MLX90316_13 MELEXIS | Alldatasheet
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Technical content
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/boxshadowdwn Absolute Rotary Position Sensor IC /boxshadowdwn Simple & Robust Magnetic Design /boxshadowdwn Tria ⊗ is® Hall Technology /boxshadowdwn Programmable Angular Range up to 360 Degrees /boxshadowdwn Programmable Linear Transfer Characteristic /boxshadowdwn Selectable Analog (Ratiometric), PWM, Serial Proto col /boxshadowdwn 12 bit Angular Resolution - 10 bit Angular Thermal Accuracy /boxshadowdwn 40 bit ID Number /boxshadowdwn Single Die – SO8 Package RoHS Compliant /boxshadowdwn Dual Die (Full Redundant) – TSSOP16 Package RoHS C ompliant
Applications
/boxshadowdwn Absolute Rotary Position Sensor /boxshadowdwn Steering Wheel Position Sensor /boxshadowdwn Pedal Position Sensor /boxshadowdwn Motor-shaft Position Sensor /boxshadowdwn Throttle Position Sensor /boxshadowdwn Float-Level Sensor /boxshadowdwn Ride Height Position Sensor /boxshadowdwn Non-Contacting Potentiometer Ordering Code Product Code Temperature Code Package Code Option Code Packing Form Code MLX90316 S DC BCG-000 RE MLX90316 S DC BCG-000 TU MLX90316 E DC BCG-000 RE MLX90316 E DC BCG-000 TU MLX90316 K DC BCG-000 RE MLX90316 K DC BCG-000 TU MLX90316 L DC BCG-000 RE MLX90316 L DC BCG-000 TU MLX90316 E GO BCG-000 RE MLX90316 E GO BCG-000 TU MLX90316 K GO BCG-000 RE MLX90316 K GO BCG-000 TU MLX90316 L GO BCG-000 RE MLX90316 L GO BCG-000 TU MLX90316 K DC BCG-200 RE MLX90316 K DC BCG-200 TU MLX90316 K GO BCG-200 RE MLX90316 K GO BCG-200 TU MLX90316 K DC BCG-300 RE MLX90316 K DC BCG-300 TU MLX90316 K GO BCG-300 RE MLX90316 K GO BCG-300 TU MLX90316 E DC BDG-100 RE MLX90316 E DC BDG-100 TU
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Temperature Code: L for Temperature Range -40° C to 150° C E for Temperature Range -40° C to 85° C K for Temperature Range -40° C to 125° C S for Temperature Range -20° C to 85° C GO for TSSOP173 Option Code: AAA-xxx: die version xxx-000: standard xxx-100: SPI xxx-102: SPI75AGC, see section 14.4.2 xxx-200: PPA (Pre-programmed Analog) xxx-300: PPD (Pre-programmed Digital) Packing Form: RE for Reel, TU for Tube
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- Functional Diagram Figure 1 - Block Diagram (Analog & PWM) Figure 2 - Block Diagram Analog (MLX90316BCS) Figure 3 - Block Diagram (Serial Protocol) DSP VSS VDD 3V3 Reg MUX µC ROMTiTF/W RAM EEP ROM Vy Vx Tria /circlexbld/circlexbld /circlexbld/circlexbldis ™ A D D A G Rev.Pol. OverVolt. OUT (Analog/PWM) xT1 SWITCH TO UT 14i DSP VSS VDD 3V3 Reg MUX µC ROMTi F/W RAM EEP ROM Vy Vx Tria /circlexbld/circlexbld /circlexbld/circlexbldis ™ A D D A G Rev.Pol. OverVolt. OUT2T (Analog) xT1 SWITCH TO UT 14i1 xT1 OUT1T (Analog) DSP VSS VDD 3V3 Reg MUX µC ROMTiTF/W RAM EEP ROM Vy Vx Tria /circlexbld/circlexbld /circlexbld/circlexbldis ™ A D G Rev.Pol. 14i15 SERIAL TP ROTOCOL /SS SCLK MOSI/MISO
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- Description The MLX90316 is a monolithic sensor IC featuring the T ria ⊗ is® Hall technology. Conventional planar Hall technology is only sensitive to the flux density applied orthogonally to the IC surface. The Tria ⊗ is® Hall sensor is also sensitive to the flux density applied para llel to the IC surface. This is obtained through an Integrated Magneto-Concentrator (IMC ) which is deposited on the CMOS die (as an additiona l back-end step). The MLX90316 is only sensitive to the flux density copla nar with the IC surface. This allows the MLX90316 with the correct magnetic circuit to decode the absolute rotary (angular) position from 0 to 360 Degrees. It enables the design of novel generation o f non-contacting rotary position sensors that are frequently required for both automotive and industria l applications. In combination with the appropriate signal processing , the magnetic flux density of a small magnet (diametral magnetization) rotating above the IC can be measured in a non-contacting way (Figure 4). The angular information is computed from both vectorial co mponents of the flux density (i.e. B X and B Y). MLX90316 produces an output signal proportional to the decoded angle. The output is selectable between Analog, PWM and Serial Protocol. Figure 4 - Typical application of MLX90316
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- 18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
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- Glossary of Terms −− −− Abbreviations −− −− Acronyms /head2right Gauss (G), Tesla (T): Units for the magnetic flux de nsity − 1 mT = 10 G /head2right TC: Temperature Coefficient (in ppm/Deg.C.) /head2right NC: Not Connected /head2right PWM: Pulse Width Modulation /head2right % DC : Duty Cycle of the output signal i.e. T ON /(T ON + T OFF ) /head2right ADC: Analog-to-Digital Converter /head2right DAC: Digital-to-Analog Converter /head2right LSB: Least Significant Bit /head2right MSB: Most Significant Bit /head2right DNL: Differential Non-Linearity /head2right INL: Integral Non-Linearity /head2right RISC: Reduced Instruction Set Computer /head2right ASP: Analog Signal Processing /head2right DSP: Digital Signal Processing /head2right ATAN: trigonometric function: arctangent (or inverse tangent) /head2right IMC: Integrated Magneto-Concentrator (IMC ) /head2right CoRDiC: Co ordinate Rotation Di gital Computer (i.e. iterative rectangular-to-polar transform ) /head2right EMC: Electro-Magnetic Compatibility 4. Pinout PinG#G SOICp8G TSSOPp16G AnalogG/GPWMG SerialGProtocolG AnalogG/GPWMG SerialGProtocolG 1L V DD L V DD L V DIG 1L V DIG 1L 2L TestL0L TestL0L V SS 1L(Ground 1)L V SS 1L(Ground 1)L 3L SwitchLOutL /SSL V DD 1L V DD 1L 4L NotLUsedL/LOutL2 (1)L SCLKL TestL0 1L TestL0 1L 5L OutL MOSIL/LMISOL SwitchLOut 2L /SS 2L 6L TestL1L TestL1L NotLUsed 2L SCLK 2L 7L V DIG L V DIG L Out 2L MOSI 2L/LMISO 2L 8L V SS L(Ground)L V SS L(Ground)L TestL1 2L TestL1 2L 9L L V DIG 2L V DIG 2L 10L VSS 2L(Ground 2)L V SS 2L(Ground 2)L 11L VDD 2L V DD 2L 12L TestL02L TestL0 2L 13L SwitchLOut 1L /SS 1L 14L NotLUsed 1L SCLK 1L 15L Out 1L MOSI 1L/LMISO 1L 16L TestL11L TestL1 1L For optimal EMC behavior, it is recommended to connect the unused pins ( NotLUsed and Test ) to the Ground (see section 17). 1LMLX90316xDCaBCSLincludesLaLprogrammableLsecondLoutputL L
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- Absolute Maximum Ratings Parameter Value SupplyLVoltage,LVDD L(overvoltage)L +L20LVL ReverseLVoltageLProtectionL − L10LVL PositiveLOutputLVoltageL–LStandardLVersionL (AnalogLorLPWM)L +L10LVL +L14LVL(200LsLmaxL − LT AL=L +L25 °C)LL PositiveLOutputLVoltageL–LSPILVersionL V DD L+L0.3VL PositiveLOutputLVoltageL(SwitchLOut)L +L10LVL +L14LVL(200LsLmaxL − LTAL=L +L25 °C)L OutputLCurrentL(IOUT )L ±L30LmAL ReverseLOutputLVoltageL − L0.3LVL ReverseLOutputLCurrentL − L50LmAL OperatingLAmbientLTemperatureLRange,LT AL − L40°CL … L+L150 °CL StorageLTemperatureLRange,LT SL − L40°CL … L+L150°CL MagneticLFluxLDensityL ±L700LmTL Exceeding the absolute maximum ratings may cause permane nt damage. Exposure to absolute- maximum-rated conditions for extended periods may af fect device reliability. 6. Detailed Description As described on the block diagram (Figure 1, Figure 2 and Figure 3), the magnetic flux density parallel to the IC surface (i.e. B // ) is sensed through the Tria ⊗ is® sensor front-end. This front-end consists into two orthogonal pairs (for each of the two directions para llel with the IC surface i.e. X and Y) of conventional planar Hall plates (blue area on Figure 5) and an I ntegrated Magneto-Concentrator (IMC yellow disk on Figure 5). Figure 5 - Tria ⊗ is® sensor front-end (4 Hall plates + IMC disk) Hall Plates
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Both components of the applied flux density B // are measured individually i.e. B X// and B Y// . Two orthogonal components (respectively B X⊥ and B Y⊥ ) proportional to the parallel components (respectiv ely B X// and B Y// ) are induced through the IMC and can be measured by both respective pairs of conventional planar Hall plates as those are sensitive to the flux density applied orthogonally to them and the IC surface. While a magnet (diametrically magnetized) rotates ab ove the IC as described on Figure 4, the sensing stage provides two differential signals in quadrature (sine and cosine − Figure 6 and Figure 7) Figure 6 – Magnetic Flux Density – B X ∝ cos( α ) & B Y ∝ sin( α ) Figure 7 – Tria ⊗ is® sensor front-end − Output signals − VX ∝ BX ∝ cos( α ) & V Y ∝ BY ∝ sin( α ) -400 -300 -200 -100 100 200 300 400 0 90 180 270 360 450 540 630 720 Alpha (Degree) BX & B Y (G) BX BY -2000 -1500 -1000 -500 500 1000 1500 2000 0 90 180 270 360 450 540 630 720 Alpha (Degree) VX & V Y (mV) VX VY
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Those Hall signals are processed through a fully diff erential analog chain featuring the classic offset cancellation technique (Hall plate quadrature spinning and chopper-stabilized amplifier). The conditioned analog signals are converted through a n ADC (configurable − 14 or 15 bits) and provided to a DSP block for further processing. The DSP stage i s based on a 16 bit RISC micro-controller whose primary function is the extraction of the angular posi tion from the two raw signals (after so-called fron t-end compensation steps) through the following operation: X Y V VATAN α The DSP functionality is governed by the micro-code (f irmware − F/W) of the micro-controller which is stored into the ROM (mask programmable). In addition to the ″ ATAN ″ function, the F/W controls the whole analog chain, the output transfer characteristic, the output protocol, the programming/calibration and also the self-diagnostic modes. In the MLX90316, the ″ ATAN ″ function is computed via a look-up table (i.e. it is not obtained through a CoRDiC algorithm). Due to the fact that the ″ ATAN ″ operation is performed on the ratio ″ V Y/V X″ , the angular information is intrinsically self-compensated vs. flux density variation s (due to airgap change, thermal or ageing effects) affecting both signals. This feature allows therefore a n improved thermal accuracy vs. rotary position sensor based on conventional linear Hall sensors. In addition to the improved thermal accuracy, the realized rotary position sensor is capable of measuring a complete revolution (360 Degrees) and the linearity pe rformances are excellent taking into account typical manufacturing tolerances (e.g. relative placement betwe en the Hall IC and the magnet). Once the angular information is computed (over 360 de grees), it is further conditioned (mapped) vs. the target transfer characteristic and it is provided at the output(s) as:
- an analog output level through a 12 bit DAC followe d by a buffer
- a digital PWM signal with 12 bit depth (programmabl e frequency 100 Hz … 1 kHz)
- a digital Serial Protocol (SP − 14 bits computed angular information available) For instance, the analog output can be programmed fo r offset, gain and clamping to meet any rotary position sensor output transfer characteristic: Vout( α ) = ClampLo for α ≤ α min Vout( α ) = Voffset + Gain × α for α min ≤ α ≤ α max Vout( α ) = ClampHi for α ≥ α max where Voffset, Gain, ClampLo and ClampHi are the mai n adjustable parameters for the end-user. The linear part of the transfer curve can be adjusted t hrough either a 2 point or a 3 point calibration depending on the linearity requirement. A digital output is also available and used as a programmable angular switch. The calibration parameters are stored in EEPROM featuring a Hamming Error Correction Coding (ECC). The programming steps do not require any dedicated pin s. The operation is done using the supply and output nodes of the IC. The programming of the MLX90 316 is handled at both engineering lab and production line levels by the Melexis Programming Unit PTC-04 with the dedicated MLX90316 daughterboard and software tools (DLL − User Interface).
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- MLX90316 Electrical Specification DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Test Conditions Min Typ Max Units NominalLSupplyLVoltageL V DD L L 4.5L 5L 5.5L VL SupplyLCurrent (2)L IddL SlowLmode (3)L FastLmode (3)L L 8.5L 13.5L 11L 16L mAL mAL PORLLevelL V DDLPORL SupplyLUnderLVoltageL 2L 2.7L 3L VL OutputLCurrentL IoutL AnalogLOutputLmodeL PWMLOutputLmodeL a8L a20L L 8L 20L mAL mAL OutputLShortLCircuitLCurrentL I short L VoutL=L0LVL VoutL=L5LVL VoutL=L14LVL(T AL=L25°C)L L 12L 12L 24L 15L 15L 45L mAL mAL mAL OutputLLoadL R LL PulladownLtoLGroundLL PullaupLtoL5V (4)L 10L 10L (5)L ∞ (5)LL kΩ L kΩ L AnalogLSaturationLOutputLLevelL Vsat_loL PullaupLloadLR LL≥ L10LkΩL L L 3L %VDD L Vsat_hiL PulladownLloadLR LL≥ L10LkΩL 96L L L %VDD L DigitalLSaturationLOutputLLevelL VsatD_loL PullaupLLowLSideLRLL≥ L10LkΩL PushaPullL(I OUT L=La20mA)L L L 1.5L %V DD L VsatD_hiL PushaPullL(I OUT L=L20mA)L 97L L L %V DD L ActiveLDiagnosticLOutputLLevelL Diag_loL PulladownLloadLR LL≥ L10LkΩL PullaupLloadLR LL≥ L10LkΩL L L 1L 1.5L %VDD L Diag_hiL PulladownLloadLR LL≥ L10LkΩL PullaupLloadLR LL≥ L10LkΩL 97L 98L L L %V DD L PassiveLDiagnosticLOutputLLevelL (BrokenLTrackLDiagnostic) L(6)L BV SS PDL BrokenLV SS (7)L&LL PulladownLloadLR LL≤L10LkΩL L L 4 (6)L %V DD L BV SS PUL BrokenLV SS (7)L&L PullaupLloadLR LL≥ L1kΩL 99L 100L L %V DD L BV DD PDL BrokenLV DD (7)L&LL PulladownLloadLR LL≥ L1kΩL L 0L 1L %V DD L BV DD PUL BrokenLV DD L&L PullaupLloadLtoL5VL NoLBrokenLTrackLdiagnosticL %V DD L …MLX 90316 Electrical Specification L 2LForLtheLdualLversion,LtheLsupplyLcurrentLisLmultipliedLbyL2L 3LSeeLsectionL14.4.1LforLdetailsLconcerningLSlowLandLFastLmode L 4LApplicableLforLoutputLinLAnalogLandLPWML(OpenaDrain)Lmodes L 5LRLL<L ∞ LforLoutputLinLPWMLmode L 6LForLdetailedLinformation,LseeLalsoLsectionL15L 7LNotLValidLforLtheLSPILVersionL
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Clamp_loL ProgrammableL 0L L 100L %V DD (8)L Clamp_hiL ProgrammableL 0L L 100L %V DD (8)L SwitchLOut (9)L Sw_loL PullaupLLoadL1.5kLtoL5VL 0.55L L 1.1L VL Sw_hiL PullaupLLoadL1.5kLtoL5VL 3.65L L 4.35L VL As an illustration of the previous table, the MLX9031 6 fits the typical classification of the output span described on the Figure 8. Figure 8 - Output Span Classification 8LClampingLlevelsLneedLtoLbeLconsideredLvsLtheLsaturationLofLtheLoutputLstageL(seeLVsat_loLandLVsat_hi)L 9LSeeLsectionL14.1.4LforLtheLapplicationLdiagramL L L L L L DiagnosticTBandT(High) LinearTRange DiagnosticTBandT(Low) ClampingTHigh ClampingTLow 0T% 10T% 20T% 30T% 40T% 50T% 60T% 70T% 80T% 90T% 100T% 96T% 4T% Output Level 92T% 88T% 12T% 8T%
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- MLX90316 Isolation Specification DC Operating Parameters at V DD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Only valid for the package code GO i.e. dual die version. Parameter Symbol Test Conditions Min Typ Max Units IsolationLResistanceL L BetweenL2LdiesL 4L L L MΩL T T T T 9. MLX90316 Timing Specification DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Test Conditions Min Typ Max Units MainLClockLFrequencyL CkL SlowLmode (10)L FastLmode (10)L L 7L 20L L MHzL MHzL SamplingLRateL L SlowLmode (11)L FastLmode (11)L L 600L 200L L µsL µsL StepLResponseLTimeL TsL SlowLmode (10),LFilter=5 (11)L FastLmode (10),LFilter=0 (11)L L L 400L 600L msL µsL WatchdogL WdL SeeLSectionL15L L L 5L msL StartaupLCycleL TsuL SlowLandLFastLmode (10)L L L 15L msL AnalogLOutputLSlewLRateL L C OUT L=L42LnFL COUT L=L100LnFL L 200L 100L L V/msL PWMLFrequencyL F PWM L PWMLOutputLEnabledL 100L L 1000L HzL DigitalLOutputLRiseLTimeL L ModeL5L–L10nF,LR LL=L10LkΩL ModeL7L–L10nF,LRLL=L10LkΩL L 120L 2.2L L µsL µsL DigitalLOutputLFallLTimeL L ModeL5L–L10nF,LR LL=L10LkΩL ModeL7L–L10nF,LRLL=L10LkΩL L 1.8L 1.9L L µsL µsL 10LSeeLsectionL14.4.1LforLdetailsLconcerningLSlowLandLFastLmode L 11LSeeLsectionL14.5LforLdetailsLconcerningLFilterLparameter L
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- MLX90316 Accuracy Specification DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Test Conditions Min Typ Max Units ADCLResolutionLonLtheLrawL signalsLsineLandLcosineL RADC L SlowLMode (12)L FastLMode (12)LL L 15L 14L L bitsL bitsL ThermalLOffsetLDriftLL#1 (13)L L ThermalLOffsetLDriftLatLtheLDSPLL inputL(excl.LDACLandLoutputLstage) L TemperatureLsuffixLS,LELandLKL TemperatureLsuffixLLL L L a60L a90L L L L L +60L +90L L L LSB 15L LSB 15LL ThermalLOffsetLDriftL#2L (toLbeLconsideredLonlyLforLtheL analogLoutputLmode)L L ThermalLOffsetLDriftLLofLtheLDACLL andLOutputLStageL TemperatureLsuffixLS,LELandLKL TemperatureLsuffixLLL L L aL0.3L aL0.4L L L L +L0.3L +L0.4L L L DDL %V DD L ThermalLDriftLofLSensitivityL Mismatch (14)L L TemperatureLsuffixLS,LELandLKL TemperatureLsuffixLLL aL0.3L aL0.5L L +L0.3L +L0.5L IntrinsicLLinearityLError (15)L LeL TAL=L25 °CL a1L L 1L DegL AnalogLOutputLResolutionL R DAC L 12LbitsLDACL (TheoreticalL–LNoiseLfree)L INLL DNLL L L a4L a2L 0.025L L L L L L +4L +2L DD /LSBL L LSBL LSBL OutputLstageLNoiseL L ClampedLOutputL L 0.05L L %V DD L NoiseLpkapk (16)L L RGL=L9,LSlowLmode,LFilter=5L RGL=L9,LFastLmode,LFilter=0L L 0.03L 0.1L 0.06L 0.2L DegL DegL RatiometryLErrorL L L a0.1L 0L 0.1L %V DD L PWMLOutputLResolutionL R PWM L 12LbitsL (TheoreticalL–LJitterLfree)L L 0.025L L L % DC /LSBL L PWMLJitter (17)L J PWM L RGL=L6,LF PWM L=L250LHzL–L800HzL L L 0.2L % DC L SerialLProtocolLOutputL ResolutionL R SP L 14LbitsL–L360LDeg.L Mapping(TheoreticalL–LJitterLfree)L L 0.022L L Deg/LSBL T 12 L15LbitsLcorrespondsLtoL14LbitsL+LsignLandL14LbitsLcorrespondsLtoL13LbitsL+Lsign.LAfterLangularLcalculation,LthisLcorrespondsLtoL 0.005Deg/LSB 15 LinLLowLSpeedLModeLandL0.01Deg/LSB 14 LinLHighLSpeed.L 13LForLinstance,LThermalLOffsetLDriftL#1LequalL±L60LSB15 LyieldsLtoLmax.L±L0.3LDeg.LangularLerrorLforLtheLcomputedLangularL informationL(outputLofLtheLDSP).LSeeLFrontLEndLApplicationLNoteLforLmoreLdetails.LThisLisLonlyLvalidLifLautomaticLgainLisLsetL(SeeL SectionL14.4.2)L 14LForLinstance,LThermalLDriftLofLSensitivityLMismatchLequalL±L0.4%LyieldsLtoLmax.L±L0.1LDeg.LangularLerrorLforLtheLcomputedL angularLinformationL(outputLofLtheLDSP).LSeeLFrontLEndLApplicationLNoteLforLmoreLdetails.L 15LTheLIntrinsicLLinearityLErrorLrefersLtoLtheLICLitselfL(offset,LsensitivityLmismatch,Lorthogonality)LtakingLintoLaccountLanLidealL rotatingLfield.LOnceLassociatedLtoLaLpracticalLmagneticLconstructionLandLtheLassociatedLmechanicalLandLmagneticLtolerances,LtheL outputLlinearityLerrorLincreases.LHowever,LitLcanLbeLimprovedLwithLtheLmultiLpointLendauserLcalibrationLthatLisLavailableLonLtheL MLX90316.L 16LTheLapplicationLdiagramLusedLisLdescribedLinLtheLrecommendedLwiring.LForLdetailedLinformation,LreferLtoLsectionLFilterLinL applicationLmodeL(SectionL14.5).LL 17LJitterLisLdefinedLbyL±L3LσLforL1000LsuccessiveLacquisitionsLandLtheLslopeLofLtheLtransferLcurveLisL100% DC /360LDeg.L
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- MLX90316 Magnetic Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Test Conditions Min Typ Max Units MagneticLFluxLDensityL BL L 20L 50L 70 (18)L mTL MagnetLTemperatureLCoefficient L TCmL L a2400L L 0L ppm/°CL 12. MLX90316 CPU & Memory Specification The DSP is based on a 16 bit RISC µController.TThisT CPU provides 5 Mips while running at 20 MHz. Parameter Symbol Test Conditions Min Typ Max Units ROML L L L 10L L kBL RAML L L L 256L L BL EEPROML L L L 128L L BL 18 LAboveL70LmT,LtheLIMCLstartsLsaturatingLyieldingLtoLanLincreaseLofLtheLlinearityLerror.L
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- MLX90316 End-User Programmable Items Parameter Comments Default Values STANDARD G SPIG/G SPI75AGC G PPAG PPDG #GbitG OutputLModeL DefineLtheLoutputLstageLmodeL 4L N/AL 4L 7L 3L MLX90316BCSL 2L N/AL 2L N/AL 3L PWMPOL1L PWMLPolarityL 0L N/AL N/AL 1L 1L PWMTL PWMLFrequencyL 1000hL N/AL N/AL 1kHzL 16L CLOCKWISEL L 0L 0L 0L 1L 1L DPL DiscontinuityLPointL 0hL 0hL 0hL 0hL 15L LNR_S0L InitialLSlopeL 0hL N/AL N/AL N/AL 16L LNR_A_XL AXLCoordinateL 8000hL 0L 0L 0L 16L LNR_A_YL AYLCoordinateL 0hL 0%L 10%L 10%L 16L LNR_A_SL ASLCoordinateL 0hL 100%/360d L80%/360d L80%/360d L 16L LNR_B_XL BXLCoordinateL FFFFhL FFFFhL FFFFhL FFFFhL 16L LNR_B_YL BYLCoordinateL 0hL FFFFhL FFFFhL FFFFhL 16L LNR_B_SL BSLCoordinateL 0hL N/AL N/AL N/AL 16L LNR_C_XL CXLCoordinateL FFFFhL FFFFhL FFFFhL FFFFhL 16L LNR_C_YL CYLCoordinateL FFFFhL FFFFhL FFFFhL FFFFhL 16L LNR_C_SL CSLCoordinateL 0hL N/AL N/AL N/AL 16L CLAMP_HIGHL ClampingLHighL 8%L 0%L 10%L 10%L 16L CLAMP_LOWL ClampingLLowL 8%L 100%L 90%L 90%L 16L KDL SwitchLOutL FFFFhL FFFFhL FFFFhL FFFFhL 16L MLX90316BCSL 0L N/AL FFFFhL N/AL 16L KDHYSTL HysteresisLonLtheLSwitchLOutL N/AL N/AL N/AL N/A L 8L DEADZONEL L 0L 0L 0L 0L 8L FHYSTL L 4L 0L 0L 0L 8L MLX90316BCSL 0L N/AL 0L N/AL 8L MLXID1L/LMLXID2L/LMLXID3L L MLXL MLXL MLXL MLXL 16L CUSTID1L L 1L 1L 1L 1L 8L CUSTID2 (20)L L 6 (19)L 19L/L36L 16L 20L 16L CUSTID3L L MLXL MLXL MLXL MLXL 16L FREE2L L 0L 0L 0L 0L 8L MLX90316BCSL 0L N/AL 2AhL N/AL 16L FILTERL L 5L 0L 2L 5L 16L FILTERLA1 (20)L FilterLcoefficientLA1LforLFILTER=6L 6600hL N/AL N/AL N /AL 16L FILTERLA2 (20)L FilterLcoefficientLA2LforLFILTER=6L 2A00hL N/AL N/AL N /AL 16L ARGCL AutoLGainLatLStartLUpL 0L 1L 1L 1L 1L MLX90316BCSL 0L N/AL 1L N/AL 1L HIGHSPEEDL L 0L 1L 0L 1L 1L End-User Programmable Items continues... L 19 LForLMLX90316SDC–BCG–STANDARD,LtheLCUSTUMERID2LparameterLmightLdifferLfromLtheLgivenLvalueL(28dLinsteadLofL6d)L
20 LNotLavailableLinLMLX90316xDCLaBCSL
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… End-User Programmable Items L FSWAPL L 1L 1L 0L 1L 1L FORCECRA75L RadiusLAdjustmentLtoL75%L 0L 0L/L1L 0L 0L 1L AUTO_RGL AutomaticLRoughLGainLSelectionL 0L 1L 1L 1L 1L RoughGainL L 9L 0L 3L 0L 8L MLX90316BCSL 6L N/AL 3L N/AL 8L RGThresLL L 0L 0L 0L 0L 4L RGThresHL L 15L 15L 15L 15L 4L EEHAMHOLEL L 3131hL 0L 0L 0L 16L RESONFAULTL L 0L 1L 1L 1L 2L MLXLOCKL L 0L 1L 1L 1L 1L LOCKL L 0L 1L 1L 1L 1L MLX90316BCSL 0L N/AL 0L N/AL 1L Parameter for MLX90316xDC-BCS only L OUT2ENL L 1L N/AL 1L N/AL 1L OUT2LSLOPELRATIOL WasLCUSTUMERID2L N/AL N/AL a1L N/AL 8L OUT2LOFFSETL L MLXL N/AL 100%L N/AL 8L CLAMP_LOWLOUT2L L 8%L N/AL 10%L N/AL 16L CLAMP_HIGHLOUT2L L 8%L N/AL 90%L N/AL 16L 14. Description of End-User Programmable Items 14.1. Output Mode The MLX90316 output type is defined by the Output Mo de parameter. Parameter Value Description AnalogLOutputLModeL 2,L4L AnalogLRailatoaRailL PWMLOutputLModeL 5L LowLSideL(NMOS)L PushaPullL SerialL N/AL LowLSideL(NMOS)L 14.1.1. Analog Output Mode The Analog Output Mode is a rail-to-rail and ratiom etric output with a push-pull output stage configura tion allows the use of a pull-up or pull-down resistor. 14.1.2. PWM Output Mode If one of the PWM Output modes is selected, the output signal is a digital signal with Pulse Width Modulation (PWM). In mode 5, the output stage is an open drain NMOS tr ansistor (low side), to be used with a pull-up resistor to V DD . In mode 7, the output stage is a push-pull stage for which Melexis recommends the use of a pull-up resistor to V DD . The PWM polarity is selected by the PWMPOL1 parameter :
- PWMPOL1 = 0 for a low level at 100%
- PWMPOL1 = 1 for a high level at 100%
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The PWM frequency is selected by the PWMT parameter. PWM Frequency Code (based on typical main clock fre quency) Oscillator Mode Pulse-Width Modulation Frequency (Hz) 100 200 500 1000 LowLSpeedL ~35000L ~17500L ~7000L ~3500L HighLSpeedL aL ~50000L ~20000L ~10000L For instance, in Low Speed Mode, set PWMT=7000 (decim al) to set the PWM frequency around 500Hz (21). 14.1.3. Serial Protocol Output Mode The MLX90316 features a digital Serial Protocol mode . The MLX90316 is considered as a Slave node. See the dedicated Serial Protocol section for a full d escription (Section 16). 14.1.4. Switch Out Parameter Value Unit KD 0…359.9999 deg KDHYST 0 … 1.4 deg The switch is activated (Sw_lo) when the digital angl e is greater than the value stored in the KD parameter. This angle refers to the internal angular reference linked to the parameter DP and not to the absolute physical 0° angle. The KDHYST defines the hysteresis amplitude around t he Switch point. The switch is actually activated if the digital angle is greater than KD+KDHYST. It is deactivated if the digital angle is less than KD-KDHYST. The mandatory application diagram to use this feature is depicted in the Figure 9. See section 7 for the electrical characteristic. If the Switch feature is not used in the application, the output pin needs to be connected to the ground. FigureL9L–LApplicationLDiagramLforLtheLSwitchLOutL 21 LInLorderLtoLcompensateLtheLlotLtoLlotLvariationLofLtheLmainLclockLfrequencyL(Ck),LMelexisLstronglyLrecommendsLtrimmingLtheL PWMLfrequencyLduringLEOLLprogrammingL(seeLtheLPTCa04Ldocumentation).LLLL SWITCH OUT 1k5 5 V ECU toTuC I/O Port 125 ΩΩΩΩ 175 ΩΩ ΩΩ 6kΩΩΩΩ 100 nF MLX90316
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14.2. Output Transfer Characteristic Parameter Value Unit CLOCKWISE 0 /barb2right CCW 1 /barb2right CW DP 0 … 359.9999 deg LNR_A_X LNR_B_X LNR_C_X 0 … 359.9999 deg LNR_A_Y LNR_B_Y LNR_C_Y 0 … 100 % LNR_S0 LNR_A_S LNR_B_S 0 … 17 %/deg LNR_C_S -17 … 0 … 17 %/deg CLAMP_LOW 0 … 100 % CLAMP_HIGH 0 … 100 % DEADZONE 0 … 359.9999 deg MLX90316 xDC – BCS only OUT2 SLOPE RATIO -8 … 0 … 8 - OUT2 OFFSET -400 … 400 % CLAMP_LOW OUT2 0 … 100 % CLAMP_HIGH OUT2 0 … 100 % 14.2.1. CLOCKWISE Parameter The CLOCKWISE parameter defines the magnet rotation direction.
- CCW is the defined by the 1-4-5-8 pin order directio n for the SOIC8 package and 1-8-9-16 pin order direction for the TSSOP16 package.
- CW is defined by the reverse direction: 8-5-4-1 pin order direction for the SOIC8 and 16-9-8-1 pin order direction for the TSSOP16 package. Refer to the drawing in the IMC positioning sections (Section 20.3 and 20.6). 14.2.2. Discontinuity Point (or Zero Degree Point) The Discontinuity Point defines the 0° point on the circle. The discontinuity point places the origin at any location of the trigonometric circle. The DP is used as reference for all the angular measurements.
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Figure 10 - Discontinuity Point Positioning 14.2.3. LNR Parameters The LNR parameters, together with the clamping values, fully define the relation (the transfer function) between the digital angle and the output signal. The shape of the MLX90316 transfer function from the digital angle value to the output voltage is described by the drawing below. Six segments can be pr ogrammed but the clamping levels are necessarily flat. Two, three, or even five calibration points are the n available, reducing the overall non-linearity of th e IC by almost an order of magnitude each time. Three or five point calibration will be preferred by customers looking for excellent non-linearity figures. Two-point calibrations will be preferred by customers looking for a cheaper calibration set-up and shorter calibration time. A Slope LNR_A_S B C Slope LNR_B_S Slope LNR_C_S Slope LNR_S0 360 (Deg.) Clamping Low Clamping High LNR_A_X LNR_A_Y LNR_B_Y LNR_C_Y CLAMPHIGH CLAMPLOW 0 % 100 %
0 LNR_B_X LNR_C_X
14.2.4. CLAMPING Parameters The clamping levels are two independent values to li mit the output voltage range. The CLAMP_LOW parameter adjusts the minimum output voltage level. T he CLAMP_HIGH parameter sets the maximum output voltage level. Both parameters have 16 bits of adjustment. In analog mode, the resolution will be limited by the D/A converter (12 bits) to 0.024%V DD . In PWM mode, the resolution will be 0.024% DC . In SPI mode, the resolution is 14bits or 0.022deg over 3 60deg. 360° The placement of the discontinuity point (0 point) is programmable.
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14.2.5. DEADZONE Parameter The dead zone is defined as the angle window between 0 and 359.9999. When the digital angle lies in this zone, the IC is in fault mode (RESONFAULT must be set to “1” – See 14.6.1). 14.2.6. MLX90316 xDC- BCS ONLY The MLX90316 BCS firmware offers the possibility to p rogram a second output transfer characteristic of the single die version. The following formula is used in the 90316BxS: O UT 2 = O UT 2SlopeRatio * OUT 1 + O UT 2Offset Range O UT 2 = [ Clamp_Low OUT 2..Clamp_High OUT 2 ] O UT 2 SLOPE RATIO Controls the slope ratio O UT 1 vs O UT 2. The ratio can be positive or negative. The example of MLX90316LDC-BCS-PPA is given in the f igure below (slope = -1, OUT2 = -1 x slope O UT1 + 100 %). 14.3. Identification Parameter Value Unit MELEXSID1 MELEXSID2 MELEXSID3 0 … 65535 0 … 65535 0 … 65535 CUSTUMERID1 CUSTUMERID2 CUSTUMERID3 0 … 255 0 … 65535 0 … 65535 Identification number: 40 bits freely useable by Cust omer for traceability purpose. 360 (Deg.) 0 OUT 1 OUT 2 Output Level (%VDD) 100% 10% 90%
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14.4. Sensor Front-End Parameter Value Unit HIGHSPEED 0 = Slow mode 1 = Fast mode ARGC 0 = disable 1 = enable AUTO_RG 0 = disable 1 = enable RoughGain 0 … 15 RGThresL 0 … 15 RGThresH 0 … 15 14.4.1. HIGHSPEED Parameter The HIGHSPEED parameter defines the main frequency for the DSP.
- HIGHSPEED = 0 selects the Slow mode with a 7 MHz mas ter clock.
- HIGHSPEED = 1 selects the Fast mode with a 20 MHz mas ter clock. For better noise performance, the Slow Mode must be enabled. 14.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Par ameters AUTO_RG and ARGC parameters enable the automatic gai n control (AGC) of the analog chain. The AGC loop is based on X)²+ (VY)² = (Amplitude)² = (Radius)² and it targets an amplitude of 90% of the ADC input span. At Start-Up phase, the gain stored in the parameter RoughGain is always used. Depending of the AUTO_RG and ARGC settings, the AGC regulation acts as follow:
- If ARGC is set, the regulation proceeds by jump to r each the target gain. Note that this regulation is only valid if the starting gain does not saturate the ADC. Melexis recommendation is to use RoughGain ≤ 3 if ARGC=1.
- If ARGC is “0” and AUTO_RG is set to “1”, the regula tion adapts every cycle by one gain code the current gain to reach the 90% ADC span target. Note that if the value of RoughGain is too far from the actual gain, the chip will enter the norma l operating mode (after the Start-Up phase) with an incorrect gain which will cause the device to go i n diagnostic low (field too low/field too high – See section 15).
- If ARGC and AUTO_RG are “0”, the AGC regulation is off and the gain used is the value stored in the parameter RoughGain. Melexis does not advise the u se of this mode. The parameter AUTO_RG activates the automatic regulati on during normal operation of the device as background task. The parameter FORCECRA75 modifies the target of the AGC algorithm to 75% - instead of 90% - of the ADC span (at start-up and in normal operation).
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Melexis strongly recommend to set ARGC = “1”, AUTO_RG = “1” and RoughGain ≤ 3 for all types of application. If the magnetic specifications of the a pplication are well known and under control, the appropriate RoughGain can also be programmed with AR GC set to “0” and AUTO_RG to “1”. Please note that the angular errors listed in the se ction 10 are only valid if the AUTO_RG is activated. AUTO_RG avoids also the saturation of the analog chain and the associated linearity error. The current gain (RG) can be read out with the PTC-0 4 and gives a rough indication of the applied magnetic flux density (Amplitude). 14.4.3. RGThresL, RGThresH Parameters RGThresL & RGThresH define the boundaries within th e gain setting (Rough Gain) is allowed to vary. Outside this range, the output is set in diagnostic low. 14.5. FILTER Parameter Value Unit FHYST 0 … 11 ; step 0.04 deg FILTER 0… 6 FSWAP 0 The MLX90316 includes 3 types of filters:
- Hysteresis Filter: programmable by the FHYSTL parameter
- Low Pass FIR Filters controlled with the Filter parame ter
- Low Pass IIR Filter controlled with the Filter parame ter and the coefficients FILTER A1 and FILTER A2 Note: if the parameter FSWAP is set to “1”, the filt ering is active on the digital angle. If set to “0”, the filtering is active on the output transfer function. 14.5.1. Hysteresis Filter The FHYST parameter is a hysteresis filter. The outpu t value of the IC is not updated when the digital st ep is smaller than the programmed FHYST parameter value . The output value is modified when the increment is bigger than the hysteresis. The hysteresi s filter reduces therefore the resolution to a level compatible with the internal noise of the IC. The hy steresis must be programmed to a value close to the noise level. Please note that for the programmable version, the FHYST parameter is set to 4 by default. If you do not wish this feature, please set it to “0”. 14.5.2. FIR Filters The MLX90316 features 6 FIR filter modes controlled with Filter = 0…5. The transfer function is described below: in j i ij i i n xa a y −
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The characteristics of the filters no 0 to 5 is given in the Table 1. FilterGNoG(j)G 0G 1G 2G 3G 4G 5G TypeL DisableL FiniteLImpulseLResponseL CoefficientsLa 0…La 5L N/AL 110000L 121000L 133100L 111100L 122210L TitleL NoLFilterL ExtraLLightL LightL 90%LResponseLTimeL 1L 2L 3L 4L 4L 5L 99%LResponseLTimeL 1L 2L 3L 4L 4L 5L Table 1 - FIR Filters Selection Table Figure 11 - Step Response and Noise Response for FIR (No 3) and FHYST=10 FIR and HYST Filters : Step response Comparative Plot 30000 32000 34000 36000 38000 40000 0 5 10 15 20 25 30 Milliseconds [0..65535] Scale x(n) fir(n) hyst(n) FIR and HYST Filter : Gaussian white noise response 39800 39850 39900 39950 40000 40050 40100 40150 40200 0 50 100 150 Milliseconds [0..65535] Scale x(n) fir(n) hyst(n)
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14.5.3. IIR Filters The IIR Filter is enabled with Filter = 6. The diagram of the IIR Filter implemented in the MLX90316 is given in Figure 12. Only the parameter A1 and A2 are configurable (See Table 2). Figure 12 - IIR Diagram FilterGNoG 6G TypeL 2 nd LOrderLInfiniteLImpulseLResponseL(IIR)L TitleL MediumL&LStrongL 90%LResponseLTimeL 11L 16L 26L 40L 52L 100L EfficiencyLP2PL(dB)L 12.9L 14.6L 17.1L 18.8L 20L >20L CoefficientLA1L 26112L 28160L 29120L 30208L 31296L 31784L CoefficientLA2L 10752L 12288L 12992L 13952L 14976L 15412L Table 2 - IIR Filter Selection Table The Figure 13 shows the response of the filter to a Gaussian noise with default coefficient A1 and A2. Zi1 x(n) Zi1 Zi1 Zi1 y(n) b0 = 1 b1 = 2 b2 = 1 -a 1 -a 2
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Figure 13 - Noise Response for the IIR Filter 14.6. Programmable Diagnostic Settings Parameter Value Unit RESONFAULT 0 EEHAMHOLE 0 3131h 14.6.1. RESONFAULT Parameter This RESONFAULT parameter enables the soft reset when a fault is detected by the CPU when the parameter is set to 1. By default, the parameter is set to “0” but it is recommended to set it to “1” to activate the self diagnostic modes (See section 15). Note that in the User Interface (MLX90316UI), the RE SONFAULT is split in two bits:
- DRESONFAULT: disable the reset in case of a fault.
- DOUTINFAULT: disable output in diagnostic low in case of fault. 14.6.2. EEHAMHOLE Parameter The EEHAMHOLE parameter disables the CRC check and th e memory recovery (Hamming code) when it is equal to 3131h. Melexis strongly recommends to set t he parameter to 0 (enable memory recovery). This is done automatically when using the MEMLOCK fu nction. 14.7. Lock Parameter Value Unit MLXLOCK 0 LOCK 0 IIR Filter - Gaussian White Noise Response 39800 39850 39900 39950 40000 40050 40100 40150 40200 0 50 100 150 Time [0…65535] Scale x(n) y(n)
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14.7.1. MLXLOCK Parameter MLXLOCK locks all the parameters set by Melexis. 14.7.2. LOCK Parameter LOCK locks all the parameters set by the user. Once t he lock is enabled, it is not possible to change the EEPROM values anymore. Note that the lock bit should be set by the solver funct ion “MemLock”.
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- MLX90316 Self Diagnostic The MLX90316 provides numerous self-diagnostic feature s. Those features increase the robustness of the IC functionality as it will prevent the IC to provide erroneous output signal in case of internal or external f ailure modes (“fail-safe”). G ActionG EffectGonGOutputsG RemarkG ROMLCRCLErrorLatLstartLup L (64LwordsLincludingLIntelligentL WatchLDogLaLIWD)L CPULReset L(22)L DiagnosticLlow (23)L AllLtheLoutputsLareLalreadyL inLDiagnosticLlowLaL(startaup)L ROMLCRCLEr rorL(OperationL aL BackgroundLtask)LL EnterLEndlessLLoop: L aLProgressL(watchdogL Acknowledge)L aLSetLOutputsLinLDiagnosticLlowL ImmediateL DiagnosticLlow L L RAMLTestLFailL(StartLup) L CPULReset L DiagnosticLlow L AllLtheLoutputsLareLalreadyL inLDiagnosticLlowL(startaup)L CalibrationLDataLCRCLErrorL L (StartaUp)LL HammingLCodeLRecovery L L Start aUpLTimeLisLincreasedL byL3LmsLifLsuccessfulL recoveryL HammingLCodeLRecoveryLError L (StartaUp)L CPULReset GL ImmediateL DiagnosticLlow L SeeL 14.6.2 L CalibrationLDataLCRCLErrorL L (OperationLaLBackground)LL CPULReset GL ImmediateL DiagnosticLlow L L DeadLZone L SetL OutputsLinLDiagnosticLlow .L NormalLOperationLuntilLtheL“deadL zone”LisLleft.L ImmediateL DiagnosticLlow L ImmediateLrecoveryLifLtheL “deadLzone”LisLleftLL ADCLClipping L (ADCLOutputLisL0000hLorL 7FFFh)L SetL OutputsLinLDiagnosticLlow L NormalLmodeLandLCPULResetLIfL recoveryL ImmediateL DiagnosticLlow L L RadiusLOverflowL(L>L100%L) LorL L RadiusLUnderflowLL (L<L50L%L)L SetL OutputsLinLDiagnosticLlow L NormalLmodeLandLCPULResetLIfL recoveryLL ImmediateL DiagnosticLlow L (50L%L aL100L%) L NoLmagnetL/LfieldLtooLhighL SeeLalsoL14.4.2L FineLGainLClipping L (FGL<L0dLorL>L63d)L SetL OutputsLinLDiagnosticLlow L NormalLmode,LandLCPULResetLIfL recoveryLL ImmediateL DiagnosticLlow L L RoughLOffsetLClipping L (ROLisL<L0dLorL>L127d)L SetL OutputsLinLDiagnosticLlow L NormalLmode,LandLCPULResetLIfL recoveryL ImmediateL DiagnosticLlow L L RoughLGainLClippingL (RGL<LRGTHRESLOWLorLRGL>L RGTHRESHIGH)L SetLOutputsLinLDiagnosticLlowL NormalLmode,LandLCPULResetLIfL recoveryL ImmediateL DiagnosticLlow L SeeLalsoL14.4.2L L DACLMonitorL(DigitalLtoLAnalogL converter)L L SetLOutputsLinLDiagnosticLlow.L NormalLModeLwithLimmediateL recoveryLwithoutLCPULResetL ImmediateL DiagnosticLlow L L L MLX90316 Fault Mode continues …
22 LCPULresetLmeansL
- CoreLResetL(sameLasLPoweraOnaReset).LItLinducesLaLtypicalLstartLupLtime.L 2. PeripheryLResetL(sameLasLPoweraOnaReset)L 3. FaultLFlag/StatusLLostL 4. TheLresetLcanLbeLdisabledLbyLclearingLtheLRESONFAULTLbitL(SeeL14.6.1)L
23 LReferLtoLsectionL7LforLtheLDiagnosticLOutputLLevelLspecificationsLL
L L
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…MLX90316 Fault Mode FaultGModeG ActionG EffectGonGOutputsG RemarkG ADCLMonitorL(AnalogLtoLDigitalL Converter)L L L SetLOutputsLinLDiagnosticLlow.L NormalLModeLwithLimmediateL recoveryLwithoutLCPULResetL ImmediateL DiagnosticLlow L ADCLInputsLareLShortedL L UndervoltageLModeL AtLStartaUp,LwaitLUntilLV DD L>L3V.LL L DuringLoperation,LCPULResetLafterL 3LmsLdebouncingLL aLVDD L<L PORLlevelL=> L OutputsLhighLimpedanceLL L aLPORLlevelL<LV DD L<L3LVL=>L OutputsLinLDiagnosticLlow.L L FirmwareLFlowLError L CPULReset L ImmediateL DiagnosticLlow L IntelligentLWatchdogL (Observer)L Read/WriteLAccessLoutLofL physicalLmemoryL CPULReset L ImmediateL DiagnosticLlow L 100%LHardwareLdetection L WriteLAccessLtoLprotectedL areaL (IOLandLRAMLWords)L CPULReset L ImmediateL DiagnosticLlow L 100%LHardwareLdetectio nL UnauthorizedLentryLinL “SYSTEM”LModeL CPULReset L ImmediateL DiagnosticLlow L 100%LHardwareLdetection L VDD L>L7LVL SetLOutputLHighLImpedanceL (Analog)L L PullLdownLresistiveLloadL=>L Diag.LLowL PullLupLresistiveLloadL=>L Diag.LHigh (23)L 100%LHardwareLdetectionL VDD L>L9.4LVL ICLisLswitchedLoffL(internalLsupply)L CPULResetLonLrecoveryL PullLdownLresistiveLloadL=>L Diag.LLowL PullLupLresistiveLloadL=>L Diag.LHighL 100%LHardwareLdetectionL BrokenL VSS (24)L CPULReset LonLrecovery L PullLdownLresistiveLloadL=>L Diag.LLowL PullLupLresistiveLloadL=>L Diag.LHighL 100%LHardwareLdetection. L PullLdownLloadL ≤ L10LkΩLtoL meetLDiagLLowLspec:L a <L2%LV DD L(temperatureL suffixLSLandLE)L a <L4%LV DD L(LtemperatureL suffixLK)L a contactLMelexisLforL temperatureLsuffixLLL BrokenLV DD (24)L CPULReset LonLrecovery L PullLdownLresistiveLloadL=>L Diag.LLowL PullLupLresistiveLloadL=>L Diag.LHighL NoLvalidLdiagnosticLforL VPULLUP L=LV DD .L L PullLupLloadL(≤ L10kΩ)LtoL V PULLUP L>L8LVLtoLmeetLDiagL HiLspecL>L96%LVdd.L
24 LNotLValidLforLSPILVersionL
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- Serial Protocol 16.1. Introduction The MLX90316 features a digital Serial Protocol mode . The MLX90316 is considered as a Slave node. The serial protocol of the MLX90316 is a three wires p rotocol (/SS, SCLK, MOSI-MISO):
- /SS pin is a 5 V tolerant digital input
- SCLK pin is a 5 V tolerant digital input
- MOSI-MISO pin is a 5 V tolerant open drain digital input/output The basic knowledge of the standard SPI specification is required for the good understanding of the present section. 16.2. SERIAL PROTOCOL Mode
- CPHA = 1 /barb2right even clock changes are used to sample the data
- CPOL = 0 /barb2right active-Hi clock The positive going edge shifts a bit to the Slave’s out put stage and the negative going edge samples the bit at the Master’s input stage. 16.3. MOSI (Master Out Slave In) The Master sends a command to the Slave to get the a ngle information. 16.4. MISO (Master In Slave Out) The MISO of the slave is an open-collector stage. Due to the capacitive load (TBD) a >1 k Ω pull-up is used for the recessive high level (in fast mode). Note th at MOSI and MISO use the same physical pin of the MLX90316. 16.5. /SS (Slave Select) The /SS pin enables a frame transfer (if CPHA = 1). I t allows a re-synchronization between Slave and Master in case of communication error. 16.6. Master Start-Up /SS, SCLK, MISO can be undefined during the Master start-up as long as the Slave is re-synchronized before the first frame transfer. 16.7. Slave Start-Up The slave start-up (after power-up or an internal f ailure) takes 16 ms. Within this time /SS and SCLK i s ignored by the Slave. The first frame can therefore be sent after 16 ms. MISO is Hi-Z (i.e. Hi-Impedance) until the Slave is selected by its /SS input. MLX90316 will cope with any signal from the Master while starting up.
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16.8. Timing To synchronize communication, the Master deactivates /S S high for at least t5 (1.5 ms). In this case, the Slave will be ready to receive a new frame. The Maste r can re-synchronize at any time, even in the middle of a byte transfer. Note: Any time shorter than t5 leads to an undefined frame state, because the Slave may or may not have seen /SS inactive. T TimingsG Min (25)G MaxG RemarksG t1L 2.3LµsL/L6.9LµsL aL NoLcapacitiveLloadLonLMISO .L t1LisLtheL minimumLclockLperiodLforLanyL bitsLwithinLaLbyte.L t2L 12.5LµsL/L37.5LµsL aL t2LtheLminimumLtimeLbetweenLanyLotherL byteL t4L 2.3LµsL/L6.9LµsL aL LTimeL betweenL lastL clockL andL /SS=high=chipLdeaselectionL t5L 300LµsL/L1500LµsL aL MinimumL /SS L =L HiL timeL whereL it’sL guaranteedL thatL aL frameL rea synchronizationsLwillLbeLstarted.L t5L 0µsL L aL MaximumL /SS L =L HiL timeL whereL it’sL guaranteedL thatL NOL frameL rea synchronizationsLwillLbeLstarted.L t6L 2.3LµsL/LL6.9LµsL aL TheL timeL t6L definesL theL minimumL timeL betweenL/SSL=LLoLandLtheLfirstLclockLedgeL t7L 15LµsL/L45LµsL aL t7LisLtheLminimumLtimeLbetweenLtheL StartByteLandLtheLByte0L t9L aL <1LµsL MaximumLtimeLbetweenL/SS L=LHiLandL MISOLBusLHighaImpedanceL TStartUp L aL <L10LmsL/L16LmsL MinimumLtimeLbetweenLLreset ainactiv eL andLanyLmasterLsignalLchangeL
25 LTimingsLshownLforLoscillatorLbaseLfrequencyLofL20MHzL(FastLMode)L/L7LMHzL(SlowLMode)L
/SS t6 t1 t7 t2 t4 t9 t5
2 Startbytes Byte 0 Byte 1 Byte 2 Byte 7
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16.9. Slave Reset On internal soft failures the Slave resets after 1 sec ond or after an (error) frame is sent. On internal ha rd failures the Slave resets itself. In that case, the Se rial Protocol will not come up. The serial protocol l ink is enabled only after the completion of the first synchronization (the Master deactivates /SS for at least t5). 16.10. Frame Layer T 16.10.1. Command Device Mechanism Before each transmission of a data frame, the Master sh ould send a byte AAh to enable a frame transfer. The latch point for the angle measurement is at the last clock before the first data frame byte. 16.10.2. Data Frame Structure A data frame consists of 10 bytes:
- 2 start bytes (AAh followed by FFh)
- 2 data bytes (DATA16 – most significant byte first)
- 2 inverted data bytes (/DATA16 - most significant by te first)
- 4 all-Hi bytes The Master should send AAh (55h in case of inverting tra nsistor) followed by 9 bytes FFh. The Slave will answer with two bytes FFh followed by 4 data bytes an d 4 bytes FFh. 16.10.3. Timing There are no timing limits for frames: a frame tran smission could be initiated at any time. There is no int er- frame time defined. /SS SCLK A A F F F F F F F F F F F F F F F F F F A A F F F F D A T A F F F F F F F F F F MOSI MISO Timing diagram F F F F F F D Latch point
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16.10.4. Data Structure T The DATA16 could be a valid angle, or an error cond ition. The two meanings are distinguished by the LSB. DATA16: Angle A[13:0] with (Angle Span)/2 Most Significant Byte Less Significant Byte MSB LSB MSB LSB A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 0 1 DATA16: Error Most Significant Byte Less Significant Byte MSB LSB MSB LSB E15 E14 E13 E12 E11 E10 E9 E8 E7 E6 E5 E4 E3 E2 E1 E0 BIT NAME E0 0 E1 1 E2 F_ADCMONITOR ADC Failure E3 F_ADCSATURA ADC Saturation (Electrical failure or f ield too strong) E4 F_RGTOOLOW Analog Gain Below Trimmed Threshold (Likely reason : field too weak) E5 F_MAGTOOLOW Magnetic Field Too Weak E6 F_MAGTOOHIGH Magnetic Field Too Strong E7 F_RGTOOHIGH Analog Gain Above Trimmed Threshold (Likely reason : field too strong) E8 F_FGCLAMP Never occurring in serial protocol E9 F_ROCLAMP Analog Chain Rough Offset Compensation : Clipping E10 F_MT7V Device Supply V DD Greater than 7V E11 - E12 - E13 - E14 F_DACMONITOR Never occurring in serial protocol E15 - 16.10.5. Angle Calculation All communication timing is independent (asynchrono us) of the angle data processing. The angle is calculated continuously by the Slave:
- Slow Mode: every 1.5 ms at most.
- Fast Mode: every 350 µs at most. The last angle calculated is hold to be read by the Master at any time. Only valid angles are transfer red by the Slave, because any internal failure of the Slave will lead to a soft reset. 16.10.6. Error Handling In case of any errors listed in section 16.10.4, th e Serial protocol will be initialized and the error condition can be read by the master. The slave will perform a soft reset once the error frame is sent. In case of any other errors (ROM CRC error, EEPROM CRC error, RAM check error, intelligent watchdog error…) the Slave’s serial protocol is not initiali zed. The MOSI/MISO pin will stay Hi-impedant (no er ror frames are sent).
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- Recommended Application Diagrams 17.1. Analog Output Wiring with the MLX90316 in SOIC Package Figure 14 – Recommended wiring for the MLX90316 in SOIC8 package (26). Figure 15 – Recommended wiring for the MLX90316 in SOIC8 package – “BCS” Version. 26 LSeeLsectionL14.1.4LifLtheLSwitchLOutputLfeatureLisLused.L 100nF MLX90316 Vdd NotUsed Test 2 Vss Test 1 Vdig Switch Out Out1 100nF 100nF Vdd GND Output 5 V ECU 10K 4.7nF ADC C2 MLX90316 VDD OUT2 TEST2 VSS TEST1 VDIG Switch Out OUT1 VDD GND OUT1 5 V ECU ADC OUT2 C1, C2, C3, C4: 100nF BCS
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17.2. Analog Output Wiring with the MLX90316 in TSSOP Package Figure 16 – Recommended wiring for the MLX90316 in TSSOP16 package (dual die). 17.3. PWM Low Side Output Wiring Figure 17 – Recommended wiring for a PWM Low Side O utput configuration (27). 27 SeeLsectionL14.1.4LifLtheLSwitchLOutputLfeatureLisLused.L L L ECU VDD1 VDD2 GND1 GND1 GND2 Vdd1 Vss1 Out2 Vdig1 Out1 Vss2 MLX90316 Vdd2 Vdig2 100nF 100nF C3 100nF 100nF 100nF 100nF Vdd1 GND1 Output1 Vdd2 GND2 Output2 ADC 10K 4.7nF 10K 4.7nF GND2 100nF MLX90316 Vdd NotUsed Test 2 Vss Test 1 Vdig Switch Out PWM 100nF 4.7nF Vdd GND Output 5 V ECU 4.7nF TIMER 5 V
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17.4. Serial Protocol Generic schematics for single slave and dual slave applications are described. 17.4.1. SPI Version – Single Die Figure 18 – MLX90316 SPI Version – Single Die – App lication Diagram 100nF MLX90316 Vdd SCLK Test 1 Vss Test 0 Vdig /SS MOSI 100nF 3.3V/5V SPI Master 5 V MISO MOSI SCLK _SS GND Vdd _SS SCLK MOSI
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17.4.2. SPI Version – Dual Die Figure 19 – MLX90316 SPI Version – Dual Die – Appli cation Diagram 100nF MLX90316 Vdd SCLK Test 1 Vss Test 0 Vdig /SS MOSI 100nF 3.3V/5V SPI Master 5 V MISO MOSI SCLK1 _SS1 GND Vdd _SS1 SCLK1 MOSI 100nF MLX90316 Vdd SCLK Test 1 Vss Test 0 Vdig /SS MOSI 100nF SCLK2 _SS2 _SS2 SCLK2
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17.4.3. Non SPI Version (Standard Version) Figure 20 – MLX90316 − Single Die − Serial Protocol Mode ApplicationGTypeG µCtrlG SupplyG (V)G Pullpup G SupplyG (V)G 90316 G SupplyG (V)G R1G(Ω)G R2G(Ω)G R3G(Ω)G R4G(Ω)G R5G(Ω)G MOS G TypeG G 5VL µ CtrlLw/oLO.D.Lw/oL3.3V L 5V L 5V L 5V L 100 L 1000 L 20,000 L 1000 L 20,000 L BS170 L 5VL µ CtrlLw/oLO.D.L w/LLL3.3V L 5V L 3.3V L 5V L 150 L 1000 L N/A L 1000 L 20,000 L BS170 L 5VL µ CtrlLw/LO.D.Lw/oL3.3V L(29)L 5V L 5V L 5V L 100 L 1000 L 20,000 L 1000 L 20,000 L N/A L Table 3 - Resistor Values for Common Specific Applications 28 LµCtrlLw/LO.D.L:LMicroacontrollerLwithLopenadrainLcapabilityL(forLinstanceLNECLV850ESLseries)L 29 LµCtrlLw/oLO.D.L:LMicroacontrollerLwithoutLopenadrainLcapabilityL(likeLTILTMS320LseriesLorLATMELLAVRLL) 100nF MLX90316 Vdd SCLK Test 1 Vss Test 0 Vdig /SS MOSI 100nF 3.3V/5V SPI Master 5 V R1 MISO MOSI SCLK _SS GND Vdd _SS MOSI
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- Standard information regarding manufacturabili ty of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (S urface Mount Devices)
- IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)
- EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Device s Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (S urface Mount Devices) and THD’s (Through Hole Devices)
- EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
- EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (T hrough Hole Devices)
- EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (S urface Mount Devices) and THD’s (Through Hole Devices)
- EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assuran ce of adhesive strength between device and board. Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/Quality_soldering.aspx ) as well as trim&form recommendations (http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 19. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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- Package Information 20.1. SOIC8 - Package Dimensions T 20.2. SOIC8 - Pinout and Marking Marking : Part Number MLX90316 (3 digits) 316 Die Version (3 digits) M12345 Week Date code (2 digits) Year Date code (2 digits) YY WW BCG Out2 SCLK 316Bxx M12345 Xy-E \\SS Switch Test 0 Vdd Out MOSI/MISO Test 1 Vdig Vss TOP Bottom BDG Standard SPI Version BCS BCS Version Split lot number (Optional ) + “-E” Xy-E Lot number: “M” + 5 digits 0.19 0.25 NOTES: All dimensions are in millimeters (anlges in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). * Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. 5.80 6.20**
1.27 TYP
4.80 4.98* 1.52 1.72 0.100 0.250 1.37 1.57 0.36 0.46* 3.81 3.99 0.41 1.27
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20.3. SOIC8 - IMC Positionning 0.46 +/- 0.06 1.25 1.65 1.96 2.26 1 2 3 4 8 7 6 5 CCW CW COS SIN The MLX90316 is an absolute angular position sensor but the linearity error (Le – See Section 10) does not include the error linked to the absolute reference 0 Deg (which can be fixed in the application through the discontinuity point – See 14.2.2). Angle detection MLX90316 SOIC8 1 2 3 4 8 7 6 5 ~ 0 Deg.* S N 1 2 3 4 8 7 6 5 S N ~ 90 Deg.* 1 2 3 4 8 7 6 5 S N ~ 270 Deg.* 1 2 3 4 8 7 6 5 S N ~ 180 Deg.* * No absolute reference for the angular information.
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20.4. TSSOP16 - Package Dimensions 0.09 0.20
1.0 DIA
NOTES: All dimensions are in millimeters (anlges in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). * Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
0.20 TYP
12 O TYP
0.09 MIN
0.50 0.75
1.0 TYP
4.90 5.10*
1.1 MAX
0.05 0.15 0.85 0.95 0.19 0.30***
6.4 TYP
4.30 4.50**
0.65 TYP
1.0 1.0
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20.5. TSSOP16 - Pinout and Marking Marking : Part Number MLX 90316 (3 digits) 316 Die Version (3 digits) M12345 Lot number: “M” + 5 digits Week Date code (2 digits) Year Date code (2 digits) YY WW BCG Vdd_1 SCLK_1 Test1_1 Vss_1 Test0_1 Out_2/MOSI/MISO_2 Vdig_1 _SS_1/ Switch_1 Out_1/MOSI/MISO_1 Vss_2 316BxG M12345 Xy-E Test0_2 Vdd_2 _SS_2/Switch_2 SCLK_2 Vdig_2Test1_2 BDG Standard SPI Version Top Bottom Xy-E Split lot number (Optional ) + “-E” 20.6. TSSOP16 - IMC Positionning 0.30 +/- 0.06 1.95 2.45 1.84 2.04 2.76 2.96 1 8 916 CCW CW COS 2 COS 1 SIN 2 SIN 1 Die 2 Die 1
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The MLX90316 is an absolute angular position sensor but the linearity error (Le – See Section 10) does not include the error linked to the absolute reference 0 Deg (which can be fixed in the application through the discontinuity point – See 14.2.2). Angle detection MLX90316 TSSOP16 ~ 270 Deg.* ~ 90 Deg.* 1 8 916 Die 2 Die 1 S N ~ 180 Deg.* ~ 0 Deg.* 1 8 916 Die 2 Die 1 S N ~ 0 Deg.* ~ 180 Deg.* 1 8 916 Die 2 Die 1 S N 1 8 916 Die 2 Die 1 S N ~ 90 Deg.* ~ 270 Deg.* * No absolute reference for the angular information.
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- Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requiremen ts, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2013 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 0495 Phone: +1 248 306 5400 E-mail: sales_europe@melexis.com E-mail: sales_usa @melexis.com ISO/TS 16949 and ISO14001 Certified