2W005 SEP | Alldatasheet
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Case: Reliable low cost construction utilizing molded plastic technique Terminals: Plated leads solderable per MIL-STD-202, Method 208 Mounting Position: Any Weight: 0.05 ounce, 1.3 grams (approx) This series is UL listed under the Recognized Component Index, file number E142814 The plastic material used carries Underwriters Laboratory flammability recognition 94V-0 Ideal for printed circuit board mounting High temperature soldering guaranteed 265 C /10 seconds at 5 lbs (2.3kg) tension High surge current capability +5.1 0.5 26.0 MIN. 23.5 MIN. +5.1 0.5 +8.85 0.5 +5.30 0.3 Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting. (2)Measured at 2.0MHz and applied reverse voltage of 4.0 volts. Dimensions in millimeters(1mm =0.0394") 2006 SEP ELECTRONIC CORP. www.sep-semi.com Rev.1 C 2W005 2W01 2W02 2W04 2W06 2W08 2W10 WOB
Rating and Characteristic Curves 2W005 thru 2W10 Fig. 1 Derating Curve for Output Rectified Current Fig. 2 Maximum Non-repetitive Peak Forward Surge Current Fig. 3 Typical Instantaneous Forward Characteristics Fig. 5 Typical Junction Capacitance ( TA=25 C Unless otherwise noted ) Average Forward Output Current, Amperes Peak Forward Surge Current, Amperes Instantaneous Forward Current, Amperes Capacitance, pF Number of Cycles at 60Hz Instantaneous Forward Voltage, Volts Reverse Voltage, Volts 1.0 2.0 50 100 1 10 100 .01 0.1 1.0 100 1 1.5 2 10 100 25 75 125 150 60Hz Resistive of Inductive Load 1.5 0.5 8.3ms Single half-sine-Wave [JEDEC Method] Tj=25 C Pulse Width=300us Tj=25 C f=1.0MHz Fig. 4 Typical Reverse Characteristics Instantaneous Reverse Current ,Amperes Percent of Rated Peak Reverse Voltage, % .01 0.1 1.0 0 20 40 60 80 100 120 140 100 Tj=25 C Tj=125 C Case Temperature, C 2006 SEP ELECTRONIC CORP. www.sep-semi.com Rev.1