32001506BUS | DigiCamel IC Datasheet

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3200150X MIPOT | Alldatasheet

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Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 1 of 24 www.mipot.com Wireless Protocol Modules MiP Series 3200150X Family Datasheet Overview The 3200150X is a family of transceivers operating in the 868 MHz (EU version) or 915 MHz (US version) SRD Band optimized for very long range, low power applications, sui table for LPWA networks. Based on LoRa® RF Technology and LoRaWAN™ protocol, it provides ultra - long range spread spectrum communication and high interference immunity. Using the (G)FSK modem (EU version), it allows to easily add wM-Bus connectivity for utility meters. Thanks to its small LGA form factor (11.3 mm x 8.9 mm) and its low current consumption, this module allows the implementation of highly integrated low power solutions for Internet of Things (IoT) applications, security systems, sensor networks , metering, smart buildings, agriculture, and supply chain management. The 32001505 is a host based module needing an external microcontroller to configure and operate it. Instead, the 32001506 family features a dual core microcontroller in which one is dedicated to the radio stack and the ARM Cortex M4 is free for the customer application firmware. The available radio stacks support a wide range of applications as the wM-Bus standard (3200150XAxx), or accelerating the development of a LoRaWAN application ( 3200150XBxx) using the LoRa modulation, or performing a local star network using the LoRa Mipot stack (3200150XCxx). Using the LoRa Modem stack (3200150 XDxx), it is easy to create point -to- point applications or build a more complex custom stack. The 320015 0XFxx can be configured to work either as a LoRaWAN module (as 3200150XBxx) or with the LoRa Modem stack (as 3200150XDxx). The 3200150XGxx can be configured to work either as a LoRaWAN

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 2 of 24 www.mipot.com module (as 3200150XBxx) or with the wM -Bus stack (as 3200150XAxx). The configuration can be changed runtime.

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 4 of 24 www.mipot.com 1. Product Features Mechanical highlights:  Extremely compact dimensions  LGA pattern Low power characteristics:  Sleep current consumption 2.2 µA  18 mA in RX mode Memories: Only for 32001506  196 Kbyte Flash memory  32 Kbyte RAM  512 byte OTP (One Time Programmable) memory RF performances:  -135 dBm Sensitivity @LoRa®  +14 dBm Output Power (EU version)  +20 dBm Output Power (US version) Additional features:  Smart serial interface selector (UART, LPUART, SPI, I2C)  Preloaded radio library  LoRaWAN™ specifications 1.0.4 Only for 32001506  ARM Cortex-M4 CPU  Internal communication channel with the radio peripheral  Based on STM32WL55J Multiple Stacks available:  wM-Bus  LoRaWAN™ specifications 1.0.4  LoRa Mipot  LoRa Modem  LoRa Multistack

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 5 of 24 www.mipot.com Regulatory compliance (EU version):  2014/53/EU (RED)  EN 300 220-1 v3.1.1 (2017-02)  EN 300 220-2 v3.1.1 (2017-02)  EN 301 489-1 v2.2.3 (2019-11)  EN 301 489-3 v2.2.0 (2021-11)  EN IEC 62311:2020  IEC 62321:2008 / IEC 62321-1:2013 / IEC 62321-2:2013 / IEC 62321-3-1:2014  EN 62321:2009/ EN 62321-1:2013 / EN 62321-2:2014 / EN 62321-3-1:2014  UNE EN 62321:2009 / UNE EN 62321-1:2009 / UNE EN 62321-2:2014 / UNE EN 62321-3-1:2014  EN 62368-1:2014 + AC:2015 + AC:2017 + A11:2017  IEC 62368-1:2014 + COR1:2015 + COR2:2015  UNE-EN 62368-1:2014 + AC1:2015 + AC2:2015 + AC:2017 + A11:2017 Regulatory compliance (US version):  USA FCC Rules and Regulations CFR 47, Part 15, Subpart B (10-1-20 Edition)  USA FCC Part 15.247 (10-1-20 Edition): Operation within the bands 902 - 928 MHz, 2400 - 2483.5 MHz, and 5725 - 5850 MHz.  USA FCC Part 15.209 (10-1-20 Edition): Radiated emission limits; general requirements.  USA FCC 47 CFR Part 2.1091 Radiofrequency radiation exposure evaluation: mobile devices.  ANSI C63.10-2013: American National Standard for Testing Unlicensed Wireless Devices. Only 32001505-BUS:  CANADA ICES-003 Issue 7 (October 2020)  CANADA RSS-247 Issue 2 (February 2017).  CANADA RSS-Gen Issue 5 amendment 1 (March 2019).  CANADA ISED RSS-102 Issue 5 (2015-03) – Radio Frequency Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands) Emission designator :  LoRa® DTS: 500KF1D  LoRa® FHSS: 125KFXD

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 6 of 24 www.mipot.com 2. Mechanical Dimensions Note: Dimension in mm. General tolerance ±0.1mm. The tolerance is not cumulative

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 7 of 24 www.mipot.com 3. Pin Definition Top View Bottom View

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 8 of 24 www.mipot.com 32001505 32001506 32001505 32001506 PAD NAME TYPE STM32WL PIN PAD NAME TYPE STM32WL PIN A1 SPI1_MISO I/O PA6 D1 GND S GND A2 SPI1_SCK I/O PA5 D2 NC - PB10 A3 SPI1_NSS I/O PA4 D3 NC - PB11 A4 LPUART1_TX I/O PC0 D4 GND S GND A5 LPUART1_RX I/O PC1 D5 NC - PB14 A6 SPI1_MOSI I/O PB5 D6 NC - PA10 A7 I2C1_SCL I/O PB8 D7 VBAT S VBAT A8 I2C1_SDA I/O PB9 D8 NC - PB13 A9 VDD S VDD D9 SPI2_MISO I/O PC2 B1 NWAKE I PA7 E1 GND S GND B2 NDATA_INDICATE O PC6 E2 GND S GND B3 USART2_TX I/O PA2 E4 NC - PB1 B4 USART2_RX I/O PA3 E6 NC - PB2 B5 USART1_TX I/O PB6 E7 NC - PA12 B6 USART1_RX I/O PB7 E9 SPI2_MOSI I/O PC3 B7 NC - PA15 F1 ANT RF I/O ANT B8 VDDA S VDDA F2 GND S GND B9 VDD S VDD F9 SPI2_NSS I/O PB12 C1 BOOT0 I/O PH3-BOOT0 G1 GND S GND C2 NC - PA8 G2 GND S GND C3 NC - PA1 G3 GND S GND C4 GND S GND G5 NRST I NRST C5 NC - PA0 G6 NC - SWDIO C6 NC - PB4 G7 NC - SWCLK C7 VREF+ S VREF+ G8 NC - SWO C9 GND S GND G9 SPI2_SCK I/O PA9 Note: - Regarding the characteristics and its alternate functions of the STM32WL’s pins refer to the STM32WL55xx datasheet. - NC means “do not connect”, leave the pin floating.

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 9 of 24 www.mipot.com 4. Firmware development (only for 32001506) 4.1. Overview The 32001506 family module is based on the STM32WL55J and embeds the necessary circuitry for the RF subsystem in the 868 MHz band (EU version) or 915 MHz band (US version). The MCU employs an asymmetrical dual core CPU comprised of an ARM Cortex -M4 and an ARM Cortex-M0+. The Cortex-M0+ core is reserved for the RF stack while the user code runs on the Cortex -M4. The communication between the cores is done using the Inter -Processor Communication Controller (IPCC). The RF stack is preloaded in the module and uses the same set of commands of the host based version. For details about the MCU, please refer to STM32WL55J data sheet (DS13293) and reference manual (RM0453). 4.2. Memory organization The memory available for the user code depend on the model because of different memory requirements of the different stacks, and is shown in the following tables. 4.2.1. Available memory for 32001506Axx Start address End Address Length Description 0x0800 0000 0x08031FFF 204800 User Flash Memory 0x2000 0000 0x2000 7FFF 32768 User RAM 0x2000 8000 0x2000 83FF 1024 IPCC RAM 0x1FFF 7200 0x1FFF 73FF 512 User OTP Memory 4.2.2. Available memory for 32001506Bxx Start address End Address Length Description 0x0800 0000 0x08026FFF 159744 User Flash Memory 0x2000 0000 0x2000 7FFF 32768 User RAM 0x2000 8000 0x2000 83FF 1024 IPCC RAM 0x1FFF 7200 0x1FFF 73FF 512 User OTP Memory

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 10 of 24 www.mipot.com 4.2.3. Available memory for 32001506Cxx Start address End Address Length Description 0x0800 0000 0x0802B7FF 178176 User Flash Memory 0x2000 0000 0x2000 7FFF 32768 User RAM 0x2000 8000 0x2000 83FF 1024 IPCC RAM 0x1FFF 7200 0x1FFF 73FF 512 User OTP Memory 4.2.4. Available memory for 32001506Dxx Start address End Address Length Description 0x0800 0000 0x0802 F7FF 194560 User Flash Memory 0x2000 0000 0x2000 7FFF 32768 User RAM 0x2000 8000 0x2000 83FF 1024 IPCC RAM 0x1FFF 7200 0x1FFF 73FF 512 User OTP Memory 4.2.5. Available memory for 32001506Fxx Start address End Address Length Description 0x0800 0000 0x08021FFF 139264 User Flash Memory 0x2000 0000 0x2000 7FFF 32768 User RAM 0x2000 8000 0x2000 83FF 1024 IPCC RAM 0x1FFF 7200 0x1FFF 73FF 512 User OTP Memory 4.3. Reserved Pins Some Pins of the STM32WL55J are reserved for internal use, so those are not available for the user application and must be not modified in any way.  PA11  PB0  PC4  PC5  PC13  PC15

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 11 of 24 www.mipot.com 5. Hardware Integration 5.1. Decoupling capacitors Each power supply pin must be decoupled with capacitors with the values suggested in the figure. 5.2. Layout guidelines For better noise rejection, put the decoupling capacitors as close as possible to the power pins of the module, giving precedence to the low value ones. The trace connecting to the RF pin must have an impedance of 50 Ω. For better performance, connect the GND pads around the RF pin without thermals.

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 12 of 24 www.mipot.com 6. Electrical Characteristics 6.1. Absolute Maximum Ratings Parameter Max. Unit Supply Voltage (VDD) 3.9 V Radio Frequency Input Level, pin F1 0 dBm Voltage Standing Wave Radio (VSWR) at RF Input, ANT, pin F1 10:1 I/O Pin voltage VDD + 0.3 V Storage Temperature -40 ÷ 100 °C Operating Temperature -40 ÷ 85 °C 6.2. Operating Condition Note: All RF parameters measured with input (pad F1, ANT) connected to a 50 Ω impedance signal source or load.

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 13 of 24 www.mipot.com 6.2.1. GENERAL ELECTRICAL CHARACTERISTICS @ 25 °C EU version: Parameter Min. Typ. Max. Unit Notes Supply Voltage (VDD) X - 2.1 3.0 3.6 V - X 1.9 3.0 3.6 VDDA X X 0 - 3.6 V VBAT X X 1.55 - 3.6 V VIN X X -0.3 - VDD + 0.3 V Sleep DC Current X - - 2.2 3.7 µA - X - 2.2 10.8 Data Rate 2-FSK X X - - 50 kbit/s Data Rate LoRa® X X 0.25 - 11 kbit/s US version: Parameter Min. Typ. Max. Unit No tes Supply Voltage (VDD) X - 2.1 3.0 3.6 V - X 1.9 3.0 3.6 VDDA X X 0 - 3.6 V VBAT X X 1.55 - 3.6 V VIN X X -0.3 - VDD + 0.3 V Sleep DC Current X X - 2.5 3.7 µA Data Rate 2-FSK X X - - 48 kbit/s Data Rate LoRa® X X 0.98 - 21.9 kbit/s

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 14 of 24 www.mipot.com 6.2.2. RECEIVER ELECTRICAL CHARACTERISTICS @ 25 °C EU version: Parameter Min. Typ. Max. Unit Notes DC Current Drain X - - - 20 mA 6 - X - - 22 Operating Frequency X - 868.1 - 869.525 MHz - X 868.0 - 868.6 Channel Frequency Precision X X - ±15 - kHz Sensitivity, 2-FSK X X - -115 - dBm 2,3,5 Sensitivity, LoRa® X X - -135 - dBm 2,4,5 Sensitivity, wM-Bus mode S X X - -107 - dBm 9 Sensitivity, wM-Bus mode T X X - -106 - dBm 9 Sensitivity, wM-Bus mode R X X - -115 - dBm 9 Sensitivity, wM-Bus mode C X X - -106 - dBm 9 Image Frequency Rejection X X - 54 - dB 7 Spurious radiated level X X - - -57 dBm Output Logic Low X X GND - 0.05 V Output Logic High X X VDD – 0.2 - VDD V US version: Parameter Min. Typ. Max. Unit Notes DC Current Drain X X - - 20 mA 6 Operating Frequency X X 902.0 - 928.0 MHz Channel Frequency Precision X X - ±15 - kHz Sensitivity, 2-FSK X X - -115 - dBm 2,3,5 Sensitivity, LoRa® X X - -135 - dBm 2,4,5 Spurious radiated level X X - - -57 dBm Output Logic Low X X GND - 0.05 V Output Logic High X X VDD - 0.2 - VDD V

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 15 of 24 www.mipot.com 6.2.3. TRANSMITTER ELECTRICAL CHARACTERISTICS @ 25 °C EU version: Parameter Min. Typ. Max. Unit Notes Current Drain (CW @14dBm) X X - 103 - mA 1,2 Current Drain (FSK @14 dBm) X - - - 128 mA 1,2 - X - - 120 Operating frequency X - 868.0 - 869.6 MHz - X 868.0 - 868.6 Occupied Bandwidth 2-FSK X X - 125 - kHz Occupied Bandwidth LoRa® X X 125 250 kHz Operating Channel Width 2-FSK X X - 200 - kHz Operating Channel Width LoRa® X X 200 - 300 kHz Maximum Output power (50 Ω load) X X - 14 - dBm 1,2,8 RF Output Impedance X X - 50 - Ω Input Logic Low X X GND - 0.05 V Input Logic High X X VDD - 0.2 - VDD V US version: Parameter Mi n. Typ. Max. Unit Notes Current Drain (CW @20 dBm) X X - 138 - mA 1,2 Operating frequency X X 902.0 - 928.0 MHz Occupied Bandwidth LoRa® DTS X X 500 - - kHz Occupied Bandwidth LoRa® FHSS X X - 125 - kHz 8 Operating Channel Width LoRa® DTS X X - 600 - kHz Operating Channel Width LoRa® FHSS X X - 200 - kHz 8 Maximum Output power (50 Ω load) X X - 20 - dBm 1,2,7 RF Output Impedance X X - 50 - Ω Input Logic Low X X GND - 0.05 V Input Logic High X X VDD - 0.2 - VDD V

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 16 of 24 www.mipot.com Notes: 1) VDD = 3.6 V. 2) All RF parameters measured with input (pin F1, ANT) connected to 50 Ω impedance signal source or load. 3) Pseudo random code NRZ, 2-FSK BER (bit error rate) = 0.1 % or better, 2 -level FSK modulation without pre -filtering, Bit Rate = 4.8 kbit/s, frequency deviation = 5 kHz, filter bandwidth = 20 kHz. 4) LoRa® PER (packet error rate) = 1 %, packet of 64 bytes, preamble of 8 bytes, error correction code CR = 4/5, CRC on payload enabled, no reduced encoding, no implicit header. 5) Sensitivities given using highest LNA gain step. 6) Power consumption measured with -140 dBm signal and AGC ON. 7) Blocking immunity, AC R and co -channel rejection, given for a single tone interferer and referenced to sensitivity +6 dB, blocking tests performed with unmodulated signal measured as per ETSI 300 220-1. 8) In order to not exceed the maximum power permitted by the ETSI EN 300 220 regulation, choose an appropriate antenna system and power supply. 9) According to EN 13757-4, measured @ PER < 0.8 with frame characteristics reported in the paragraphs 5/6/7/8 (mode S, T, R, C).

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 17 of 24 www.mipot.com 7. Temperature Range Curves Note: All RF parameters measured with input (pad F1) connected to a 50 Ω impedance signal source or load. EU version: 86,0 91,0 96,0 101,0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 85 Current mA Temp °C TX Current Drain vs. Temperature (CW mode) VDD = 2.1 V VDD = 3.0 V VDD = 3.6 V 12,0 13,0 14,0 15,0 16,0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 85 Power dBm Temp °C Output TX Power vs. Temperature (CW mode) VDD = 2.1 V VDD = 3.0 V VDD = 3.6 V

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 18 of 24 www.mipot.com US version: 8. Safety note To meet safety requirements, the module must be powered by an external power source that meets limits of ES1 and PS1 according to IEC 62368-1. 9. Exposure assessment (only for US version) A conservative evaluation distance of 20 cm has been used to perform the assessment. The Maximum Gain to meet FCC Radiofrequency radiation exposure limits is: Technology/Mode Band Frequency (MHz) Distance (cm) FCC General Population Limit (mW/cm2) Maximum Gain to comply with RF Exposure Limits (dBi) LoRa ISM (USA) 902 - 928 20 0.60 16.10 This device must be kept at a safety distance of at least 20 cm from the human body while in use to comply with the Radiofrequency exposure limits. 90,0 95,0 100,0 105,0 110,0 115,0 120,0 125,0 130,0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 85 Current mA TX Current Drain vs. Temperature (CW mode) VDD = 2.1 V VDD = 3.0 V VDD = 3.6 V 16,0 16,5 17,0 17,5 18,0 18,5 19,0 19,5 20,0 20,5 21,0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 85 Power dBm Output TX Power vs. Temperature (CW mode) VDD = 2.1 V VDD = 3.0 V VDD = 3.6 V

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 19 of 24 www.mipot.com 10. Antenna details To perform the assessments the following antenna has been used as reference: Antenna model 2J0B15 – C885G Parameters 868/915 MHz ISM Antenna Standards ZigBee, ISM, SIGFOX, LoRa Band (MHz) 868 915 Frequency (MHz) 863 - 870 902 – 928 Return Loss (dB) -7.8 -8.0 VSWR 2.4:1 2.4:1 Efficiency (%) 66.1 75.2 Peak Gain (dBi) 2.7 3.3 Average Gain (dB) -1.8 -1.2 Impedance (Ω) 50 Polarization Linear Radiation Pattern Omni-Directional Max. Input Power (W) 25

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 20 of 24 www.mipot.com 11. Supporting Documentation Title Description Doc Notes Command Reference Manual Description of commands for the wM-Bus stack 3200150xAxx_Com_Ref Command Reference Manual Description of commands for the LoRaWAN stack 3200150xBxx_Com_Ref Command Reference Manual Description of commands for the LoRa Mipot stack 3200150xCxx_Com_Ref Command Reference Manual Description of commands for the LoRa Modem stack 3200150xDxx_Com_Ref Command Reference Manual Description of commands for the multi-stack module 3200150xDSM_Com_Ref Manufacturing Process Information for LGA MiP Series Modules Packaging information, Tape& Reel Specification, Reflow soldering information AN_MNF002 STM32WL55J data sheet Overview of the MCU and its peripherals DS13293 (from ST) 1 STM32WL55J reference manual Detailed description of the MCU and its peripherals RM0453 (from ST) 1 Notes: 1) Only for 32001506

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 21 of 24 www.mipot.com 12. Ordering Information Title Description Do C 32001505AEU MiP-Wm-1C128N-EU Europe 32001505BEU MiP-Lw-1C128N-EU Europe 32001505CEU MiP-LoMi-1C128N-EU Europe 32001505DEU MiP-LoMo-1C128N-EU Europe 32001505FEU MiP-LwMo-1C128N-EU Europe 32001505GEU MiP-WmLw-1C128N-EU Europe Title Description DoC 32001506AEU MiP-Wm-2C256N-EU Europe 32001506BEU MiP-Lw-2C256N-EU Europe 32001506CEU MiP-LoMi-2C256N-EU Europe 32001506DEU MiP-LoMo-2C256N-EU Europe 32001506FEU MiP-LwMo-2C256N-EU Europe 32001506GEU MiP-WmLw-2C256N-EU Europe Title Description DoC 32001505AUS MiP-Wm-1C128N-US United States 32001505BUS MiP-Lw-1C128N-US United States 32001505CUS MiP-LoMi-1C128N-US United States 32001505DUS MiP-LoMo-1C128N-US United States 32001505FUS MiP-LwMo-1C128N-US United States 32001505GUS MiP-WmLw-1C128N-US United States Title Description DoC 32001506AUS MiP-Wm-2C256N-US United States 32001506BUS MiP-Lw-2C256N-US United States 32001506CUS MiP-LoMi-2C256N-US United States 32001506DUS MiP-LoMo-2C256N-US United States 32001506FUS MiP-LwMo-2C256N-US United States 32001506GUS MiP-WmLw-2C256N-US United States

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 22 of 24 www.mipot.com Example 3200150 5 A EU Core 5 = Single core module 6 = Dual core module Stack Radio A = wM-Bus B = LoRaWAN C = LoRa Mipot D = LoRa Modem F = LoRaWAN + LoRa Modem G = wM-Bus + LoRaWAN Region EU = Europe (UE) US = United States/Canada

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 23 of 24 www.mipot.com 13. Regulatory Approvals EU version: Doc Title Description DoC 32001505BEU_DoC Declaration of Conformity DoI 32001505BEU_DoI Declaration of Identity US version: Models: 32001505AUS, 32001505BUS, 32001505CUS, 32001505DUS, 32001505FUS, 32001506AUS, 32001506BUS, 32001506CUS, 32001506DUS, 32001506FUS U.S. FCC ID: 2AQJP-MIP This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference rec eived, including interference that may cause undesired operation. Doc Title Description DoI 32001505xUS_DoI Declaration of Identity CANADA IC: 28566-MIP HVIN: 32M01514A PMN: 32001505BUS HVIN: 32M01514A HMN: - FVIN: - This device contains licence -exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence -exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device.

Wireless Protocol Modules MiP Series – Data Sheet 3200150X_Datasheet_rev0.1.pdf Page 24 of 24 www.mipot.com 14. Revision History Revision Date Description 0.0 19.03.2025 Preliminary - Draft 0.1 20.11.2025 Added sensitivity values for wM-Bus (EU version)

Product Information

32001506BUS specifications and overview.

Summary

Wireless Protocol Modules MiP Series 3200150X Family rev0.1.

Description

Wireless Protocol Modules MiP Series 3200150X Family rev0.1.

Source title 32001506BUS Datasheet(PDF) - MIPOT S.p.A.

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