33390

MC33390 MOTOROLA | Alldatasheet

Document overview

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Technical content

Features

• Designed for SAE J-1850 Class B Data Rates
• Full Operational Bus Dynamics Over a Supply Voltage of 9.0 to 16 V
• Ambient Operating Temperature of -40 °C to 125°C
• Interfaces Directly to Standard 5.0 V CMOS Microcontroller
• BUS Pin Protected Against Shorts to Battery and Ground
• Thermal Shutdown with Hysteresis
• Voltage Waveshaping of Bus Output Driver
• 40 V Max V BAT Capability J-1850 SERIAL TRANSCEIVER

ORDERING INFORMATION

Range (TA) Package MC33390D/DR2 -40 to 125°C 8 SOICN D SUFFIX PLASTIC PACKAGE CASE 751 (8-LEAD SOICN) 33390 BUS VBAT SLEEP Tx Rx 4X/LOOP GND LOAD Primary Node MCU VBAT Secondary Nodes 10.6 kΩ 470 pF 47 µH Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

33390 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

Figure 1. 33390 Simplified Block Diagram Note This device contains approximately 400 active transistors and 250 gates. Freescale Semiconductor, Inc.

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 SLEEP Enables the transceiver when Logic 1 and disables the transceiver when Logic 0. 2 GND Device ground pin. 3 LOAD Accommodates an external pull-down resistor to ground to provide loss of ground protection. 4 BUS Waveshaped SAE Standard J-1850 Class B transmitter output and receiver input. 5 VBAT Provides device operating input power. 6 4X/LOOP Tristate input mode control; Logic 0 = normal waveshaping, Logic 1 = waveshaping disabled for 4X transmitting, high impedance = loopback mode. 7 Tx Serial data input (DI) from the microcontroller to be transmitted onto Bus. 8 Rx Bus received serial data output (DO) sent to the microcontroller. Rx Tx VBAT 4X/LOOP SLEEP GND LOAD BUS Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit VBAT DC Supply Voltage (Note 1) VBAT -0.3 to 40 V Input I/O Terminals (Note 2) VI/O(CPU) -0.3 to 7.0 V BUS and LOAD Outputs VBUS -2.0 to 16 V ESD Voltage Human Body Model (Note 3) Machine Model (Note 4) VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -65 to 150 °C Operating Ambient Temperature TA -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Soldering Temperature (for 10 seconds) TSOLDER 260 °C Thermal Resistance (Junction-to-Ambient) RθJ-A 180 °C/W Notes 1. An external series diode must be used to pr ovide reverse battery protection of the device. 2. SLEEP, TX, RX, and 4X/LOOP are normally connected to a microcontroller. 3. ESD1 testing is performed in accordance with the Human Body Model (C ZAP=100 pF, RZAP=1500 Ω). 4. ESD2 testing is performed in ac cordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions of 7.0 V≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic Symbol Min Typ Max Unit POWER CONSUMPTION Operational Battery Current (RMS with Tx = 7.812 kHz Square Wave) BUS Load = 1380 Ω to GND, 3.6 nF to GND BUS Load = 257 Ω to GND, 20.2 nF to GND IBAT(OP1) IBAT(OP2) 3.0 22.4 11.5 mA Battery Bus Low Input Current After SLEEP Toggle Low to High; Prior to Tx Toggling After Tx Toggle High to Low IBAT(BUS L1) IBAT(BUS L2) 1.1 6.4 3.0 8.5 mA Sleep State Battery Current VSLEEP = 0 V IBAT(SLEEP) –3 8 . 2 6 5 µA BUS BUS Input Receiver Threshold (Note 5) Threshold High (Bus Increasing until Rx ≥ 3.0 V) Threshold Low (Bus Decreasing until Rx ≤ 3.0 V) Threshold in Sleep State (SLEEP = 0 V) Hysteresis (VBUS(IH) -V BUS(IL), SLEEP = 0 V) VBUS(IH) VBUS(IL) BUSTH(SLEEP) VBUS(HYST) 4.25 2.4 0.1 3.9 3.7 3.0 0.2 3.5 3.4 0.6 V BUS-Out Voltage (257 Ω ≤ RBUS(L) to GND ≤ 1380 Ω) 8.2 V ≤ VBAT ≤ 16 V, Tx = 5.0 V 4.25 V ≤ VBAT ≤ 8.2 V, Tx = 5.0 V Tx = 0 V VBUS(OUT1) VBUS(OUT2) VBUS(OUT3) 6.25 VBAT - 1.6 6.9 0.27 8.0 VBAT 0.7 V BUS Short Circuit Output Current Tx = 5.0 V, -2.0 V ≤ VBUS ≤ 4.8 V IBUS(SHORT) 60 129 170 mA BUS Leakage Current -2.0 V ≤ VBUS ≤ 0V

0 V ≤ VBUS ≤ VBAT

IBUS(LEAK1) IBUS(LEAK2) -500 -55 189 500 µA BUS Thermal Shutdown (Note 6) (Tx = 5.0 V, IBUS = -0.1 mA) Increase Temperature until VBUS ≤ 2.5 V TBUS(LIM) 150 170 190 BUS Thermal Shutdown Hysteresis (Note 7) TBUS(LIM) - TBUS(REEN) TBUS(LIMHYS) 10 12 15 BUS and LOAD Current with Loss of VBAT or GND (IBAT = 0 µA) (see Figure 2) -18 V ≤ VBUS ≤ 9.0 V -18 V ≤ VLOAD ≤ 9.0 V IBUS (LOSS) ILOAD (LOSS) 0.00 0.00 0.1 0.1 mA Notes 5. Typical threshold value is the approximate ac tual occurring switch point value with VBAT = 13 V, TA = 25°C. 6. Device characterized but not production tested for thermal shutdown. 7. Device characterized but not production tested for thermal shutdown hysteresis. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

STATIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions of 7.0 V≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic Symbol Min Typ Max Unit BUS (continued) LOAD Output IL = 6.0 mA LON – 0.07 0.2 V Unpowered LOAD Output VBAT = 0 V, IL = 6.0 mA LDIO 0.3 0.56 0.9 V Tx Tx Input Voltage Tx Input Logic Low Level Tx Input Logic High Level VTx(IL) VTx(IH) 3.5 0.8 V Tx Input Current VTx = 5.0 V VTx = 0 V ITx(IH) ITx(IL) -2.0 106 0.23 200 2.0 µA LOOP 4X/LOOP Input Current V4X/LOOP = 0 V (Normal Mode) V4X/LOOP = 5.0 V (4X Mode) I4X/LOOP(IL) I4X/LOOP(IH) -200 -200 -60 110 200 200 µA 4X/LOOP Input Threshold (Tx = 4096 Hz Square Wave) Normal Mode to Loopback Mode Loopback Mode to 4X Mode V4X/LOOP(IL) V4X/LOOP(IH) 1.1 3.2 1.31 3.43 1.5 3.6 V Rx Rx Output Voltage Low VBUS = 0 V, IRx = 1.6 mA VRx(LOW) 0.01 0.18 0.4 V Rx Output Voltage High VBUS = 7.0 V, IRx = -200 µA VRx(HIGH) 4.25 4.58 4.75 V Rx Output Current VRx = High; Short Circuit Protection Limits IRx 2.0 3.67 8.0 mA SLEEP SLEEP Input Current VSLEEP = 0 V VSLEEP = 5.0 V ISLEEP(IL) ISLEEP(IH) 1.0 -0.23 6.21 -2.0 µA Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 DYNAMIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions of 7.0 V≤ VBAT ≤ 16 V, -40°C ≤ TA ≤ 125°C, SLEEP = 5.0 V unless otherwise noted. Typical values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the pin. All negative currents are out of the pin. Characteristic Symbol Min Typ Max Unit BUS BUS Voltage Rise Time (Note 8) (9.0 V ≤ VBAT ≤ 16 V, Tx = 7.812 kHz Square Wave) (see Figure 3) BUS Load = 3,300 pF and 1.38 kΩ to GND BUS Load = 16,500 pF and 300 Ω to GND trise(BUS) 9.0 9.0 11.15 11.86 µs BUS Voltage Fall Time (Note 8) (9.0 V ≤ VBAT ≤ 16 V, Tx = 7.812 kHz Square Wave) (see Figure 3) BUS Load = 3,300 pF and 1.38 kΩ to GND BUS Load = 16,500 pF and 300 Ω to GND tfall(BUS) 9.0 9.0 10.50 11.17 µs Pulse Width Distortion Time (9.0 V ≤ VBAT ≤ 16 V, Tx = 7.812 kHz Square Wave) (see Figure 4) BUS Load = 3,300 pF and 1.38 kΩ to GND tpwd(BUS) 35 62 93 µs Propagation Delay Tx Threshold to Rx Threshold tpd(BUS) – 17.7 25 µs Tx Tx to BUS Delay Time (Tx = 2.5 V to VBUS = 3.875 V) (see Figure 5) 4X Mode Normal Mode tTxDelay 2.6 17.3 4.0 µs SLEEP to Tx Setup Time (see Figure 5) tSLEEPTxSU 80 40 – µs Rx Rx Output Delay Time (Tx = 2.5 V to VBUS = 3.875 V) (see Figure 6) Low-to-Output High High-to-Output Low tRxDelay/L–H tRxDelay/H–L 0.11 0.38 2.0 2.0 µs Rx Output Transition Time (CRx = 50 pF to GND, 10% and 90% Points) (see Figure 7) Low-to-Output High High-to-Output Low tRxTrans/L–H tRxTrans/H–L 0.34 0.08 1.0 1.0 µs Rx Output Transition Time (Note 9) (CRx = 50 pF to GND, SLEEP = 0 V, 10% and 90% Points) (see Figure 7) Low-to-Output High High-to-Output Low tRxTrans/L–H tRxTrans/H–L 0.32 0.08 5.0 5.0 µs Notes 8. Typical is the parameter's approximate average value with VBAT = 13 V, TA = 25°C. 9. Rx Output Transition Time from a sleep state. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 2. Loss of Ground or VBAT Test Circuit Figure 3. BUS Rise and Fall Times Figure 4. Pulse Width Distortion Figure 5. SLEEP to Tx Delay Times Figure 6. BUS-to-Rx Delay Time Figure 7. Rx Rise and Fall Time

1.5 V tpwd(max)

3.875 VtTxDelay

Freescale Semiconductor, Inc.

internal block diagram of the device is shown in Figure 1. plastic package makes the device a cost-effective solution. will remain fully operational with a minimum of 9.0 V on this pin. must be placed in series with this pin to protect the IC. establish the Rx output level and slew rate times. potentials that are ±2.0 V relative to the control assembly. exists. The 33390 is a secondary node on the Class B bus. given by the expressions shown in Table 1, page 10. Figure 8. Minimum Bus Load Figure 9. Maximum Number of Nodes Figure 10. Maximum Bus Load

24 Secondary Nodes

31 Secondary Nodes

Freescale Semiconductor, Inc.

APPLICATIONS

Transmitter Data from the MCU (Tx) The Tx input is a push-pull (N-channel/P-channel FETs) buffer with hysteresis for noise immunity purposes. This pin is a

5.0 V CMOS logic level input from the MCU following a true

logic protocol. A logic [0] input drives the BUS output to 0 V (via the external pull-down resistor to ground on each node), while a logic [1] input produces a high voltage at the BUS output. A logic [0] input level is guaranteed when the Tx input pin is open- circuited by virtue of an internal 40 kΩ pull-down resistor. No external resistor is required for its operation. Waveshaping and 4X/Loop This input is a tristateable input: 0 V = normal waveshaping,

5.0 V = waveshaping is disabled for 4X transmitting, and high

impedance = loopback mode of operation. This is a logic level input used to select whether waveshaping for the Class B output is enabled or disabled. A logic [0] enables waveshaping, while a logic [1] disables waveshaping. In the 4X mode, the BUS output rise time is less than 2.0µs and the fall time is less than 5.0 µs (owing to the external RC pull-down to ground). In the loopback condition, the Tx signal is fed back to the Rx output after waveshaping without being transmitted onto the BUS. This mode of operation is useful for system diagnostic purposes. Class B Module Outputs Transceiver Output (BUS) This is the output driver stage that sources current to the bus. Its output follows the waveshaped waveform input. Its output voltage is limited to 6.25 V to 8.0 V under normal battery level conditions. The limited level is controlled by an internal regulator/clamp circuit. Once the battery voltage drops below

9.0 V, the regulator/clamp circuit saturates, causing the bus

voltage to track the battery voltage. A 1.5 kΩ ±5% external resistor (as well as any 10.6 kΩ pull-down resistors of any secondary nodes) sinks the current to discharge the capacitors during high-to-low transitions. This sourcing output is short circuit-protected (60 mA to 170 mA) against a short to -2.0 V and sinks less than 1.0 mA when shorted to VBAT. If a short occurs, the overtemperature shutdown circuit protects the source driver of the device. In the event battery power is lost to the assembly, the bus transmitter's output stage will be disabled and the leakage current from the BUS output will not source or sink more than 100 µA of current. The transceiver will operate with a remote ground offset of ±2.0 V, but the lower corners of transmission will not be rounded during this condition. Receiver Output to the Microcontroller (Rx) This is a 5.0 V CMOS compatible push-pull output used to send received data to the microcontroller. It does not require an external pull-up resistor to be used. The receiver is always enabled and draws less than 65 µA of current from VBAT. The receive threshold is dependent on the state of the SLEEP pin. The receiver circuitry is able to operate with VBAT voltages as low as 4.25 V and still remains capable of “waking up” the 33390 when remote Class B activity is detected. When the SLEEP pin is 0 V and message activity occurs on the bus, the receiver passes the bus message through to the microcontroller. The 33390 does not automatically “wake up” from a sleep state when bus activity occurs: the microcontroller must tell it to do so. In the Static Electrical Characteristics table, the maximum voltage for Rx is specified as 4.75 V over an operating range of -40°C to 125°C temperature and 7.0 V to 16 V VBAT. This maximum Rx voltage is compatible with the minimum VDD voltage of microcontrollers to prevent the 33390 from sourcing current to the microcontroller's output. Switched Ground Output (LOAD) Normally this output is a saturated switch to ground, which pulls down the external resistor between the BUS and LOAD outputs. In the event ground is lost to the assembly, the LOAD output will bias itself “off” and will not leak more than 100 µA of current out of this pin. Overtemperature Shutdown If the BUS output becomes shorted to ground for any duration, an overtemperature shutdown circuit “latches off” the output source transistor whenever the die temperature exceeds 150°C to 190°C. The output transistor remains latched off until the Tx input is toggled from a logic [0] to a logic [1]. The rising edge provides the clearing function, provided the locally sensed temperature is 10°C to 15°C below the latch-off temperature trip temperature. Waveshaping Waveshaping is incorporated into the 33390 to minimize radiated EMI emissions. Table 1. Class B Bus Capacitance and Resistance Expressions Freescale Semiconductor, Inc.

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 Receiver Protocol The Class B communication scheme uses a variable pulse width (VPW) protocol. The microcontroller provides the VPW decoding function. Once the receiver detects a transition on Rx, it starts an internal counter. The initial “start of frame” bit is a logic [1] and lasts 200 µs. For subsequent bits, if there is a bus transition before 96 µs, one logic state is inferred. If there is a bus transition after 96 µs, the other logic state is inferred. The “end of data” bit is a logic [0] and lasts 200 µs. If there is no activity on the bus for 280 µs to 320 µs following a broadcast message, multiple unit nodes may arbitrate for control of the next message. During an arbitration, after the “start of frame” bit has been transmitted, the secondary node transmitting the most consecutive logic [0] bits will be granted sole transmission access to the bus for that message. Loss of Assembly Ground Connection The definition of a loss of assembly ground condition at the device level is that all pins of the 33390, with the exception of BUS and LOAD, see a very low impedance to VBAT. The LOAD pin of the device has an internal transistor switch connected to it that is normally saturated to ground. This pulls the LOAD-side of the external resistor (tied from BUS to LOAD) to ground under normal conditions. The LOAD pin switch is essentially that of an “upside down” FET, which is normally biased “on” so long as module ground is present and biased “off” when loss-of-ground occurs. When a loss of assembly ground occurs, the load transistor switch is self-biased “off”, allowing no more than 100 µA of leakage current to flow in the LOAD pin. During such a loss of assembly ground condition, the BUS and LOAD pins exhibit a high impedance to VBAT; all other pins will exhibit a low impedance to VBAT. During this condition the BUS pin is prevented from sourcing any current or loading the bus, which would cause a corruption of any data being transmitted on the bus. While a particular assembly is experiencing a loss of ground, all other assembly nodes are permitted to function normally. It should be noted that with other nodes existing on the bus, the bus will always have some minimum/maximum impedance to ground as shown in Table 1, page 10. Loss of Assembly Battery Connection The definition of a loss of assembly battery condition at the device level is that the VBAT pin of the 33390 sees an infinite impedance to VBAT, but there is some undefined impedance between these pins and ground. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

A0.25 M CB SS

0.25 M B M

h θ C X 45° L DIM MIN MAX MILLIMETERS A 1.35 1.75 A1 0.10 0.25 B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E

1.27 BSCe

3.80 4.00 H 5.80 6.20 h 0 7 L 0.40 1.25 θ 0.25 0.50 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. D E H A B e BA1 C A 0.10 D SUFFIX (8-LEAD SOIC NARROW BODY) PLASTIC PACKAGE CASE 751-06 ISSUE T Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 NOTES Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33390 NOTES Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

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