32128A-RGB ETC2 | Alldatasheet
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Technical content
4 Viewing Angle (Cr2) Φ=0° 25 --- 40 --- Deg Note1 Φ=180° 25 --- 35 --- Φ=90° 25 --- 30 --- Φ=270° 25 --- 30 --- 5 Current Consumption ILCD Hz=64 25 --- 17 --- uA Note3 NOTE 1: DEFINITION OF VIEWING ANGLE AND DIRECTION NOTE 2: THERSHOLD VOLTAGE AND SATURATION VOLTAGE Vth: The voltage Vop which the transmission rate of segment is 90%(positive) or 10%(negative) of saturated value on conditions of the selected waveform.(non-selected waveform is opposition) Vsat: The voltage Vop which the transmission rate of segment is 10%(positive) or 10%(negative) of saturated value on conditions of the selected waveform.(non-selected waveform is opposition) Detector 3H Φ =90° Φ 6H Φ =0° Z =0° 9H Φ =270° 12H Φ =180°
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 4 of 18 NOTE 3: CURRENT CONSUMPTION (I LCD) NOTE 4: RESPONSE TIME (Tr, Tf) NOTE 5: CONTRAST RATIO (CR) 5.1 POSITIVE TYPE: CONTRAST RATIO = BRIGHTNESS AT VOP(NON-SELECTED) BRIGHTNESS AT VOP(SELECTED) 5.2 NEGATIVE TYPE: CONTRAST RATIO = BRIGHTNESS AT VOP(SELECTED) BRIGHTNESS AT VOP(NON-SELECTED) NOTE 6: CAPACITANCE (C) Conditions: Voltage applied to all segments. Conditions: 1.Driving waveform: static waveform. 2.Voltage applied to all segments
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 5 of 18 n BLOCK DIAGRAM
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 6 of 18 n MECHANCIAL DRAWING
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 7 of 18 n BACKLIGHT DRAWING
TESTING POINT CIRCUIT DIAGRAM REMARK: 1. AVERAGE LUMINOUS INTENSITY IS THE AVERAGE VALUE OF THE SIX INDICATED POINTS AS SHOWN. 2. MEASUREMENT INSTRUMENT: BM-7, APERTURE: 10mm.
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 10 of 18 ◆ INSPECTION STANDARD 1) FUNCTIONAL TEST STANDARD Item Inspection Standard Description Standard Defect type 1 LCD has no display Reject MAJ 2 LCM display do not change Reject MAJ 3 Display wrong pattern Reject MAJ
4 Display segment open
5 Display dim segment Reject MAJ
6 Wrong LCD viewing direction Reject MAJ 7 Dim Display See sample MAJ 8 LCD color variation See sample MAJ Pattern parallelism Acceptable range L <a b Accept
10 LCD display Pin hole
Ø=2 yx + QTY Ø≦0.25 1 Accept Ø>0.25 1 Accept Ø<41W 1 Accept Ø>41W 1 Reject MIN Missing segment Missing segment Dim segment Dim segment
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 11 of 18 Item Inspection Standard Description Standard Defect type
11 LCD display Broken segment(dots)
Draw Standard X y QTY ≧41b ≧41a 1 Reject MIN (X or y) ≧0.2mm 1 Reject MIN ≦41b ≦41a 1 Accept ≦51b ≦51a 2 Accept
12 LCD display Black spot or White spot
Ø=2 1.5 Scratch on LCD 1.6 LCD scratch Scratch depth see sample
1.7 White or black spot on LCD Ø=2
Ø=2 yx + x y
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 12 of 18 Item Standard description of inspection Standard Defect type
2.12 Scratch circuit, damage Circuit
a≦1/2w or b<w Accept a>1/2w or b>w Reject 3 Bezel specification 3.1 Wrong Materials MAJ 3.2 Incorrect dimension MAJ 3.3 Bezel broken MAJ 3.4 Rust on Bezel MAJ
3.5 Hole or dirty on oil Paint surface
Displaytech Ltd LCD MODULE 32128A-RGB SERIES Version : 1.1 P 13 of 18 Item Standard description of inspection Standard Defect type 3.6 Bezel bow or twist h≦0.01 mm/mm Accept h>0.01 mm/mm Reject MIN 3.7 d1-d2≦tolerance Accept d1-d2>tolerance Reject MIN 3.8
3.9 Twist angle α=45º+5º Accept
3.10 Void gap between bezel and PCB Reject MIN
3.11 Bezel clip incorrectly Reject MIN
4 Solder specification 4.1 Wrong component Reject MAJ 4.2 Broken component Reject MAJ 4.3 Mis-alignment Component legs extend beyond the pad and Legs >pad distance(w) on solder area >W2 Accept Component legs extend beyond the pad and Legs >pad distance(w) on solder area <W2 Reject MIN Component Offset Solder legs offset distance L<solder legs 1/4W Accept Solder legs offset L>1/4W Reject MIN
4.4 Component assembly defect Reject MIN
4.5 CHIP components hoist≦0.5mm Accept 4.6 CHIP components hoist>0.5mm Reject MIN NG
4.10 Solder PAD tilt up, but height (h) less than Solder PAD thickness (a) Accept
4.11 Excess solder above components Reject Min
4.12 Insufficient solder below components height or less than diameter Reject MIN
4.13 Solder area less than soldering PAD Area by 2/3 Reject MIN
4.14 Trimmed pin length beyond 0.09inch (2.3mm) Reject Min
- When assembling the LCM into other equipment, the spacer to the bit between the LCM and the fitting plate should have enough height to avoid causing stress to the module surface, refer to the individual specifications for measurements. The
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