32TSOP MAXIM | Alldatasheet
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PACKAGE RELIABILITY REPORT FOR
32 TSOP 8mm
4401 South Beltwood Parkway
Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610
Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor packages: Package Description: A description of this assembly can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm. Reliability Derating: The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that are temperature accelerated. AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts AfT = Acceleration factor due to Temperature tu = Time at use temperature (e.g. 55°C) ts = Time at stress temperature (e.g. 125°C) k = Boltzmann’s Constant (8.617 x 10-5 eV/°K) Tu = Temperature at Use (°K) Ts = Temperature at Stress (°K) Ea = Activation Energy (e.g. 0.7 ev) The activation energy of the failure mechanism is derived from either internal studies or industry accepted standards, or activation energy of 0.7ev will be used whenever actual failure mechanisms or their activation energies are unknown. All deratings will be done from the stress ambient temperature to the use ambient temperature. An exponential model will be used to determine the acceleration factor for failure mechanisms, which are voltage accelerated. AfV = exp(B*(Vs - Vu)) AfV = Acceleration factor due to Voltage Vs = Stress Voltage (e.g. 7.0 volts) Vu = Maximum Operating Voltage (e.g. 5.5 volts) The Constant, B, related to the failure mechanism is derived from either internal studies or industry accepted standards, or a B of 1.0 will be used whenever actual failure mechanisms or their B are unknown. All deratings will be done from the stress voltage to the maximum operating voltage. Failure rate data from the operating life test is reported using a Chi-Squared statistical model at the 60% or 90% confidence level (Cf). In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing assemblies will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html. The failure rate, Fr, is related to the acceleration during life test by: Fr = X/(ts * AfV * AfT * N * 2) X = Chi-Sq statistical upper limit N = Life test sample size
The calculated failure rate for this device/process is: The parameters used to calculate this failure rate are as follows: Cf: 60% Ea: 0.7 B: 0 Tu: 25 Vu: 5.5°C Volts The reliability data follows. Some of the data in this report may be generic. A the start of this data is a description of the assembly vehicle used to generate this reliability data. The next section is the detailed reliability data for each stress. If there are additional assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that assembly. Where appropriate, preconditioning is performed before all stresses and the bond crater test unless otherwise noted. The reliability data section includes the latest data available. Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. FITS: 3.0MTTF (YRS): 37651FAILURE RATE: Assembly Site: ASE Body Size: 8x13.4x0.965 Pin Count: 28 Package Type: TSOP Lead Frame: Stamped Alloy 42 Assembly Information: Lead Finsh: Sn Plate 100% Matte Mold Compound: Sumitomo G700 Die Attach: Sumitomo 1076 DS Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 04290429 toDate Code Range: Theta JA: Theta JC: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# JESD22-B102 15 0SOLDERABILITY 0429 0Total:
Assembly Site: ATK (Amkor, K) Body Size: 8x13.4x0.965 Pin Count: 28 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Sumitomo 7351T Die Attach: 8361J Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 03030223 toDate Code Range: Theta JA: Theta JC: OPERATING LIFE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000125C, 7.0 VOLTS 80 0HIGH VOLTAGE LIFE HRS0223 1000125C, 7.0 VOLTS 160 0HIGH VOLTAGE LIFE HRS0223 1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0303 0Total: Assembly Site: ATK (Amkor, K) Body Size: 8x20x1.0 Pin Count: 32 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Sumitomo 7351T Die Attach: 8361J Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 03030038 toDate Code Range: Theta JA: Theta JC: MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# J-STD-020 8 0ULTRASOUND 0038 24125C 8STORAGE LIFE HRS 24030C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS MIL-STD-883-2009 8 0EXTERNAL VISUAL J-STD-020 8 0PRECONDITION U/S 0Total: OPERATING LIFE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA#
1000125C, 6.0 VOLTS 116 0HIGH VOLTAGE LIFE HRS0038 1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0303 0Total: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# MIL-STD-883-2003 3 0SOLDERABILITY 0038 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 0038 MIL-STD-883-2016 6 0PHYSICAL DIMENSIONS MIL-STD-883-2015 6 0MARK PERMANENCY MIL-STD-883-2004 : COND B2 6 0LEAD INTEGRITY 0Total: PRECONDITIONING LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 24125C 315STORAGE LIFE HRS0038 24030C/60% R.H. 315MOISTURE SOAK HRS 3235C +5/-0C 315 0CONVECTION REFLOW PASS 0Total: TEMPERATURE CYCLE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000-55C TO 125C 77 0TEMP CYCLE CYS0038 0Total: TEMPERATURE HUMIDITY BIAS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 100130C, 85%R.H.,5.5V 77 0HAST HRS0038 0Total: UNBIASED MOISTURE RESISTANCE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 200130C, 85% R.H. 45 0HAST, NO BIAS HRS0038 0Total: Assembly Site: ATP (Amkor, PI) Body Size: 8x13.4x0.965 Pin Count: 28 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Sumitomo 7351T Die Attach: 8361J Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 99249921 toDate Code Range: Theta JA: Theta JC:
MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# J-STD-020 6 0PRECONDITION U/S 9921 MIL-STD-883-2009 8 0EXTERNAL VISUAL J-STD-020 8 0ULTRASOUND 24125C 8STORAGE LIFE HRS 24030C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS J-STD-020 8 0PRECONDITION U/S 9921 J-STD-020 8 0ULTRASOUND 24125C 8STORAGE LIFE HRS 24030C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS MIL-STD-883-2009 8 0EXTERNAL VISUAL 0Total: OPERATING LIFE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000125C, 7.0 VOLTS 116 0HIGH VOLTAGE LIFE HRS9921 1000125C, 7.0 VOLTS 116 1HIGH VOLTAGE LIFE HRS9924 990165 1Total: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# SENT TO OUTSIDE SOURCE 5 0CONSTRUCTION ANALYSIS 9921 MIL-STD-883-2003 3 0SOLDERABILITY 9921 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 9921 MIL-STD-883-2016 6 0PHYSICAL DIMENSIONS MIL-STD-883-2015 6 0MARK PERMANENCY MIL-STD-883-2004 : COND B2 6 0LEAD INTEGRITY MIL-STD-883-2003 3 0SOLDERABILITY 9921 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 9921 MIL-STD-883-2016 6 0PHYSICAL DIMENSIONS MIL-STD-883-2015 6 0MARK PERMANENCY MIL-STD-883-2004 : COND B2 6 0LEAD INTEGRITY 0Total: PRECONDITIONING LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 24125C 356STORAGE LIFE HRS9921 24030C/60% R.H. 356MOISTURE SOAK HRS 3235C +5/-0C 356 0CONVECTION REFLOW PASS 0Total: TEMPERATURE CYCLE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000-55C TO 125C 77 0TEMP CYCLE CYS9921 1000-55C TO 125C 91 0TEMP CYCLE CYS9921
0Total: TEMPERATURE HUMIDITY BIAS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 100130C, 85%R.H.,5.5V 45 1HAST HRS9921 No FA 100130C, 85%R.H.,5.5V 90 0HAST HRS9921 1Total: UNBIASED MOISTURE RESISTANCE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 200130C, 85% R.H. 45 0HAST, NO BIAS HRS9921 200130C, 85% R.H. 55 0HAST, NO BIAS HRS9921 0Total: Assembly Site: ATP (Amkor, PI) Body Size: 8x20x1.0 Pin Count: 32 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Sumitomo 7351T Die Attach: 8361J Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 01069913 toDate Code Range: Theta JA: Theta JC: MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# J-STD-020 8 0PRECONDITION U/S 9913 J-STD-020 8 0ULTRASOUND 125C 8STORAGE LIFE HRS 24030C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS MIL-STD-883-2009 8 0EXTERNAL VISUAL 0Total: OPERATING LIFE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000125C, 6.0 VOLTS 85 0HIGH VOLTAGE LIFE HRS9913 1000125C, 6.0 VOLTS 256 2HIGH VOLTAGE LIFE HRS0106 iBATT LEAK 2Total: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# MIL-STD-883-2003 3 0SOLDERABILITY 9913 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 9913
MIL-STD-883-2016 6 0PHYSICAL DIMENSIONS 9913 MIL-STD-883-2015 6 0MARK PERMANENCY MIL-STD-883-2004 : COND B2 6 0LEAD INTEGRITY 0Total: PRECONDITIONING LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 24125C 315STORAGE LIFE HRS9913 24030C/60% R.H. 315MOISTURE SOAK HRS 3235C +5/-0C 315 0CONVECTION REFLOW PASS 0Total: TEMPERATURE CYCLE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000-55C TO 125C 70 0TEMP CYCLE CYS9913 0Total: TEMPERATURE HUMIDITY BIAS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 100130C, 85%R.H.,5.5V 70 0HAST HRS9913 0Total: UNBIASED MOISTURE RESISTANCE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 200130C, 85% R.H. 40 0HAST, NO BIAS HRS9913 0Total: Assembly Site: NSEB Body Size: 8x13.4x0.965 Pin Count: 28 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Ciba-Geigy Aratonic 2184-4 (KMC 184) Die Attach: 84-1 LMISR4 Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 04320432 toDate Code Range: Theta JA: Theta JC: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# JESD22-B102 8 0SOLDERABILITY 0432 0Total:
Assembly Site: NSEB Body Size: 8x20x1.0 Pin Count: 32 Package Type: TSOP Lead Frame: Stamped Copper C7025 Assembly Information: Lead Finsh: SnPb Plate Mold Compound: Ciba-Geigy Aratonic 2184-4 (KMC 184) Die Attach: 84-1 LMISR4 Epoxy Silverfilled Ablebond Bond Wire / Size: Au / 1.0 mil Moisture Sensitivity (JEDEC J-STD20A) Level 3 Flammability: UL 94-V0 03240145 toDate Code Range: Theta JA: Theta JC: CONSTRUCTION ANALYSIS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# TO BE SUBMITTED BY ASSEMBLY SITE 3 0CONSTRUCTION ANALYSIS 0146 0Total: MOISTURE SENSITIVITY LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# J-STD-020 8 0ULTRASOUND 0145 24125C 8STORAGE LIFE HRS 19230C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS J-STD-020, 6.1a 8 0EXTERNAL VISUAL J-STD-020 8 0PRECONDITION U/S J-STD-020 8 0ULTRASOUND 0146 24125C 8STORAGE LIFE HRS 19230C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS J-STD-020, 6.1a 8 0EXTERNAL VISUAL J-STD-020 8 0PRECONDITION U/S J-STD-020 8 0ULTRASOUND 0147 24125C 8STORAGE LIFE HRS 19230C/60% R.H. 8MOISTURE SOAK HRS 3235C +5/-0C 8 0CONVECTION REFLOW PASS J-STD-020, 6.1a 8 0EXTERNAL VISUAL J-STD-020 8 0PRECONDITION U/S 0Total: OPERATING LIFE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000125C, 6.0 VOLTS 70 0HIGH VOLTAGE LIFE HRS0145 1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0146 1000125C, 6.0 VOLTS 77 0HIGH VOLTAGE LIFE HRS0147 1000125C, 5.5 VOLTS 77 0HIGH TEMP OP LIFE HRS0324
988125C, 5.5 VOLTS 77 0HIGH TEMP OP LIFE HRS0324 0Total: PACKAGE TESTS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# JESD22-B102 3 0SOLDERABILITY 0145 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 0145 JESD22-B100 6 0PHYSICAL DIMENSIONS JESD22-B107 6 0MARK PERMANENCY JESD22-B105 TEST CONDITION B 6 0LEAD INTEGRITY JESD22-B102 3 0SOLDERABILITY 0146 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 0146 JESD22-B100 6 0PHYSICAL DIMENSIONS JESD22-B107 6 0MARK PERMANENCY JESD22-B105 TEST CONDITION B 6 0LEAD INTEGRITY JESD22-B102 3 0SOLDERABILITY 0147 MIL-STD-883-2012 : TOP & SIDE VIEW 6 0X-RAY 0147 JESD22-B100 6 0PHYSICAL DIMENSIONS JESD22-B107 6 0MARK PERMANENCY JESD22-B105 TEST CONDITION B 6 0LEAD INTEGRITY 0Total: PRECONDITIONING LEVEL 3 DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 24125C 308STORAGE LIFE HRS0145 19230C/60% R.H. 308MOISTURE SOAK HRS 3235C +5/-0C 308 0CONVECTION REFLOW PASS 24125C 308STORAGE LIFE HRS0146 19230C/60% R.H. 308MOISTURE SOAK HRS 3235C +5/-0C 308 0CONVECTION REFLOW PASS 24125C 308STORAGE LIFE HRS0147 19230C/60% R.H. 308MOISTURE SOAK HRS 3235C +5/-0C 308 0CONVECTION REFLOW PASS 0Total: TEMPERATURE CYCLE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 1000-55C TO 125C 70 0TEMP CYCLE CYS0145 1000-55C TO 125C 77 0TEMP CYCLE CYS0146 1000-55C TO 125C 77 0TEMP CYCLE CYS0147 0Total: TEMPERATURE HUMIDITY BIAS DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 100130C, 85%R.H.,5.5V 44 0HAST HRS0145 100130C, 85%R.H.,5.5V 77 0HAST HRS0146 100130C, 85%R.H.,5.5V 77 0HAST HRS0147
0Total: UNBIASED MOISTURE RESISTANCE DESCRIPTION READPOINTCONDITION QTY FAILSDATE CODE FA# 200130C, 85% R.H. 44 0HAST, NO BIAS HRS0145 200130C, 85% R.H. 74 0HAST, NO BIAS HRS0146 200130C, 85% R.H. 73 0HAST, NO BIAS HRS0147 0Total: FITS: 3.0MTTF (YRS): 37651FAILURE RATE: