TPS3809-Q1 TI | Alldatasheet
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Technical content
TPS3809xxx-Q1 3-Pin Supply Voltage Supervisors
1 Features
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C5
- 3-Pin SOT-23 Package
- Supply Current of 9 μA (Typical)
- Precision-Supply Voltage Monitor 2.5 V, 3 V, 3.3 V, 5 V
- Power-On Reset Generator With Fixed Delay Time of 200 ms
- Pin-For-Pin Compatible With MAX 809
2 Applications
- Automotive Camera Systems
- Telematics
- Automotive Cluster
- Engine Controls
- Surround View Systems
3 Description
The TPS3809 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems. The newer TLV809E device is an alternative with the same pins, functions and electrical parameters. During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V. Thereafter, the supervisory circuit monitors V DD and keeps RESET active as long as V DD remains below the threshold voltage V IT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time, t d(typ) = 200 ms, starts after VDD has risen above the threshold voltage VIT. When the supply voltage drops below the threshold voltage VIT, the output becomes active (low) again. No external components are required. All the devices of this family have a fixed sense-threshold voltage VIT set by an internal voltage divider. The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a 3-pin SOT-23. The TPS3809xxx-Q1 devices are characterized for operation over a temperature range of −40°C to 125°C, and are qualified in accordance with AEC-Q100 stress test qualification for integrated circuits. Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS3809xxx-Q1 SOT-23 (3) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 3.3 V TPS3809K33-Q1 TMS320LC54x GND GND RESET RESET V DD V DD TPS76333 GND OUTIN5 V Typical Application www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 1 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1 TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
13 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (March 2016) to Revision C (December 2020) Page Changes from Revision A (December 2002) to Revision B (February 2016) Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
5 Device Comparison
Table 5-1. Device Threshold Options PRODUCT THRESHOLD VOLTAGE TPS3809J25QDBVRQ1 2.25 V TPS3809L30QDBVRQ1 2.64 V TPS3809K33QDBVRQ1 2.93 V TPS3809I50QDBVRQ1 4.55 V Table 5-2. Device Family Comparison DEVICE FUNCTION TLV803 Open-Drain, RESET Output TLV809 Push-Pull, RESET Output TLV810 Push-Pull, RESET Output
6 Pin Configuration and Functions
1 GND
2 RESET_
3 V DD
Figure 6-1. DBV Package 3-Pin SOT-23 Top View
6.1 Pin Functions
NAME NO. GND 1 — Ground RESET 2 O Reset output VDD 3 I Supply voltage and supervising input www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VDD (2) 6.5 V All other pins(2) –0.3 6.5 V Maximum low output current, IOL 5 mA Maximum high output current, IOH –5 mA Input clamp current, IIK (VI<0 or VI>VDD) –20 20 mA Output clamp current, IOK (VO<0 or VO>VDD) –20 20 mA Continuous total power dissipation Operating free-air temperature range, TA –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. For reliable operation the device should not be operated at 6.5 V for more than t = 1000 h continuously.
7.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 2 6 V TA Operating free-air temperature –40 125 °C
7.4 Thermal Information
THERMAL METRIC(1) TPS3809xxx-Q1 UNITDBV (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 232.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 187.6 °C/W RθJB Junction-to-board thermal resistance 104.1 °C/W ψJT Junction-to-top characterization parameter 40.5 °C/W ψJB Junction-to-board characterization parameter 104.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage VDD = 2.5 V to 6 V, IOH = −500 μA VDD – 0.2 V VDD = 3.3 V, IOH = −2 μA VDD – 0.4 VDD = 6 V, IOH = −4 mA TA = −40°C to +25°C VDD – 0.4 TA = 125°C VDD – 0.5 VOL Low-level output voltage VDD = 2 V to 6 V, IOL = 500 μA 0.3 VVDD = 3.3 V, IOL = 2 mA 0.4 VDD = 6 V, IOL = 4 mA 0.4 Power-up reset voltage(1) VDD ≥ 1.1 V, IOL = 50 μA 0.2 V VIT− Negative-going input threshold voltage(2) TPS3809J25-Q1 TA = −40°C to +125°C 2.20 2.25 2.30 V TPS3809L30-Q1 2.58 2.64 2.7 TPS3809K33-Q1 2.87 2.93 2.99 TPS3809I50-Q1 TA = −40°C to +85°C 4.45 4.55 4.65 TA = −40°C to +125°C 4.4 4.55 4.65 Vhys Hysteresis TPS3809J25-Q1 30 mV TPS3809L30-Q1 35 TPS3809K33-Q1 40 TPS3809I50-Q1 60 IDD Supply current VDD = 2 V, Output unconnected 9 15 μA VDD = 6 V, Output unconnected 20 30 Ci Input capacitance VI = 0 V to VDD 5 pF (1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 µs/V. (2) To ensure best stability of the threshold voltage, a bypass capacitor ( 0.1 µF, ceramic) should be placed near the supply terminals.
7.6 Timing Requirements
RL = 1 MΩ, CL = 50 pF, TA = 25°C MIN NOM MAX UNIT tw Pulse width at VDD VDD = VIT− + 0.2 V, VDD = VIT− − 0.2 V 10 μs
7.7 Switching Characteristics
RL = 1 MΩ, CL = 50 pF, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT td Delay time VDD ≥ VIT− + 0.2 V, See timing diagram, Section 7.8 120 200 280 ms tPHL Propagation (delay) time, high-to-low-level output VDD to RESET delay VIL = VIT− − 0.2 V, VIH = VIT− +0.2 V 10 μs www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
7.8 Timing Diagrams
t VDD aaaaa aaaaa aaaaa aaaaa aaaaa aaaa aaaa aaaa aaaa aaaa V(NOM) VIT 1.1 V 0 t For VDD< 1.1 V Undefined Behavior of RESET Output RESET td Figure 7-1. Timing Diagram TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
7.9 Typical Characteristics
0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 VDD = 2.5 V TA = 85 o C TA = –40 o C IOL – Low-Level Output Current – mA OLV – Low-Level Output V oltage – V TA = 25 C o TA = 0 o C Figure 7-2. Low-Level Output Voltage vs Low-Level Output Current –50 –40 –30 –20 –10 –2 0 2 4 6 TA = 25 C o VDD – Supply V oltage – V Current I – Supply – ADD /c109 TPS3809J25 Figure 7-3. Supply Current vs Supply Voltage 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 IOH – High-Level Output Current – mA VDD = 6 V TA = 85 o C VOH – High-Level Output V oltage – V TA = –40 C o TA = 0 o C TA = 25 o C VDD = 6 V Figure 7-4. High-Level Output Voltage vs High- Level Output Current 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 IOH – High-Level Output Current – mA VDD = 2.5 V TA = 85 o C VOH – High-Level Output V oltage – V TA = –40 C o TA = 25 o C TA = 0 o C VDD = 2.5 V Figure 7-5. High-Level Output Voltage vs High- Level Output Current 0.995 0.996 0.997 0.998 0.999 1.000 1.001 TA – Free-Air T emperature – C o –40 –20 0 20 40 60 85 VDD = 2.3 V Normalized Threshold V oltage V (T ), V (25 C) IT A IT o VDD = 2.3 V Figure 7-6. Normalized Input Threshold Voltage vs Free-Air Temperature at VDD www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
8 Detailed Description
8.1 Overview
The TPS3809xxx-Q1 device is a low-current supervisory circuit for monitoring system voltages above 2 V. The device asserts an active-low RESET signal when VDD drops below a preset threshold. The RESET output remains low until VDD returns above its threshold. The device design is also to be relatively immune to short negative transients on the VDD pin.
8.2 Functional Block Diagram
of 1.137 V Reset Logic Timer
8.3 Feature Description
8.3.1 VDD Monitoring
The VDD pin provides a terminal at which a system voltage can be monitored. If the voltage on this pin drops below VIT, RESET is asserted low. The comparator has a built-in hysteresis to ensure smooth RESET assertions and deassertions. Refer to Section 5 to determine the VDD voltage threshold for each device.
8.4 Device Functional Modes
TPS3809xxx-Q1 monitors one supply using the V DD pin. When V DD is above the V IT threshold for the device, RESET will be high. When VDD is below the VIT threshold for the device, RESET will be low. TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
9 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
9.1 Application Information
The TPS3809xxx-Q1 voltage supervisor device design asserts an active-low RESET signal when V DD drops below a voltage threshold V IT. The RESET signal remains low until the voltage returns above its threshold. The typical application is with a processor or microcontroller, which needs to be reset when the supply rail drops below a specified tolerance.
9.2 Typical Application
3.3 V TPS3809K33-Q1 TMS320LC54x GND GND RESET RESET V DD V DD TPS76333 GND OUTIN5 V Figure 9-1. Typical Application Schematic
9.2.1 Design Requirements
Each device has a fixed=voltage monitoring threshold, and the device should be chosen based on the voltage being monitored. Refer to Section 5 to determine the VDD voltage threshold for each device. In this example, a 3.3V supply rail to a microcontroller will be monitored.
9.2.2 Detailed Design Procedure
Because a 3.3-V supply rail needs to be monitored, TPS3809K33-Q1 should be used. This device has a 2.93-V threshold for reset. Connect the 3.3-V supply to the V DD pin and the reset output of the supervisor to the reset pin of the microcontroller. www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
9.2.3 Application Curves
–50 –40 –30 –20 –10 –2 0 2 4 6 TA = 25 C o VDD – Supply V oltage – V Current I – Supply – ADD /c109 TPS3809J25 Figure 9-2. Supply Current vs Supply Voltage 0.995 0.996 0.997 0.998 0.999 1.000 1.001 TA – Free-Air T emperature – C o –40 –20 0 20 40 60 85 VDD = 2.3 V Normalized Threshold V oltage V (T ), V (25 C) IT A IT o VDD = 2.3 V Figure 9-3. Normalized Input Threshold Voltage vs Free-Air Temperature at VDD TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
10 Power Supply Recommendations
The TPS3809xxx-Q1 device design operates from an input supply from 2 V to 6 V. TI recommends placing a 0.1- µF capacitor near the VDD pin. www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
11 Layout
11.1 Layout Guidelines
TI recommends placing the 0.1-µF decoupling capacitor close to the V DD pin. The V DD and GND traces should be able to carry 30 µA without a significant drop in voltage.
11.2 Layout Example
Figure 11-1. Layout Example TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 www.ti.com
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
12 Device and Documentation Support
12.1 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
12.2 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.4 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1 SGLS142C – DECEMBER 2002 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 2T09I50QDBVRG4Q Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDCQ 2T09I50QDBVRG4Q.A Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDCQ TPS3809I50QDBVRQ1 Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDCQ TPS3809I50QDBVRQ1.A Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDCQ TPS3809K33QDBVRQ1 Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 125 PDBQ TPS3809K33QDBVRQ1.A Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDBQ TPS3809L30QDBVRQ1 Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDAQ TPS3809L30QDBVRQ1.A Active Production SOT-23 (DBV) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 PDAQ (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1
www.ti.com 23-May-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS3809-Q1 :
- Catalog : TPS3809
- Enhanced Product : TPS3809-EP NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 19-Jan-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 19-Jan-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 2T09I50QDBVRG4Q SOT-23 DBV 3 3000 180.0 180.0 18.0 TPS3809I50QDBVRQ1 SOT-23 DBV 3 3000 180.0 180.0 18.0 TPS3809K33QDBVRQ1 SOT-23 DBV 3 3000 180.0 180.0 18.0 TPS3809L30QDBVRQ1 SOT-23 DBV 3 3000 180.0 180.0 18.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.12 TYP
0.25 3.0 2.6 1.45 0.90 0.15
0.00 TYP
3X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 0.95 (0.15) (0.1) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0003A SMALL OUTLINE TRANSISTOR 4220743/D 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.1) 3X (0.6) (2.6) 2X (0.95) (R0.05) TYP 4220743/D 08/2024 SOT-23 - 1.45 mm max heightDBV0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) 2X(0.95) 3X (1.1) 3X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0003A SMALL OUTLINE TRANSISTOR 4220743/D 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG
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