33290_08 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- Operates Over Wide Supply Voltage of 8.0 to 18V
- Operating Temperature of -40 to 125 °C
- Interfaces Directly to St andard CMOS Microprocessors
- ISO K Line Pin Protected Against Shorts to Ground
- Thermal Shutdown with Hysteresis
- ISO K Line Pin Capable of High Currents
- ISO K Line Can Be Driven with up to 10 nF of Parasitic Capacitance
- 8.0 kV ESD Protection Attainable with Few Additional Components
- Standby Mode: No V Bat Current Drain with VDD at 5.0 V
- Low Current Drain During Operation with V DD at 5.0 V
- Pb-Free Packaging Designated by Suffix Code EF
Figure 1. 33290 Simplified Application Diagram
ORDERING INFORMATION
Range (TA) Package MC33290D/R2 -40 to 125°C 8-SOICN MCZ33290EF/R2 VDD Dx SCIRxD SCITxD VDD 33290 +VBAT ISO K-Line R xD T xD MCU RX TX CEN VDD VBB GND ISO
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Figure 2. 33290 Simplified Block Diagram
20 V50 V
10 V 10 V
Figure 3. 33290 Pin Connections Table 1. 33290 Pin Definitions 1 VBB Battery power through external resistor and diode. 3 GND Common signal and power return. 5 TX Logic level input for data to be transmitted on the bus. 6 RX Logic output of data received on the bus. 7 VDD Logic power source input. 8 CEN Chip enable. Logic “1” for active state. Logic “0” for sleep state.
- NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits.
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ELECTRICAL CHARACTERISTICS
Table 2. Maximum Ratings permanent damage to the device.
- Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain
within specified parametric limits during this duration.
- ESD data available upon request.
- ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
- Nonrepetitive clamping capability at 25 °C.
- Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
- Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data Freescale Semiconductor 5 33290 STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics
0.7 VDD
0.3 VDD
0.8 VDD – –
- When IBB transitions to >100 µA.
- When IBB transitions to <100 µA.
- Enable pin has an internal current pull-down. Pu ll-down current is measured with CEN pin at 0.3 VDD.
- Measured by ramping T X down from 0.7 VDD and noting TX value at which ISO falls below 0.2 VBB.
- Measured by ramping T X up from 0.3 VDD and noting the value at which ISO rises above 0.9 VBB.
- T x pin has internal current pull-up. Pull-up current is measured with TX pin at 0.7 VDD.
- Thermal Shutdown performance (T LIM) is guaranteed by design but not production tested.
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STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (Continued)
- Input Hysteresis, V Hys(ISO) = VIH(ISO) - VIL(ISO).
- ISO has internal current limiting.
Analog Integrated Circuit Device Data Freescale Semiconductor 7 33290 DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics
- Time required ISO voltage to transition from 0.8 V BB to 0.2 VBB.
- Changes in the value of C ISO affect the rise and fall time but have minimal effect on Propagation Delay.
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ELECTRICAL PERFORMANCE CURVES ELECTRICAL PERFORMANCE CURVES Figure 4. ISO Input Threshold/VBB vs. Temperature Figure 5. ISO Output/VBB vs. Temperature Figure 6. ISO Fall Time vs. Temperature Figure 7. ISO Propagation Delay vs. Temperature
Analog Integrated Circuit Device Data Freescale Semiconductor 9 33290 TYPICAL APPLICATIONS INTRODUCTION TYPICAL APPLICATIONS INTRODUCTION The 33290 is a serial link bus interface device conforming to the ISO 9141 physical bus specification. The device was designed for automotive environment usage compliant with On-Board Diagnostic (OBD) requirements set forth by the California Air Resources Board (CARB) using the ISO K line. The device does not incorporate an ISO L line. It provides bi- directional half-duplex communications interfacing from a microcontroller to the communication bus. The 33290 incorporates circuitry to interface the digital translations from 5.0 V microcontroller logic levels to battery level logic and from battery level logic to 5.0 V logic levels. The 33290 is built using Freescale Semiconductor’s SMARTMOS process and is packaged in an 8-pin plastic SOIC. FUNCTIONAL DESCRIPTION The 33290 transforms 5.0 V microcontroller logic signals to battery level logic signals and visa versa. The maximum data rate is set by the fall time and the rise time. The fall time is set by the output driver. The rise time is set by the bus capacitance and the pull-up resistors on the bus. The fall time of the 33290 allows data rates up to 150 kbps using a 30 percent maximum bit time transition value. The serial link interface will remain fully functional over a battery voltage range of 6.0 to 18 V. The device is parametrically specified over a dynamic VBB voltage range of 8.0 to 18 V. Required input levels from the microcontroller are ratio- metric with the VDD voltage normally used to power the microcontroller. This enhances the 33290’s ability to remain in harmony with the R X and TX control input signals of the microcontroller. The RX and TX control inputs are compatible with standard 5.0 V CMOS circuitry. For fault-tolerant purposes the TX input from the microcontroller has an internal passive pull-up to VDD, while the CEN input has an internal passive pull-down to ground. A pull-up to battery is internally provided as well as an active data pull-down. The internal active pull-down is current-limit-protected against shorts to battery and further protected by thermal shutdown. Typical applications have reverse battery protection by the incorporation of an external 510 Ω pull-up resistor and diode to battery. Reverse battery protection of the device is provided by using a reverse battery blocking diode (“D” in the Simplified Application Diagram on page 1). Battery line transient protection of the device is provided for by using a 45 V zener and a 500 Ω resistor connected to the VBB source as shown in the same diagram. Device ESD protection from the communication lines exiting the module is through the use of the capacitor connected to the V BB device pin and the capacitor used in conjunction with the 27 V zener connected to the ISO pin.
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For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. D SUFFIX EF SUFFIX (PB-FREE) 8-PIN PLASTIC PACKAGE 98ASB42564B REV. U
Analog Integrated Circuit Device Data Freescale Semiconductor 11 33290
REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES 6.0 7/2006 • Implemented Revision History page
- Converted to Freescale format and updated to the prevailing for and style
- Added Pb-free suffix EF
- Removed MC33290EG/R2 and replaced wit h MCZ33290EG/R2 in the Ordering Information block 7.0 10/2006 • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 4. Added note with instructions to obtain this information from www.freescale.com. 8.0 8/2008 • Corrected the Document header information.
- Updated to the current Freescale form and style.
Rev 8.0 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2006-2008. All rights reserved. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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