [1.27µ] Ni per SAE AMS-QQ-N- 290
- CONTACT CURRENT RATING: 3 amps
- O PERATING TEMPERATURE: 221°F [105°C]
- I NSERTION FORCE: 180g/pin; based on a 0.018 [0.46] dia. test lead
- W ITHDRAWAL FORCE: 90g/pin; based on a 0.018 [0.46] dia. test lead
- N ORMAL FORCE: 140g/pin; based on a 0.018 [0.46] dia. test lead [2.54-3.18] long MOUNTING CONSIDERATIONS
- SUGGESTED PCB SOLDER PAD SIZE : 0.028 [0.71] min. width 18009 Rev. AB Series 354000 DIP-to-SOIC Adapter P/N Suffix Dim. “X” Dim. “Y” CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Pins 8 , 14, 16, 20, 24, 28 Series Adapter Pin Options (see P/N Suffix Table) 1 = S hort Adapter Pin 2 = L ong Adapter Pin