28MLI07E3V1 SEMIKRON | Alldatasheet
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© by SEMIKRON Rev. 2.0 24.09.2021 1 MiniSKiiP® 2 MLI 3-Level NPC IGBT-Module SKiiP 28MLI07E3V1 Features* 650V Trench IGBTs Robust and soft diodes in CAL technology Highly reliable spring contacts for electrical connections UL recognised: File no. E63532 NTC T-Sensor Typical Applications Uninterruptible power supplies (UPS) Solar inverters Remarks Case temperature limited to T C=125°C max.; TC=TS (valid for baseplate-less modules) Product reliability results are valid for Tjop=150°C Footnotes 1) Please find further technical information on the SEMIKRON website. Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES 650 V IC λpaste=0.8 W/(mK) Tj = 175 °C Ts = 25 °C 135 A Ts = 70 °C 107 A IC λpaste=2.5 W/(mK) Tj = 175 °C Ts = 25 °C 163 A Ts = 70 °C 130 A ICnom 150 A ICRM 450 A VGES -20 ... 20 V tpsc VCC = 360 V VGE ≤ 15 V VCES ≤ 650 V Tj = 150 °C 6 µs Tj -40 ... 175 °C Inverse diode IF λpaste=0.8 W/(mK) Tj = 175 °C Ts = 25 °C 126 A Ts = 70 °C 97 A IF λpaste=2.5 W/(mK) Tj = 175 °C Ts = 25 °C 151 A Ts = 70 °C 118 A IFRM 300 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 1200 A Tj -40 ... 175 °C Clamping diode IF λpaste=0.8 W/(mK) Tj = 175 °C Ts = 25 °C 126 A Ts = 70 °C 97 A IF λpaste=2.5 W/(mK) Tj = 175 °C Ts = 25 °C 151 A Ts = 70 °C 118 A IFRM 300 A IFSM 10 ms, sin 180°, Tj = 25 °C 1200 A Tj -40 ... 175 °C Module It(RMS) Tterminal = 80°C, 20A per spring 120 A Tstg -40 ... 125 °C Visol AC sinus 50 Hz, t = 1 min 2500 V Characteristics Symbol Conditions min. typ. max. Unit IGBT VCE(sat) IC = 150 A VGE = 15 V chiplevel Tj = 25 °C 1.45 1.90 V Tj = 150 °C 1.70 2.10 V VCE0 chiplevel Tj = 25 °C 0.90 1.00 V Tj = 150 °C 0.82 0.90 V rCE VGE = 15 V chiplevel Tj = 25 °C 3.7 6.0 m Ω Tj = 150 °C 5.9 8.0 m Ω VGE(th) VGE = VCE, IC = 2.4 mA 5.1 5.8 6.4 V ICES VGE = 0 V VCE = 650 V Tj = 25 °C 1.5 mA - mA Cies VCE = 25 V VGE = 0 V f = 1 MHz 9.24 nF Coes f = 1 MHz 0.58 nF Cres f = 1 MHz 0.27 nF
2 Rev. 2.0 24.09.2021 © by SEMIKRON Characteristics Symbol Conditions min. typ. max. Unit IGBT QG VGE = - 8 V...+ 15 V 1200 nC RGint Tj = 25 °C 2.0 Ω T1 / T4 td(on) VCE = 300 V IC = 150 A VGE = +15/-15 V RG on = 3 Ω RG off = 1.6 Ω di/dton = 2100 A/µs di/dtoff = 1700 A/µs Tj = 150 °C 108 ns tr Tj = 150 °C 73 ns Eon Tj = 150 °C 5.5 mJ td(off) Tj = 150 °C 268 ns tf Tj = 150 °C 76 ns Eoff Tj = 150 °C 5.6 mJ Rth(j-s) per IGBT, λpaste=0.8 W/(mK) 0.55 K/W Rth(j-s) per IGBT, λpaste=2.5 W/(mK) 0.41 K/W T2 / T3 td(on) VCE = 300 V IC = 150 A VGE = +15/-15 V RG on = 3 Ω RG off = 1.6 Ω di/dton = 2520 A/µs di/dtoff = 1750 A/µs Tj = 150 °C 106 ns tr Tj = 150 °C 64 ns Eon Tj = 150 °C 2 mJ td(off) Tj = 150 °C 268 ns tf Tj = 150 °C 77 ns Eoff Tj = 150 °C 5.2 mJ Rth(j-s) per IGBT, λpaste=0.8 W/(mK) 0.55 K/W Rth(j-s) per IGBT, λpaste=2.5 W/(mK) 0.41 K/W Inverse diode VF = VEC IF = 150 A VGE = 0 V chiplevel Tj = 25 °C 1.40 1.76 V Tj = 150 °C 1.39 1.77 V VF0 chiplevel Tj = 25 °C 1.04 1.24 V Tj = 150 °C 0.85 0.99 V rF chiplevel Tj = 25 °C 2.4 3.5 m Ω Tj = 150 °C 3.6 5.2 m Ω IRRM IF = 150 A di/dtoff = 2450 A/µs VGE = -15 V VR = 300 V Tj = 150 °C 121 A Qrr Tj = 150 °C 20 µC Err Tj = 150 °C 5.5 mJ Rth(j-s) per Diode, λpaste=0.8 W/(mK) 0.75 K/W Rth(j-s) per Diode, λpaste=2.5 W/(mK) 0.58 K/W Clamping diode VF = VEC IF = 150 A VGE = 0 V chiplevel Tj = 25 °C 1.40 1.76 V Tj = 150 °C 1.39 1.77 V VF0 chiplevel Tj = 25 °C 1.04 1.24 V Tj = 150 °C 0.85 0.99 V rF chiplevel Tj = 25 °C 2.4 3.5 m Ω Tj = 150 °C 3.6 5.2 m Ω IRRM IF = 150 A di/dtoff = 2210 A/µs VGE = -15 V VR = 300 V Tj = 150 °C 116 A Qrr Tj = 150 °C 13.2 µC Err 1) Tj = 150 °C 2.6 mJ Rth(j-s) per Diode, λpaste=0.8 W/(mK) 0.75 K/W Rth(j-s) per Diode, λpaste=2.5 W/(mK) 0.58 K/W Module Ms to heat sink 2 2.5 Nm w weight 55 g Temperature Sensor R25 NTC, Tr = 25 °C 1) 5.0 ± 5% k Ω MiniSKiiP® 2 MLI 3-Level NPC IGBT-Module SKiiP 28MLI07E3V1 Features* 650V Trench IGBTs Robust and soft diodes in CAL technology Highly reliable spring contacts for electrical connections UL recognised: File no. E63532 NTC T-Sensor Typical Applications Uninterruptible power supplies (UPS) Solar inverters Remarks Case temperature limited to T C=125°C max.; TC=TS (valid for baseplate-less modules) Product reliability results are valid for Tjop=150°C Footnotes 1) Please find further technical information on the SEMIKRON website.
© by SEMIKRON Rev. 2.0 24.09.2021 3 Fig. 3: Typ. IGBT1 & Diode5 turn-on /-off energy = f (IC) Fig. 4: Typ. IGBT1 & Diode5 turn-on /-off energy = f(RG) Fig. 5: Typ. IGBT1 transfer characteristic Fig. 6: Typ. IGBT1 gate charge characteristic
4 Rev. 2.0 24.09.2021 © by SEMIKRON Fig. 9: Typ. transient thermal impedance of IGBT1 & Diode5 Fig. 10: Typ. Diode5 forward characteristic, incl. RCC'+ EE' Fig. 11: Typ. Diode5 peak reverse recovery current Fig. 12: Typ. Diode5 recovery charge
© by SEMIKRON Rev. 2.0 24.09.2021 5 Pinout and Dimensions Pinout
6 Rev. 2.0 24.09.2021 © by SEMIKRON This is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340. *IMPORTANT INFORMATION AND WARNINGS The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.