AB-3535CJ-F1D AMERICANBRIGHT | Alldatasheet

Document overview

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Technical content

1 | P a g e Specification for 3535C1 Series AB-3535CJ-F1D Features:

  • Top view infrared LED
  • High power infrared LED
  • Low thermal resistance
  • Pb-free reflow soldering application
  • RoHS and REACH compliant Applications:
  • Infrared Illumination for cameras
  • Surveillance systems
  • Proximity sensor
  • Auto Focus
  • Gaming Notebook
  • Large Size Touch Panel
  • Car Sensors
  • Virtual Reality 3535 Ceramic 1.0W 850nm 3V IR LED

2 | P a g e Absolute Maximum Ratings (Tj=25֯C) Item Symbol Absolute Max. Rating Unit Forward Current IF 1000 mA Pulse Forward Current IFP 1200 mA Power Dissipation PD 3.6 W Reverse Voltage VR 5 V Operating Temperature Topr -40~ +85 ˚C Storage Temperature Tstg -40~ +105 ˚C Junction Temperature Tj 115 ˚C Soldering Temperature Tsld Reflow soldering: 230˚C or 260˚C for 10 sec * IFP condition with Pulse: Width≤100μs, Duty cycle≤1/10 * LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product * All measurements were made under the standardized environment of American Bright LED Electrical/Optical Characteristics (Tj=25֯C) Item Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 2.6 3.0 3.6 V If = 350mA Reverse Current IR - - 10 µA VR = 5V Radiant Flux Фe - 520 - mW If = 350mA Radiant Intensity Ie - 280 - mW/Sr If = 350mA Peak Wavelength λp - 850 - nm If = 350mA Viewing Angle 2θ1/2 - 60 - ˚ If = 350mA Thermal Resistance Rth j-sp - 5.3 - ˚C/W If = 350mA Electrostatic Discharge ESD 6000 - - V HBM * Tolerance of measurements of the Forward Voltage is ±0.1V * Tolerance of measurements of the Radiant Flux is ±7% * 2θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity * Tolerance of measurements of Peak Wavelength is ±2.0nm * Rth j-sp is the thermal resistance from LED junction to solder point on MCPCB with electrical power Naming System: AB-3535CJ-F1D-yyy yyy: bin code

3 | P a g e BIN Structure Radiant Flux BINs (IF =350mA, Tj =25˚C) Radiant Flux BIN code Min. Max. Unit JNO 315 390 mW JPO 390 490 mW JQO 490 610 mW JRO 610 770 mW JSO 770 960 mW * Tolerance of meJSOasurements of the Luminous Flux is ±7% Peak Wavelength Bins (IF = 350mA, Tj =25֯C) BIN code Min. Max. Unit XE0 840 860 nm XF0 860 880 nm * Tolerance of measurements of the peak wavelength is ±2.0nm Forward Voltage Ranks (IF = 150mA, Tj =25֯C) BIN Code Min. Max. Unit AB6 2.6 2.8 V AC3 2.8 3.0 V AC4 3.0 3.2 V AC5 3.2 3.4 V AC6 3.4 3.6 * Tolerance of measurements of the Forward Voltage is ±0.1V

4 | P a g e Typical Characteristics Curves Fig 1. Color Spectrum (Tj=25֯C) Fig 2. Forward Current vs. Relative Intensity, Tj = 25˚C Fig 3. Forward Current vs. Relative Voltage, Tj =25˚C Fig 4. Ambient Temperature vs. Relative Output Flux,If=350mA Fig 5. Typical Viewing Angle =60°, Tj = 25˚C Fig 6. Soldering Temperature vs. Maximum Forward Current

5 | P a g e Package Dimensions * The tolerance unless mentioned is ±0.1mm, unit = mm Recommended Solder Pad * The tolerance unless mentioned is ±0.1mm, unit = mm

6 | P a g e Reflow Soldering Characteristics Reflow Soldering Temperature min (Ts, min) 150˚C Temperature Max (Ts, Max) 200˚C Time (ts) from (Ts, min to Ts, Max) 60-120 s Ramp-up rate (TL to Tp) 3˚C/s Max Liquidous temperature (TL) 217˚C Time (TL) maintained above TL 60-150 s Peak package body temperature 260˚C Max Time (Tp) within 5˚C of the specified classification temperature (Tc) 30 s Max Ramp-down rate (Tp to TL) 6˚C/s Max Time 25˚C to peak temperature 8 min. Max

7 | P a g e Package Dimensions of Tape * Quantity: Max 500pcs/Reel * Cumulative Tolerance: Cumulative Tolerance/10 pitches to be ±0.25mm * Package: P/N, Manufacturing data Code No. and Quantity to be indicated on a waterproof Package. * unit = mm Package Dimensions of Reel

8 | P a g e Packaging

9 | P a g e Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. Notes on American Bright AB-3535CJ Series soldering: 1. Recommend to use reflow machine. 2. Recommend to use heating plate soldering. 3. Manual soldering is not recommended. Notes on reflow process: 1. To confirm whether the actual temperature curve in the reflow soldering conditions comply with recommended conditions. LEDs are guaranteed for one time reflow. 2. During reflow process do not apply force on LED active area. 3. After reflow process, PCB board should be cooled down before packing or storage. Precaution for use Storage 1. Before opening the package: The LED should be kept at 30˚C or less and 90%RH or less. 2. After opening the package: The LED’s lifetime is 168Hrs @30˚C or 60%RH. If unused LED remain, it should be stored in moisture proof packages JEDEC (MSL 3). 3.If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions: baking treatment: 60±5˚C for 24 hours.