MC33661 MOTOROLA | Alldatasheet
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Features
Operational from V SUP 6.0 V to 18 V DC, Functional up to 27 V DC, and Handles 40 V During Load Dump Active Bus Waveshaping Offering Excellent Radiated Emission Performance 5.0 kV ESD on LIN Bus Terminal 3 0 k Ω Internal Pullup Resistor LIN Bus Short-to-Ground or High Leakage in Sleep Mode -18 V to +40 V DC Voltage at LIN Terminal 8 . 0 µA Standby Current in Sleep Mode Local and Remote Wake-Up Capability Reported by INH and RXD Terminals 5.0 V and 3.3 V Compatible Digital Inputs Without Any External Components Required LIN INTERFACE
ORDERING INFORMATION
Range (TA) Package MC33661D/R2 -40°C to 125°C 8 SOICN D SUFFIX CASE 751-06 8-TERMINAL SOICN
33661 Simplified Application Diagram
iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
33661 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
Figure 1. 33661 Simplified Internal Block Diagram Freescale Semiconductor, Inc.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33661 TERMINAL DEFINITIONS A functional description of each terminal can be found in the System/Application Information section beginning on page 13. Terminal Terminal Name Formal Name Definition 1 RXD Receiver Output MCU interface that reports the state of the LIN bus voltage. 2 EN Enable Control Controls the operation mode of the interface. 3 WAKE Wake Input A high-voltage input used to wake up the device from sleep mode. 4 TXD Transmitter Input MCU interface to control the state of the LIN output. 5 INH Inhibit Output This terminal can have two main functions: controlling an external switchable voltage regulator or driving a bus external resistor in the master node application. 6 VSUP Power Supply Device power supply terminal. 7 LIN LIN Bus Represents the single-wire bus transmitter and receiver. 8 GND Ground Device ground terminal. 4 5 8RXD EN WAKE TXD INH V SUP LIN GND Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage Continuous Supply Voltage Transient Voltage (Load Dump) VSUP V WAKE DC and Transient Voltage (Through a 33 kΩ Serial Resistor) VWAKE -18 to 40 V Logic Terminals (RXD, TXD, EN) VLOG -0.3 to 5.5 V LIN DC Voltage Transient (Coupled Through 1.0 nF Capacitor) VBUS -18 to 40 -150 to 100 V INH DC Voltage DC Current VINH IINH -0.3 to VSUP + 0.3 V mA ESD Human Body Model (Note 1) All Terminals LIN Terminal with Respect to Ground VESD1 ±2000 ±5000 V ESD Machine Model (Note 2) All Terminals VESD2 ±200 V THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 Storage Temperature TS -40 to 150 °C Thermal Resistance Junction to Ambient RθJA 150 °C/W Peak Package Reflow Temperature During Solder Mounting (Note 3) TSOLDER 240 °C Thermal Shutdown TSHUT 150 to 200 °C Thermal Shutdown Hysteresis THYST 8.0 to 20 °C Notes 1. ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, RZAP = 1500 Ω). 2. ESD2 testing is performed in ac cordance with the Machine Model (CZAP = 220 pF, RZAP =0 Ω). 3. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33661 STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 7.0 V≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit VSUP TERMINAL (DEVICE POWER SUPPLY) Nominal DC Voltage VSUP 7.0 13.5 18.0 V Functional DC Voltage TA ≥ 25°C VSUP 6.0 V Supply Current in Sleep Mode VSUP ≤ 13.5 V, Bus Recessive
13.5 V < VSUP < 18 V
VSUP ≤ 13.5 V, Bus Dominant or Shorted to GND IS1 IS2 IS3 8.0 300 200 µA Supply Current in Normal, Slow or Fast Mode Bus Recessive, Excluding INH Output Current Bus Dominant, Total Bus Load >500 Ω, Excluding INH Output Current IS(N-REC) IS(N-DOM) 4.0 6.0 6.0 8.0 mA RXD OUTPUT TERMINAL (LOGIC) Low-Level Voltage Output IIN ≤ 1.5 mA VOL 0 0.9 V High-Level Voltage Output VEN = 5.0 V, IOUT ≤ 250 µA VEN = 3.3 V, IOUT ≤ 250 µA VOH 4.25 3.0 5.25 3.5 V TXD INPUT TERMINAL (LOGIC) Low-Level Voltage Input VIL 1.2 V High-Level Voltage Input VIH 2.5 V Input Threshold Hysteresis VINHYST 100 300 800 mV Pullup Current Source VEN = 5 . 0V , 1 . 0V < VTXD < 3.5 V IS1 -60 -35 -20 µA ENABLE INPUT TERMINAL (LOGIC) Low-Level Voltage Input VIL 1.2 V High-Level Voltage Input VIH 2.5 V Input Threshold Hysteresis VINHYST 100 300 800 mV Low-Level Input Current VIN = 1.0 V IIL 5.0 20 30 µA High-Level Input Current VIN = 4.0 V IIH 20 40 µA LIN BUS TERMINAL (VOLTAGE EXPRESSED VERSUS VSUP VOLTAGE) Low-Level Dominant Voltage External Bus Pullup 500 Ω VLINlow 1.4 V High-Level Voltage TXD High, IOUT = 1.0 µA, Recessive State VLINhigh VSUP - 1.0 V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
LIN BUS TERMINAL (VOLTAGE EXPRESSED VERSUS VSUP VOLTAGE) (continued) Pullup Resistor to VSUP (Normal Mode) RPU 20 30 47 kΩ Pullup Current Source (Sleep Mode) IPU 20 µA Overcurrent Shutdown Threshold IOV-CUR 50 75 150 mA Overcurrent Shutdown Delay (Note 4) IOV-DELAY 10 µs Leakage Current to GND Recessive State, 8.0 V ≤ VSUP ≤ 18 V, 8.0 V ≤ VLIN ≤ 18 V IBUS-PAS-REC 0 3.0 20 µA GND Disconnected VGND = VSUP, VLIN at -18 V IBUS no GND -1.0 1.0 mA Leakage Current to GND VSUP Disconnected, VLIN at +18 V IBUS 1.0 10 µA LIN Receiver VIL TXD High, RXD Low VLIN-VIL 0 0.4 VSUP V LIN Receiver VIH TXD High, RXD High VLIN-VIH
0.6 VSUP VSUP
V LIN Receiver Threshold Center (VLIN-VIH - VLIN-VIL)/2 VLINTHRES 0.475 0.5 0.525 VSUP LIN Receiver Input Hysteresis VLIN-VIH - VLIN-VIL VLINHYST 0.175 VSUP LIN Wake-Up Threshold VLINWU 0.5 VSUP INHIBIT OUTPUT TERMINAL INH Driver ON Resistance (Normal Mode) INHON 35 70 Ω Leakage Current (Sleep Mode) 0 < VINH < VSUP ILEAK 0 5.0 µA WAKE TERMINAL Typical Wake-Up Threshold (EN = 0 V, 7.0 V ≤ VSUP ≤ 18 V) (Note 5) HIGH-to-LOW Transition LOW-to-HIGH Transition VWUTHRESHL VWUTHRESLH
0.3 VSUP
0.4 VSUP
0.43 VSUP
0.55 VSUP
0.65 VSUP
V Wake-Up Threshold Hysteresis VWUHYST 0.1 VSUP 0.16 VSUP 0.2 VSUP V WAKE Input Current V < 27 V IWIN1 1.0 5.0 µA Notes 4. This parameter is guaranteed by desi gn; however, it is not production tested. 5. When V SUP > 18 V, the wake-up thresholds remain identical to the wake-up thresholds at 18 V. STATIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions 7.0 V≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33661 DYNAMIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 7.0 V≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit LIN OUTPUT TIMING CHARACTERISTICS FOR NORMAL SLEW RATE Dominant Propagation Delay TXD to LIN (Note 6) Measurement Threshold (50% TXD to 58.1% VSUP) Measurement Threshold (50% TXD to 28.4% VSUP) tDOM(MIN) tDOM(MAX) µs Recessive Propagation Delay TXD to LIN (Note 6) Measurement Threshold (50% TXD to 42.2% VSUP) Measurement Threshold (50% TXD to 74.4% VSUP) tREC(MIN) tREC(MAX) µs Propagation Delay Symmetry tDOM(MIN) to tREC(MAX) tDOM(MAX) to tREC(MIN) dt1 dt2 -10.44 -10.44 8.12 8.12 µs LIN OUTPUT TIMING CHARACTERISTICS FOR SLOW SLEW RATE Dominant Propagation Delay TXD to LIN (Note 6) Measurement Threshold (50% TXD to 61.6% VSUP) Measurement Threshold (50% TXD to 25.1% VSUP) tDOM(MIN) tDOM(MAX) 100 100 µs Recessive Propagation Delay TXD to LIN (Note 6) Measurement Threshold (50% TXD to 38.9% VSUP) Measurement Threshold (50% TXD to 77.8% VSUP) tREC(MIN) tREC(MAX) 100 100 µs Propagation Delay Symmetry tDOM(MIN) to tREC(MAX) tDOM(MAX) to tREC(MIN) dt1S dt2S -21.88 -21.88 17.44 17.44 µs LIN OUTPUT DRIVER FAST SLEW RATE LIN Fast Slew Rate (Programming Mode) Fast Slew Rate dv/dt fast 15 V/µs LIN RECEIVER CHARACTERISTICS Receiver Dominant Propagation Delay (Note 7) LIN LOW to RXD LOW tRL 3.5 6.0 µs Receiver Recessive Propagation Delay (Note 7) LIN HIGH to RXD HIGH tRH 3.5 6.0 µs Receiver Propagation Delay Symmetry tRL - tRH tR-SYM -2.0 2.0 µs Notes 7. Measured between LIN signal threshold LIN-V IL or LIN-V IH and 50% of RXD signal. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
DYNAMIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions 7.0 V≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit SLEEP MODE AND WAKE-UP TIMINGS LIN Terminal Wake-Up Filter Time (LIN Bus Wake-Up) tWUF 40 70 120 µs EN Terminal Wake-Up Time tLWUE 5.0 15 µs WAKE Terminal Filter Time tWF 10 70 µs Sleep Mode Delay EN HIGH to LOW tSD 40 µs Delay Between EN and TXD for Mode Selection (Note 8) tD_MS 5.0 µs Delay Between First TXD after Device Mode Selection (Note 8) tD_COM 50 µs Notes 8. This parameter is guaranteed by design; however, it is not production tested. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
Figure 5. EN Terminal Wake-Up and Figure 6. WAKE Terminal Wake-Up and Figure 7. LIN Bus Wake-Up and Figure 8. EN Terminal Wake-Up and Figure 9. WAKE Terminal Wake-Up and Figure 10. LIN Bus Wake-Up and Freescale Semiconductor, Inc.
Figure 13. Mode Transitions Table 1. Explanation of Mode Transitions Note See Table 1 for explanation of mode transitions. Sleep Recessive state, driver off. 20 µA pullup current source. Awake Recessive state, driver off. LOW transition reports wake-up. Normal Driver active. 30 kΩ pullup active. Recessive state. Driver off. Slow Driver active. 30 kΩ pullup active. Fast Driver active. 30 kΩ pullup active. Slew rate slow (> 100 kbps). Freescale Semiconductor, Inc.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33661 SYSTEM/APPLICATION INFORMATION INTRODUCTION The 33661 is a Physical Layer component dedicated to automotive LIN sub-bus applications. The 33661 features include slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate for test and programming modes, excellent radiated emission performance, and safe behavior in case of LIN bus short-to-ground or LIN bus leakage during low power mode. Digital inputs are 5.0 V and 3.3 V compatible without any external component required. The INH output may be used to control an external voltage regulator or to drive a LIN bus pullup resistor. FUNCTIONAL TERMINAL DESCRIPTION VSUP Supply Terminal The VSUP supply terminal is the power supply terminal for the 33661. LIN Bus Terminal This I/O terminal represents the single-wire bus transmitter and receiver. TXD Input Terminal The TXD input terminal is the MCU interface to control the state of the LIN output. When TXD is LOW, LIN output is LOW; when TXD is HIGH, the LIN output transistor is turned OFF. The threshold is 3.3 V and 5.0 V compatible. The baud rate selection (normal or slow mode) is done at device wake-up by the state of the TXD terminal prior to a HIGH level at the EN terminal (see Figures 5 through 10, page 10). RXD Output Terminal The RXD output terminal is the MCU interface, which reports the state of the LIN bus voltage. LIN HIGH (recessive) is reported by a high voltage on RXD; LIN LOW (dominant) is reported by a low voltage on RXD. The RXD output structure is a CMOS-type push-pull output stage. The low level is fixed. The high level is dependant on the EN voltage. If EN is set at 3.3 V, RXD VOH is 3.3 V. If EN is set at 5.0 V, RXD VOH is 5.0 V. In the sleep mode, RXD is high impedance. When a wake-up event is recognized from WAKE terminal or from the LIN bus terminal, RXD is pulled LOW to report the wake-up event. An external pullup resistor may be needed. EN Input Terminal The EN input terminal controls the operation mode of the interface. If EN = 1, the interface is in normal mode, with transmission path from TXD to LIN and from LIN to RXD both active. The threshold is 3.3 V and 5.0 V compatible. The high level at EN defines the VOH at RXD. The sleep mode is entered by setting EN LOW while TXD is HIGH. Sleep mode is active after the t1 filter time (see Figure 12, page 11). INH Output Terminal The INH output terminal may have two main functions. It may be used to control an external switchable voltage regulator having an inhibit input. The high drive capability also allows it to drive the bus external resistor in the master node application. This is illustrated in Figures 16 and 17, page 17. In sleep mode, INH is turned OFF. If a voltage regulator inhibit input is connected to INH, the regulator will be disabled. If the master node pullup resistor is connected to INH, the pullup resistor will be disabled from the LIN bus. WAKE Input Terminal The WAKE terminal is a high-voltage input used to wake up the device from the sleep mode. WAKE is usually connected to an external switch in the application. The typical wake thresholds are VSUP/2. The WAKE terminal has a special design structure and allows wake-up from both HIGH-to-LOW or LOW-to-HIGH transitions. When entering into sleep mode, the LIN monitors the state of the WAKE terminal and stores it as a reference state. The opposite state of this reference state will be the wake-up event used by the device to enter again into normal mode. An internal filter is implemented (40 µs typical filtering time delay). WAKE terminal input structure exhibits a high impedance, with extremely low input current when voltage at this terminal is below 14 V. When voltage at the WAKE terminal exceeds 14 V, input current starts to sink into the device. A serial resistor should be inserted in order to limit the input current mainly during transient pulses. Recommended resistor value is 33 kΩ. Important The WAKE terminal should not be left open. If the wake-up function is not used, WAKE should be connected to ground to avoid false wake-up. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
The 33661 has two communication modes, transmitting and receiving modes, and two operational modes, normal and sleep. The normal mode is differentiated by the slew rate normal, slow, or fastof the LIN output. Operational Modes Normal Mode In the normal mode, the 33661 has slew rate and timing compatible with the LIN protocol specification and can operate at 20 kbps. This mode is selected after sleep mode by setting the TXD terminal HIGH prior to setting EN from LOW to HIGH. Once normal mode is selected, it is impossible to select the slow mode unless the 33661 is set to sleep mode. Slow Mode In the slow mode, the slew rate is around half the normal slew rate, and bus speed operation is limited up to 10 kbps. The radiated emission is significantly reduced compared to the already excellent emission level of the normal mode. Slow mode is entered after sleep mode by setting the TXD terminal LOW prior to setting EN from LOW to HIGH. Once the slow mode is selected, it is impossible to select the normal mode unless the device is set to sleep mode. Fast Mode In the fast mode, the slew rate is around 10 times faster than the normal mode. This allows very fast data transmission (>100 kbps)for instance, for ECU tests and microcontroller program download. The bus pullup resistor might be reduced to ensure a correct RC time constant in line with the high baud rate used. Fast mode is entered via a special sequence (call toggle function) at the TXD and EN terminals described in Figure 11 on page 11. Fast mode can be selected from either normal or slow mode. Once in fast mode, the toggle function will bring the device back in the previously selected mode (normal or slow). A glitch on EN will also reset the device to the previously selected mode (normal or slow) as shown in Figure 11 on page 11. Sleep Mode In the sleep mode, the transmission path is disabled and the 33661 is in low power mode. Supply current from VSUP is very low. Wake-up can occur from LIN bus activity from node internal wake-up through the EN terminal and from the WAKE input terminal. In the sleep mode, the 33661 has an internal 20 µA pullup source to VSUP. This avoids the high current path from the battery to ground in the event the bus is shorted to ground. (Refer to succeeding paragraphs describing wake-up behavior.) Device Wake-Up Events The 33661 can be awakened from sleep mode by three wake-up events: remote wake-up via LIN bus activity, internal node wake-up via the EN terminal, or toggling the WAKE terminal. Remote Wake from LIN Bus The LIN bus wake-up is recognized by a recessive-to- dominant transition, followed by a dominant level with a duration greater than 70 µs, followed by a dominant-to- recessive transition. This is illustrated in Figures 7 and 10 on page 10. Once the wake-up is detected, the 33661 enters the awake mode, with INH HIGH and RXD pulled LOW. Wake-Up from Internal Node Activity The 33661 can wake up by internal node activity through a LOW-to-HIGH transition of the EN terminal. When EN is switched from LOW to HIGH, the device is awakened and enters either the normal or the wait slow mode depending on the level of TXD input. The MCU must set the TXD terminal LOW or HIGH prior to waking up the device through the EN terminal. Wake-Up from WAKE Terminal If the WAKE input terminal is toggled, the 33661 enters the awake mode, with INH HIGH and RXD pulled LOW. Device Power-Up At power-up (VSUP rises from zero), the 33661 automatically switches in the awake mode. It switches the INH terminal to HIGH state and RXD to LOW state. The MCU of the application will then confirm normal or slow mode by setting the TXD and EN terminals appropriately. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
APPLICATIONS
Motorola Device Compatibility: 33661 and 33399 The two Motorola devices are terminal-to-terminal compatible. Table 2 summarizes the differences between the two devices. Table 2. Compatibility Comparison 8-terminal SOICN. 8-terminal SOICN. 1 baud rate operation from 1.0 to 20 kbps. Controlling an external switchable voltage regulator. Driving a bus master termination resistor. WAKE Terminal Identical to 33399. Identical to 33661. and bus short-to-ground, 20 µA pullup. 30 kΩ pullup in normal and sleep modes. Sleep Current Typical 8.0 µA. Typical 20 µA, maximum 50 µA. Mode Normal, slow, fast, and sl eep modes. Normal and sleep modes. Normal Mode Selected by TXD HIGH, then EN HIGH at device wake-up. Selected by TXD high and EN high at device wake-up. Slow Mode Selected by TXD LOW, then EN HIGH at device wake-up. Dominant level, 50 µs duration. Freescale Semiconductor, Inc.
L h X 45˚ θ C SEATING PLANE SBM0.25 A SC BA1 C A 0.10 MBM0.25 D E H A B e DIM MIN MAX MILLIMETERS A 1.35 1.75 A1 0.10 0.25 B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00 H 5.80 6.20 h 0˚ 7˚ L 0.40 1.25 θ 0.25 0.50 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOT AL IN EXCESS OF THE B DIMENSION A T MAXIMUM MA TERIAL CONDITION. D SUFFIX 8-TERMINAL SOIC NARROW BODY PLASTIC PACKAGE CASE 751-06 ISSUE T Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33661 NOTES Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...
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