2822HC EATON | Alldatasheet

Document overview

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Technical content

High current surface mount Brick fuse Product features

  • 7 .7 x 6.0 x 4.3 mm surface mount package
  • High current Brick fuse
  • Current rating: 40 A to 125 A
  • Voltage rating: Up to 80 Vdc
  • High interrupting rating
  • cURus recognized
  • Single fuse solution for high current applications
  • Moisture sensitivity level: (MSL): 1

Applications

  • Servers and back planes
  • Power distribution units (PDUs)
  • Power supplies
  • Energy storage system
  • Industrial automation tools
  • Robotic machinery
  • Telecom DC/DC power
  • Routers & switches Agency information cURus Recognition file number: E91958, Guide JFHR2 & JFHR8 Environmental compliance HALOGEN HFFREE 2822HC xx -R TR Family code Ampere rating RoHS compliant Packaging code Ordering part number Packaging code suffix TR (1000 parts on a 13” diameter tape and reel)

High current surface mount Brick fuse www.eaton.com/electronicsElectrical characteristics Amp Rating 1.0 In minimum 2.5 In maximum

40 A ~ 125 A 4 hours 60 seconds

@ rated voltage1 Typical cold resistance2 Typical voltage drop Part number (A) (Vdc) (A) (mΩ) (mV) Part marking 2822HC40-R 40 72* 1000 A @ 72 Vdc 1000 A @ 80 Vdc 1.10 75 BUSS 2822HC 40A 2822HC50-R 50 72* 1000 A @ 72 Vdc 1000 A @ 80 Vdc 0.87 75 BUSS 2822HC 50A 2822HC60-R 60 72* 1000 A @ 72 Vdc 1000 A @ 80 Vdc 0.78 100 BUSS 2822HC 60A 2822HC70-R 70 72* 1000 A @ 72 Vdc 500 A @ 80 Vdc 0.60 100 BUSS 2822HC 70A 2822HC80-R 80 72* 1000 A @ 72 Vdc 500 A @ 80 Vdc 0.58 100 BUSS 2822HC 80A 2822HC90-R 90 72* 1000 A @ 72 Vdc 500 A @ 80 Vdc 0.54 100 BUSS 2822HC 90A 2822HC100-R 100 72* 1000 A @ 72 Vdc 500 A @ 80 Vdc 0.45 100 BUSS 2822HC 100A 2822HC125-R 125 60 1000 A @ 60 Vdc 0.40 110 BUSS 2822HC 125A 1. DC Interrupting rating (measured at designated voltage, time constant of less than 1 mlliseconds, battery source) 2. Typical cold resistance is measured at <10% of rated current in ambient temperature of +25 °C *= UL rated at 72 Vdc and 80 Vdc Dimensions- mm Drawing not to scale Amp rating L W T W1 T1 Recommended pad layout Standard test board Testing board: 1 .6 mm FR4 PCB Copper thickness: 3 oz for 40 A – 70 A, 6 oz for above 70 A. Tin plated

High current surface mount Brick fuse www.eaton.com/electronics Packaging information - mm 1000 parts per 13” diameter reel (EIA-481 compliant) Drawing not to scale Dimension millimeter W 16.0 F 7.5 E 1.75 P0 4.0 P 12.0 P2 2.0 ØD0 1.50 ØD1 N/A A0 6.3 B0 8.0 K0 4.7 Reel dimension- mm Dimension millimeter A 330 B 2.2 C 13.5 D 22 W1 16.5 W2 22.4 maximum General specifications Operating temperature: -40 °C to +125 °C with proper derating factor applied Soldering heat resistance: MIL-STD-202 method 210, Solder temperature +260 ±5 °C, solder immersion time 10±5 s Solderability test: J-STD-002, method B1, Steam aging 1 hour, Solder temperature + 255 ±5 °C, solder immersion time 5 s Thermal shock: MIL-STD-202 method 107, -40 °C/+125 °C. 1000 cycles, maximum transfer time 20 seconds, Dwell time 15 minutes. Air-Air Humidity bias: MIL-STD-202 method 103, 1000 hours +85 °C/85% RH. at 10% of operating power. Vibration: MIL-STD-202F method 201, 2 hours each of 3 orientations. Test from 10-55 Hz for 1 minute Mechanical shock: MIL-STD-202 method 213, Figure 1 of Method 213. Condition C 100 g 6 ms High temperature operating life: MIL-STD-202 method 108, Condition D steady state TA=+70 °C at 60% rated current.

High current surface mount Brick fuse www.eaton.com/electronics T emperature derating curveDerating factor T emperature (°C) I2t vs. time curve I2t (A2s) Time (seconds) Time vs. current curve Current (A) Time (seconds) I2t vs. currentI2t (A2s) Current (A)

High current surface mount Brick fuse www.eaton.com/electronics Temperature Time Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area Reference Profile feature Standard SnPb solder Lead (Pb) free solder Preheat • Temperature min. (T smin) 100 °C 100 °C

  • Temperature typ. (Tstyp) 120 °C 120 °C
  • Temperature max. (Tsmax) 130 °C 130 °C
  • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 6 seconds max 3 seconds max each wave 6 seconds max 3 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Manual solder +350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended. Wave solder profile

1000 Eaton Boulevard

Cleveland, OH 44122 United States Eaton.com/electronics © 2022 Eaton All Rights Reserved Printed in USA Publication No. ELX1147 BU-ELX22002 February 2022 2822HC High current surface mount Brick fuse Technical Data ELX1 147 Effective February 2022 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C