304HIR-3B EHAOAN | Alldatasheet

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Technical content

1 EHAOAN Electronics Co., Ltd.

304 IR-3B

Features/产品特性

  • 外观尺寸/ Package :F3 圆头直插
  • 胶体/ Lens: 黑色胶体/Black clear
  • EIA 规范标准包装/ EIA STD Package
  • 环保产品，符合 ROHS 要求/ Meet ROHS, Green Product Applications/产品应用
  • PCB 安装红外传感器/PCB mounted infrared sensor
  • 用于微型光栅的红外发射/Infrared emitting for miniature light barrier
  • 光电开关/Optoelectronic switch
  • 烟雾探测器/Smoke detector H

2 EHAOAN Electronics Co., Ltd. PackageDimensions/尺寸参数 Note: Tolerances unless mentioned ±0.1mm. Unit = mm 注：除非另有说明，否则公差为±0.1 mm 单位=mm

3 EHAOAN Electronics Co., Ltd. AbsoluteMaximumRatings/最大限度参数值(Ta=25°C) 参数名称 Parameter 符号 Symbol 最大额定值 Rating 单位 Unit 正向电流 Forward Current IF 100 mA 峰值电流 Peak Forward Current IFP 350 mA 反向电压 Reverse Voltage VR 5 V 消耗功率 Power Dissipation Pd 140 mW 工作温度 Operating Temperature Topr -35~+85 °C 存储温度 Storage Temperature Tstg -40~+85 °C 焊接温度 Soldering Temperature Tsol 回流焊: 260°C,10s 手动焊: 300°C,3s Opto-ElectronicalSpecification/主要光电参数(Ta=25℃) 参数名称 Parameter 符号 Symbol 最小值 Min 标准值 Type 最大值 Max 单位 Unit 测试条件 Condition 正向电压 Forward Voltage VF -- 1.4 1.6 V IF=20mA Pulse width≤100μs,Duty≤1% 反向电流 Reverse Current IR -- -- 10 uA VR=5V 发光角度 Viewing Angleh 2θ1/2 -- 30 -- deg IF =20mA 辐射强度 Radiant Intensity Ee 10 16 -- mW/sr IF=20mA -- 100 -- IF=100mA Pulse width≤100μs,Duty≤1% -- -- -- IF=1A Pulse width≤100μs,Duty≤1% 峰值波长 Peak Wavelength λp -- 850 -- nm IF =20mA 半波宽 Spectral Bandwidth Δλ -- 40 -- nm IF =20mA

4 EHAOAN Electronics Co., Ltd. TypicalCharacteristicsCurves/曲线参数

5 EHAOAN Electronics Co., Ltd. Rank BinNumber Symbol Min Max TestCondition N mW/sr 11 17.5 IF =20mA P 15 24 Packing/最小包装：1000 pcs/ bag MoistureResistantPackingMaterials/标签标识 CAT：Ranks HUE：Peak Wavelength REF：Reference QTY: Packing Quantity LOT No: Lot Number

6 EHAOAN Electronics Co., Ltd. Notes/注意事项 引脚成形方法 LEDbracketformingmethod 1、必需离胶体 2 毫米才能折弯支架。 The pin of LED can be bent where is at least 2mm out of LED colloid. 2、支架成形必须用夹具或由专业人员来完成。 Must use fixture to deform the LED bracket. 3、支架成形必须在焊接前完成。 Finishing the forming of LED bracket must be before soldering. 4、支架成形需保证引脚和间距与线路板上一致。 Guarantee the gap between two pin of LED tallys with LED pads in PCB when forming. 烙铁焊接 Manualsoldering 烙铁（最高 30W）尖端温度不超过 300℃；焊接时间不超过 3 秒；焊接位置至少离胶体 3 毫米。 The tip temperature of soldering iron don’t exceed 300℃；soldering time don’t exceed 3s and soldering position must be 3mm out of led colloid。 HandSoldering 手工焊接 DIPSoldering 浸焊 Temp. at tip of iron 尖端温度 300℃ Max. (30W Max.) Preheat temp. 预热温度 100℃ Max. (60 sec Max.) Soldering time 焊接时间 3 sec Max. Bath temp. & time 炉温&时间 260 Max., 5 sec Max Distance 距离 3mm Min.(From solder joint to epoxy bulb) Distance 距离 3mm Min. (From solder joint to epoxy bulb) 120sec.Max. 60sec.Max. Above 220°C1~5°C/sec.Max. Pre-heating 180-200°C 1~5°C/sec.Max. 260°C.Max. 10sec.Max. 1~5°C/sec.Max. lead-free solder 防静电措施 ESDcountermeasure 静电及高压会对 LED 造成损坏，特别是芯片材质为 InGaN 的产品对静电防护要求更加严格，要求在使用和检 验产品时戴防静电手腕带或防静电手套，焊接工具及设备外壳需可靠接地，焊接条件遵循此份规格书中的条件。 Static electricity and high volt can damage LED，The production whose Die material is InGaN must strictly required to prevent ESD，Must put on static glove and static fillet，Soldering tool and the cover of device must connect the ground，soldering condition follows the related stating of production specification manual。

7 EHAOAN Electronics Co., Ltd. 过电流保护 Protectingcountermeasurewhenovercurrent 为避免由于电压的变化引起大电流冲击而造成产品损坏，需要加入保护电阻。 Need add the protecting resistor in circuit in order to avoid damaging led due to big current and voltage fluctuation。 LED 安装方法 LEDinstallationmethod 1、注意各类器件外线的排列以防极性装错，器件不可与发热组件靠得太近，工作条件不要超过其规定的极限。 Pay attention to the LED polarity and avoid installation wrong。LED can’t be close to euthermic component，work condition should tally with it’s specification。 2、务必不要在引脚间距变形的情况下安装 LED。 Don’t install the LED under the condition of the led pin deformation。 3、当装配 LED 进入 PCB 或装配孔时，LED 支架不能承受任何压力。 The LED bracket don’t load any pressure when installing the LED into PCB or fitting hole。 4、在焊接温度回到正常以前，必须避免使 LED 受到任何的震动或外力。 Must avoid any strike and force on LED before the soldering temperature return to room temperature。 存储时间 Storagetime 1、在温度 5℃～35℃，湿度 RH60%条件下，产品可保存一年。超过保存期的产品需重新检测后方能使用。 LED can be stored for a year under the condition: the temperature of 5℃～35℃ and humidity of RH60%，These production must be re-inspected and tested before use if their storage time exceed a year。 2、如果打开的产品在 5℃～35℃，RH60%的空气条件下放置超过一周，则需要将产品在 65℃±5℃的环境中放 置 24 小时以上，并尽量在十五天内使用。 If LED is exposed in air for a week under the condition: the temperature of 5℃～35℃，humidity of RH60%，must place the LED in the ambience of 65℃±5℃ for 24 hours and use it in 15 days for best。 清洗 Cleaning 当用化学用品清洗胶体时必须特别小心，因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮等。 可用乙醇擦拭、浸渍，时间在常温下不超过 3 分钟。 Be careful of some chemical results in the LED colloid fades and damage when using chemical clean the LED，such as chloroethylene, acetone etc。 Can use ethanol to wash or soak LED but the time don’t exceed 3 minutes. 弯脚（Kinked） 当 LED 成形弯脚时，弯脚模具容易刮花 LED 脚支架镀层，刮伤处容易生锈，特别是空气湿度大时。 为减少生锈机会，建议使用镀锡支架。 The kinked tooling scrape easily the pin of LED, where the LED bracket is rusting easily, especial expose it in moist air. To decrease the LED bracket rust, advise using plated tin LED bracket.