04EP04-N3GM627 KINGSTON | Alldatasheet
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kingston.com/epop Embedded Package-on-Package Memory for Wearables Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB) space, and ensures optimum performance. ePoP is an ideal solution for space constrained applications such as wearables. more >> ePoP #KingstonIsWithYou
EPOP PART NUMBERS AND SPECIFICATIONS LPDDR3 based ePoP Part Number Capacity Description Package FBGA Operating TemperatureNAND (GB) DRAM (Gb) eMMC DRAM (mm) 04EP04-N3GM627 4 4 5.0 LPDDR3 10x10x0.8 136 -25°C ~ +85°C 04EP08-N3GM627 4 8 5.0 LPDDR3 10x10x0.85 136 -25°C ~ +85°C 08EP08-N3GTC32* 8 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C 32EP08-N3GTC32 32 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C LPDDR4x based ePoP Part Number Capacity Description Package FBGA Operating TemperatureNAND (GB) DRAM (Gb) eMMC DRAM (mm) 08EP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 08CP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C 16EP08-M4ETC32 16 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32EP08-M4ETC32 32 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 16EP16-M4FTC32 16 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32EP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32CP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C *pSLC mode for higher endurance IoT Wearables THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. US MKF-960 MARKET SEGMENTS
- By mounting directly on top of a host SoC, ePoP provides an ideal solution for small form factor applications such as wearables.
- Low-Power DRAM and optimized storage fi rmware reduces power consumption while delivering the high performance needed for battery powered wearable applications. KEY BENEFITS
- Simplifi es system design, reduces time to market, and shortens the qualifi cation cycle.
- Multiple fi rmware confi gurations available to best fi t your application requirements for performance, power, and life span. Augmented Reality (AR) / Virtual Reality (VR) devices