33186 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 21
Technical content
Features
- Overtemperature, Short-Circuit Protection, and Overvoltage Protection against Transients up to 40 V at VBAT Typical
- RDSon = 150 m Ω for each output Transistor at 25°C
- Continuous DC Load Current 5 A (TC < 100 °C)
- Output Current Limitation at typ 6,5 A +/- 20%
- Short-Circuit Shutdown for Output Currents over 8 A
- Logic Inputs TTL/CMOS Compatible
- Operating Frequency up to 20 kHz
- Undervoltage Disable Function
- Diagnostic Output, 2 Disable Input
- Coding Input for Alternative Functions
- Stable Operation with an Extern al Capacitance of Maximum 47 µF at VBAT
- Pb-Free Packaging Designated by Suffix Code VW
Figure 1. 33186 Simplified Block Diagram
ORDERING INFORMATION
Range (TA) Package MC33186DH1/R2 - 40°C to 125°C 20 HSOP MC33186VW1/R2 DH SUFFIX VW SUFFIX (PB-FREE) PLASTIC PACKAGE 98ASH70702A 20-PIN HSOP
5.0 V VPWR
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Figure 2. 33186 Simplified Internal Block Diagram
Figure 3. 33186 Pin Locations Table 1. 33186 Pin Description typically in less than 100 ms. change of the voltage-level on IN1 or IN2. 6, 7, 14, 15 OUT1, OUT2 H-Bridge outputs with integrated free-wheeling diodes.
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The Pin 16 supplies the right high side and the charge pump. in tristate and the status flag is switched low. into normal operation, according to the input Pins and the status flag is reset. signals and the status flag is switched low. (Pin names in brackets refer to coding Pin = VCC). signals and the status flag is set. is below the specified limits.
17 CP Charge Pump output Pin
the device to perform a maximum speed, timing and PWM frequency. Table 1. 33186 Pin Description(continued)
Analog Integrated Circuit Device Data Freescale Semiconductor 5 33186
ELECTRICAL CHARACTERISTICS
Table 2. MAXIMUM RATINGS permanent damage to the device.
- Pin soldering temperature limit is for 10 seconds maximum dur ation. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
- Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
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STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. STATIC ELECTRICAL CHARACTERISTICS approximate mean at 25°C, nominal VCC, at time of device characterization.
- In case of negative voltage at OUT2 (respectively OUT1) this maximum pull down current at DI2 (respectively COD) Pin can be
exceeded. This happens during recirculation when the current is flowing in the low side. See curve 22.
Analog Integrated Circuit Device Data Freescale Semiconductor 7 33186 STATIC ELECTRICAL CHARACTERISTICS High Side Overcurrent Detection(4) Low Side Overcurrent Detection IOCHS IOCLS 8.0 A Leakage Current Output Stage Switched off – – 100 µA Free-Wheeling Diode Forward Voltage IOU = 3.0 A UD –– 2 . 0 V Free-Wheeling Diode Reverse Recovery Time IFM =1.0 A, di/dt = 4.0 A/µs tRR –2 . 0 5 . 0 µs Switch-off Temperature Hysteresis 160 190 OUTPUT STATUS FLAG (OPEN DRAIN OUTPUT) Output High (SF not set) USF = 5.0 V ISF – –1 0 µA Output Low (SF set) ISF = 300 µA VSF – – 1.0 V TIMING PWM frequency CCP = 33 nF f– – 1 0 K H z Maximum Switching Frequency During Current Limitation Output ON Delay Output OFF Delay Output Switching Time CCP = 0 to 33 nF IOUT = 3.0 A tr, tf 2.0 – 5.0 µs Disable Delay Time Turn off in Case of Overcurrent or Overtemperature –4 . 0 8.0 µs Power On Delay Time (CCP = 33 nF)(5) –1 . 0 5 . 0 m s Notes 4. In case of overcurrent, the time when the current is greater than 7.8 A is lower than 30 µs, with a maximum frequency of 1 kHz. 5. This parameter corresponds to the time for CCP to reach its nominal value when VBAT is applied. Table 3. STATIC ELECTRICAL CHARACTERISTICS(continued) approximate mean at 25°C, nominal VCC, at time of device characterization.
Analog Integrated Circuit Device Data
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Table 4. TRUTH TABLE
- In case of undervoltage, tristate and status-flag are reset automatically.
- Whenever overcurrent or overtemperature is detected, the fault is stored (i.e.status-flag remains low). The tristate conditions and the
status-flag are reset via DI1 (IN1) or DI2 (IN2). Pin names in brackets refer to coding Pin (COD = VCC).
- If COD = VCC then DI1 and DI2 are not active.
Z = High impedance (all output stage transistors are switched off).
Analog Integrated Circuit Device Data
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Figure 6. Disable Delay Time Figure 7. Output Switching Time
Analog Integrated Circuit Device Data Freescale Semiconductor 11 33186 Figure 8. Current Limitation on Low Side
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Figure 9. Stand-by Current vs. Temperature Figure 10. VBAT Undervoltage vs. Temperature Figure 11. Low Threshold Input Voltage vs. Temperature Figure 12. High Threshold Input Voltage vs. Figure 13. Vcp vs. Battery Voltage Figure 14. RDSON vs. Temperature
40 Tambient=25°C
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Figure 21. Output OFF Delay Figure 22. Output ON Delay Figure 23. Disable Delay Time Figure 24. High Side Overcurrent High Side Detection Figure 25. Maximum Di2 Input Current vs. Iout2, current
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Important: For the most current revision of the package, visit www.freescale.com and perform a keyword search on the 98A number listed below. CASE 979C–02 ISSUE A DATE 07/22/98 SEATING PLANE DATUM PLANE BOTTOM VIEW A X 45 E D h e 18X BMbbb C 1110 /C0095 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.150 PER SIDE. DIMENSIONS D AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –H–. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS –A– AND –B– TO BE DETERMINED AT DATUM PLANE –H–. 7. DIMENSION D DOES NOT INCLUDE TIEBAR PROTRUSIONS. ALLOWABLE TIEBAR PROTRUSIONS ARE 0.150 PER SIDE. ÇÇÇ ÇÇÇ ÉÉÉ ÉÉÉ SECTION W–W b c AMaaa C EXPOSED HEATSINK AREA A B C H PIN ONE ID 10X Y GAUGE PLANE DETAIL Y (1.600) L W W /C0113bbb C DIM MIN MAX MILLIMETERS A 3.000 3.400 A1 0.100 0.300 A2 2.900 3.100 A3 0.00 0.100 D 15.800 16.000 D1 11.700 12.600 D2 0.900 1.100 E 13.950 14.450 E1 10.900 11.100 E2 2.500 2.700 E3 6.400 7.200 E4 2.700 2.900 L 0.840 1.100 L1 0.350 BSC b 0.400 0.520 b1 0.400 0.482 c 0.230 0.320 c1 0.230 0.280 e 1.270 BSC h ––– 1.100 /C0113 0 8 aaa 0.200 bbb 0.100 /C0095/C0095 e/2 DH1 SUFFIX VW1 SUFFIX (PB-FREE) 20-PIN HSOP PLASTIC PACKAGE 98ASH70702A ISSUE A
application, and packaging information is provided in the datasheet. The MC33186 is offered in a 20 pin HSOP exposed pad, single die package. simulation according to the standards listed below.
- Per JEDEC JESD51-2 at natural convection, still air condition.
- 2s2p thermal test board per JEDEC JESD51-5 and
- Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
- Single layer thermal test board per JEDEC JESD51-3 and
- Thermal resistance between the die junction and the exposed
remaining surfaces insulated. Figure 28. Thermal Land Pattern for Direct Thermal Table 5. Thermal Performance Comparison
20 Pin HSOP-EP
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Figure 29. Thermal Test Board
Figure 30. Device on Thermal Test Board RθJA Figure 31. Transient Thermal Resistance RθJA
1 W Step Response, Device on Thermal Test Board Area A = 600 (mm2)
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REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES 5.0 5/2006 • Implemented Revision History page
- Added Lead Free (Pb-Free) Part Number MC33186VW1 6.0 10/2006 • Updated data sheet formal
- Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from MAXIMUM RATINGS on page 5. Added note with instructions to obtain this information from www.freescale.com.
Rev. 6.0 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2007. All rights reserved. RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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