MC34167_05 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Output Switch Current in Excess of 5.0 A
  • Fixed Frequency Oscillator (72 kHz) with On−Chip Timing
  • Provides 5.05 V Output without External Resistor Divider
  • Precision 2% Reference
  • 0% to 95% Output Duty Cycle
  • Cycle−by−Cycle Current Limiting
  • Undervoltage Lockout with Hysteresis
  • Internal Thermal Shutdown
  • Operation from 7.5 V to 40 V
  • Standby Mode Reduces Power Supply Current to 36 /C0109A
  • Economical 5−Lead TO−220 Package with Two Optional Leadforms
  • Also Available in Surface Mount D2PAK Package
  • Moisture Sensitivity Level (MSL) Equals 1
  • Pb−Free Packages are Available

Figure 1. Simplified Block Diagram This device contains 143 active transistors. dimensions section on page 17 of this data sheet.

ORDERING INFORMATION

TO−220 TV SUFFIX CASE 314B Heatsink surface connected to Pin 3 TO−220 T SUFFIX CASE 314D Pin 1. Voltage Feedback Input 2. Switch Output 3. Ground 4. Input Voltage/V CC 5. Compensation/Standby D2PAK D2T SUFFIX CASE 936A Heatsink surface (shown as terminal 6 in case outline drawing) is connected to Pin 3 x = 3 or 4 A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package MC 3x167T AWLYWWG http://onsemi.com MC 3x167T AWLYWWG MC 3x167T AWLYWWG MC 3x167T AWLYWWG

MC34167, MC33167 http://onsemi.com MAXIMUM RATINGS (Note 1 and 2) Rating Symbol Value Unit Power Supply Input Voltage VCC 40 V Switch Output Voltage Range VO(switch) −2.0 to + Vin V Voltage Feedback and Compensation Input Voltage Range VFB, VComp −1.0 to + 7.0 V Power Dissipation Case 314A, 314B and 314D (TA = +25°C) PD Internally Limited W Thermal Resistance, Junction−to−Ambient /C0113JA 65 °C/W Thermal Resistance, Junction−to−Case /C0113JC 5.0 °C/W Case 936A (D2PAK) (TA = +25°C) PD Internally Limited W Thermal Resistance, Junction−to−Ambient /C0113JA 70 °C/W Thermal Resistance, Junction−to−Case /C0113JC 5.0 °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature (Note 3) MC34167 MC33167 TA 0 to + 70 − 40 to + 85 Storage Temperature Range Tstg − 65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Maximum package power dissipation limits must be observed to prevent thermal shutdown activation. 2. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015. Machine Model Method 200 V. 3. T low =0 °C for MC34167 T high = + 70 °C for MC34167 =− 4 0 °C for MC33167 = + 85 °C for MC33167

MC34167, MC33167 http://onsemi.com ELECTRICAL CHARACTERISTICS (VCC = 12 V, for typical values TA = +25°C, for min/max values TA is the operating ambient temperature range that applies (Notes 4, 5), unless otherwise noted.) Characteristic Symbol Min Typ Max Unit OSCILLATOR Frequency (VCC = 7.5 V to 40 V) T A = +25°C TA = Tlow to Thigh fOSC 65 kHz ERROR AMPLIFIER Voltage Feedback Input Threshold T A =+ 25°C TA = Tlow to Thigh VFB(th) 4.95 4.85 5.05 5.15 5.20 V Line Regulation (VCC = 7.5 V to 40 V, TA = +25°C) Regline − 0.03 0.078 %/V Input Bias Current (VFB = VFB(th) + 0.15 V) IIB − 0.15 1.0 /C0109A Power Supply Rejection Ratio (VCC = 10 V to 20 V, f = 120 Hz) PSRR 60 80 − dB Output Voltage Swing High State (I Source = 75 /C0109A, VFB = 4.5 V) Low State (ISink = 0.4 mA, VFB = 5.5 V) VOH VOL 4.2 4.9 1.6 1.9 V PWM COMPARATOR Duty Cycle (VCC = 20 V) Maximum (V FB = 0 V) Minimum (VComp = 1.9 V) DC(max) DC(min) 100 SWITCH OUTPUT Output Voltage Source Saturation (VCC = 7.5 V, ISource = 5.0 A) Vsat − (VCC −1.5) (VCC −1.8) V Off−State Leakage (VCC = 40 V, Pin 2 = GND) Isw(off) − 0 100 /C0109A Current Limit Threshold (VCC = 7.5 V) Ipk(switch) 5.5 6.5 8.0 A Switching Times (VCC = 40 V, Ipk = 5.0 A, L = 225 /C0109H, TA = +25°C) Output Voltage Rise Time Output Voltage Fall Time tr tf 100 200 100 ns UNDERVOLTAGE LOCKOUT Startup Threshold (VCC Increasing, TA = +25°C) Vth(UVLO) 5.5 5.9 6.3 V Hysteresis (VCC Decreasing, TA = +25°C) VH(UVLO) 0.6 0.9 1.2 V TOTAL DEVICE Power Supply Current (TA = +25°C ) Standby (VCC = 12 V, VComp < 0.15 V) Operating (VCC = 40 V, Pin 1 = GND for maximum duty cycle) ICC 100 /C0109A mA 4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 5. T low =0 °C for MC34167 T high = + 70 °C for MC34167 =− 4 0 °C for MC33167 = + 85 °C for MC33167

Figure 2. Voltage Feedback Input Threshold Figure 3. Voltage Feedback Input Bias Figure 4. Error Amp Open Loop Gain and Figure 5. Error Amp Output Saturation Figure 6. Oscillator Frequency Change Figure 7. Switch Output Duty Cycle

10 M10

MC34167, MC33167 http://onsemi.com Switch Output The output transistor is designed to switch a maximum of 40 V , with a minimum peak collector current of 5.5 A. When configured for step−down or voltage−inverting applications, as in Figures 19 and 23, the inductor will forward bias the output rectifier when the switch turns off. Rectifiers with a high forward voltage drop or long turn on delay time should not be used. If the emitter is allowed to go sufficiently negative, collector current will flow, causing additional device heating and reduced conversion efficiency. Figure 9 shows that by clamping the emitter to 0.5 V , the collector current will be in the range of 100 /C0109A over temperature. A 1N5825 or equivalent Sc hottky barrier rectifier is recommended to fulfill these requirements. Undervoltage Lockout An Undervoltage Lockout comparator has been incorporated to guarantee that the integrated circuit is fully functional before the output st age is enabled. The internal reference voltage is monitore d by the comparator which enables the output stage when VCC exceeds 5.9 V . To prevent erratic output switching as the threshold is crossed, 0.9 V of hysteresis is provided. Thermal Protection Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170°C, the latch is forced into a ‘res et’ state, disabling the output switch. This feature is provi ded to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heatsinking. The MC34167 is contained in a 5−lead TO−220 type package. The tab of the package is common with the center pin (Pin 3) and is normally connected to ground. DESIGN CONSIDERATIONS Do not attempt to construct a converter on wire−wrap or plug−in prototype boards. Special care should be taken to separate ground paths from signal currents and ground paths from load currents. All high current loops should be kept as short as possible using heavy copper runs to minimize ringing and radiated EMI. For best operation, a tight component layout is recommended. Capacitors C in, CO, and all feedback components should be placed as close to the IC as physically possible. It is also imperative that the Schottky diode connected to the Switch Output be located as close to the IC as possible.

Figure 25. Triple Output Converter

12 V/250 mA

T1 = Primary: Coilcraft M1496−A or General Magnetics Technology GMT−0223, 42 turns of #16 AWG on Magnetics Inc. 58350−A2 core. Heatsink = AAVID Engineering Inc. 5903B, or 5930B. best auxiliary regulation, the auxiliary outputs should be less than 33% of the total output power.

115 VAC

T2 = Heatsink = AAVID Engineering Inc. accurate independently regulated outputs for a distributed power system. Figure 28. Off−Line Preconverter Figure 29. D2PAK Thermal Resistance and Maximum

Table 1. Design Equations

2 ILa v g /C0041/C0068IL

  1. V sat − Switch Output source saturation voltage, refer to Figure 8.
  2. V F − Output rectifier forward voltage drop. Typical value for 1N5822 Schottky barrier rectifier is 0.35 V.
  3. Duty cycle is calculated at the minimum operating input voltage and must not exceed the guaranteed minimum DC(max) specification of 0.92.

value, let /C0068IL = 2 (IL avg). This will proportionally reduce the converter’s output current capability. Desired peak−to−peak output ripple voltage. For best performance, the ripple voltage should be kept to less than 2% of V out. Capacitor CO should be a low equivalent series resistance (ESR) electrolytic designed for switching regulator applications.

MC34167, MC33167 http://onsemi.com Temperature Range Package Shipping† MC33167D2T TA= −40° to +85°C D2PAK (Surface Mount) 50 Units / Rail MC33167D2TG D2PAK (Surface Mount) (Pb−Free) 50 Units / Rail MC33167D2TR4 D2PAK (Surface Mount) 800 / Tape & Reel MC33167D2TR4G D2PAK (Surface Mount) (Pb−Free) 800 / Tape & Reel MC33167T TO−220 (Straight Lead) 50 Units / Rail MC33167TG TO−220 (Straight Lead) (Pb−Free) 50 Units / Rail MC33167TH TO−220 (Horizontal Mount) 50 Units / Rail MC33167THG TO−220 (Horizontal Mount) (Pb−Free) 50 Units / Rail MC33167TV TO−220 (Vertical Mount) 50 Units / Rail MC33167TVG TO−220 (Vertical Mount) (Pb−Free) 50 Units / Rail MC34167D2T TA= 0° to +70°C D2PAK (Surface Mount) 50 Units / Rail MC34167D2TG D2PAK (Surface Mount) (Pb−Free) 50 Units / Rail MC34167D2TR4 D2PAK (Surface Mount) 800 / Tape & Reel MC34167D2TR4G D2PAK (Surface Mount) (Pb−Free) 800 / Tape & Reel MC34167T TO−220 (Straight Lead) 50 Units / Rail MC34167TG TO−220 (Straight Lead) (Pb−Free) 50 Units / Rail MC34167TH TO−220 (Horizontal Mount) 50 Units / Rail MC34167THG TO−220 (Horizontal Mount) (Pb−Free) 50 Units / Rail MC34167TV TO−220 (Vertical Mount) 50 Units / Rail MC34167TVG TO−220 (Vertical Mount) (Pb−Free) 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

MC34167, MC33167 http://onsemi.com PACKAGE DIMENSIONS TO−220 TH SUFFIX CASE 314A−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. DIM A MIN MAX MIN MAX MILLIMETERS 0.572 0.613 14.529 15.570 INCHES B 0.390 0.415 9.906 10.541 C 0.170 0.180 4.318 4.572 D 0.025 0.038 0.635 0.965 E 0.048 0.055 1.219 1.397 F 0.570 0.585 14.478 14.859 G 0.067 BSC 1.702 BSC J 0.015 0.025 0.381 0.635 K 0.730 0.745 18.542 18.923 L 0.320 0.365 8.128 9.271 Q 0.140 0.153 3.556 3.886 S 0.210 0.260 5.334 6.604 U 0.468 0.505 11.888 12.827 −T− SEATING PLANE L S E C F K J OPTIONAL CHAMFER D5X MPM0.014 (0.356) T G AU B Q −P− TO−220 TV SUFFIX CASE 314B−05 ISSUE L V Q K F U A B G −P− M0.10 (0.254) P MT 5X J M0.24 (0.610) T OPTIONAL CHAMFER S L W E C H N −T− SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.572 0.613 14.529 15.570 B 0.390 0.415 9.906 10.541 C 0.170 0.180 4.318 4.572 D 0.025 0.038 0.635 0.965 E 0.048 0.055 1.219 1.397 F 0.850 0.935 21.590 23.749 G 0.067 BSC 1.702 BSC H 0.166 BSC 4.216 BSC J 0.015 0.025 0.381 0.635 K 0.900 1.100 22.860 27.940 L 0.320 0.365 8.128 9.271 N 0.320 BSC 8.128 BSC Q 0.140 0.153 3.556 3.886 U 0.468 0.505 11.888 12.827 W 0.090 0.110 2.286 2.794 5X D

MC34167, MC33167 http://onsemi.com PACKAGE DIMENSIONS TO−220 T SUFFIX CASE 314D−04 ISSUE F −Q− 12345 U K D G A 5 PL J H L E C MQM0.356 (0.014) T SEATING PLANE−T− DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.572 0.613 14.529 15.570 B 0.390 0.415 9.906 10.541 C 0.170 0.180 4.318 4.572 D 0.025 0.038 0.635 0.965 E 0.048 0.055 1.219 1.397 G 0.067 BSC 1.702 BSC H 0.087 0.112 2.210 2.845 J 0.015 0.025 0.381 0.635 K 0.977 1.045 24.810 26.543 L 0.320 0.365 8.128 9.271 Q 0.140 0.153 3.556 3.886 U 0.105 0.117 2.667 2.972 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. B1 0.375 0.415 9.525 10.541 B DETAIL A−A B DETAIL A−A

MC34167, MC33167 http://onsemi.com D2PAK D2T SUFFIX CASE 936A−02 ISSUE C *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*

5 REF

A 12 3 K B S H D G C E M L PN R V U TERMINAL 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. DIM A MIN MAX MIN MAX MILLIMETERS 0.386 0.403 9.804 10.236 INCHES B 0.356 0.368 9.042 9.347 C 0.170 0.180 4.318 4.572 D 0.026 0.036 0.660 0.914 E 0.045 0.055 1.143 1.397 G 0.067 BSC 1.702 BSC H 0.539 0.579 13.691 14.707 K 0.050 REF 1.270 REF L 0.000 0.010 0.000 0.254 M 0.088 0.102 2.235 2.591 N 0.018 0.026 0.457 0.660 P 0.058 0.078 1.473 1.981 R 5 REF S 0.116 REF 2.946 REF U 0.200 MIN 5.080 MIN V 0.250 MIN 6.350 MIN /C0095/C0095 M0.010 (0.254) T −T− OPTIONAL CHAMFER 8.38 0.33 1.016 0.04 16.02 0.63 10.66 0.42 3.05 0.12 1.702 0.067 SCALE 3:1 /C0466mm inches/C0467 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 MC34167/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.