27LV256 MICROCHIP | Alldatasheet
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Technical content
Ó 1996 Microchip Technology Inc. DS11020F-page 1 27LV256
FEATURES
- Wide voltage range 3.0V to 5.5V
- High speed performance - 200 ns access time available at 3.0V
- CMOS Technology for low power consumption - 8 mA Active current at 3.0V - 20 mA Active current at 5.5V - 100 m A Standby current
- Factory programming available
- Auto-insertion-compatible plastic packages
- Auto ID aids automated programming
- Separate chip enable and output enable controls
- High speed “Express” programming algorithm
- Organized 32K x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC package - 28-pin SOIC package - 28-pin VSOP package - Tape and reel
- Data Retention > 200 years
- Available for the following temperature ranges: - Commercial: 0˚C to +70˚C - Industrial: -40˚C to +85˚C
DESCRIPTION
The Microchip Technology Inc. 27LV256 is a low volt- age (3.0 volt) CMOS EPROM designed for battery powered applications. The device is organized as a 32K x 8 (32K-Byte) non-volatile memory product. The 27LV256 consumes only 8 mA maximum of active cur- rent during a 3.0 volt read operation therefore improv- ing battery performance. This device is designed for very low voltage applications where conventional 5.0 volt only EPROMS can not be used. Accessing individ- ual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 200 ns at 3.0V. This device allows systems designers the ability to use low voltage non-volatile memory with today’s' low voltage microprocessors and peripherals in battery powered applications. A complete family of packages is offered to provide the most flexibility in applications. For surface mount appli- cations, PLCC, VSOP or SOIC packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages. PACKAGE TYPES
- 1 V A12 V V A14 A13 A11 OE A10 CE PP SS CC NC A11 NC OE A10 CE A12 V NU Vcc A14 A13 V NU PPSS VPP A12 V SS VCC A14 A13 A11 OE A10 CE A10 CE V SS OE A11 V PP A12 A13 A14 V CC PDIP PLCC SOIC VSOP 27LV256 27LV25627LV25627LV256 256K (32K x 8) Low-Voltage CMOS EPROM This document was created with FrameMaker404
Ó 1996 Microchip Technology Inc.
1.0 ELECTRICAL
1.1 Maxim um Ratings*
V CC and input voltages w.r.t. V SS V PP voltage w.r.t. V SS during Voltage on A9 w.r.t. V SS Output voltage w.r.t. V SS CC +1.0V *Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rat- ing only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating con- ditions for extended periods may affect device reliability. TABLE 1-1: PIN FUNCTION TABLE Name Function A0-A14 Address Inputs CE Chip Enable OE Output Enable V PP Programming Voltage O0 - O7 Data Output V CC +5V or +3V Power Supply V SS Ground NC No Connection; No Internal Connection NU Not Used; No External Connection Is Allowed TABLE 1-2: READ OPERATION DC CHARACTERISTICS V CC = +5V 10% or 3.0V where indicated Commercial: Tamb = 0˚C to +70˚C Industrial: Tamb = -40˚C to +85˚C Parameter Part* Status Symbol Min. Max. Units Conditions Input Voltages all Logic "1" Logic "0" V IH V IL 2.0 -0.5 V CC 0.8 V V Input Leakage all I LI -10 10 m AV IN = 0 to V CC Output Voltages all Logic "1" Logic "0" V OH V OL 2.4 0.45 V V I OH = -400 m A I OL = 2.1 mA Output Leakage all — I LO -10 10 m AV OUT = 0V to V CC Input Capacitance all — C IN — 6 pF V IN = 0V; Tamb = 25 f = 1 MHz Output Capacitance all — C OUT —1 2 p F V OUT = 0V; Tamb = 25 f = 1 MHz Power Supply Current, Active C I TTL input TTL input I CC 1 I CC 2 20 @ 5.0V 8 @ 3.0V 25 @ 5.0V 10 @ 3.0V mA mA mA mA V CC = 5.5V; V PP = V CC f = 1 MHz; OE = CE = V IL I OUT = 0 mA; V IL = -0.1 to 0.8V; V IH = 2.0 to V CC Note 1 Power Supply Current, Standby C I all TTL input TTL input CMOS input I CC S ) — 1 @ 3.0V 2 @ 3.0V 100 @ 3.0V mA mA m AC E =V CC 0.2V * Parts: C=Commercial Temperature Range I =Industrial Temperature Ranges Note 1: Typical active current increases .75 mA per MHz up to operating frequency for all temperature ranges.
Ó 1996 Microchip Technology Inc. DS11020F-page 3 27LV256 TABLE 1-3: READ OPERATION AC CHARACTERISTICS FIGURE 1-1: READ WAVEFORMS AC Testing Waveform: V IH = 2.4V and V IL = 0.45V; V OH = 2.0V V OL = 0.8V Output Load: 1 TTL Load + 100 pF Input Rise and Fall Times: 10 ns Ambient Temperature: Commercial: Tamb = 0˚C to +70˚C Industrial: Tamb = -40˚C to +85˚C Parameter Sym 27HC256-20 27HC256-25 27HC256-30 Units Conditions Min Max Min Max Min Max Address to Output Delay t ACC — 200 — 250 — 300 ns CE = OE = V IL CE to Output Delay t CE — 200 — 250 — 300 ns OE = V IL OE to Output Delay t OE — 100 — 125 — 125 ns CE = V IL CE or OE to O/P High Impedance t OFF 0 50 0 50 0 50 ns Output Hold from Address CE or OE, whichever goes first t OH 0—0—0 —n s Address VIH VIL VIH VIL VIH VIL Outputs O0 - O7 VOH VOL Address valid tCE(2) tOE(2) High Z Valid Output tACC (1) tOFF is specified for OE or CE, whichever occurs first (2) OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE (3) This parameter is sampled and is not 100% tested. High Z tOH tOFF(1,3) CE OE Notes:
Ó 1996 Microchip Technology Inc. TABLE 1-4: PROGRAMMING DC CHARACTERISTICS TABLE 1-5: PROGRAMMING AC CHARACTERISTICS Ambient Temperature: Tamb = 25 C C V CC = 6.5V 0.25V, V PP = 13.0V 0.25V Parameter Status Symbol Min Max. Units Conditions Input Voltages Logic”1” Logic”0” V IH V IL 2.0 -0.1 V CC 0.8 V V Input Leakage — I LI -10 10 m AV IN = 0V to V CC Output Voltages Logic”1” Logic”0” V OH V OL 2.4 0.45 V V I OH = -400 m A I OL = 2.1 mA V CC Current, program & verify — I CC 2 — 20 mA Note 1 V PP Current, program — I PP 2 — 25 mA Note 1 A9 Product Identification — V H 11.5 12.5 V Note 1: V CC must be applied simultaneously or before V PP and removed simultaneously or after V PP for Program, Program Verify AC Testing Waveform: V IH =2.4V and V IL =0.45V; V OH =2.0V; V OL =0.8V and Program Inhibit Modes Output Load: 1 TLL Load + 100pF Ambient Temperature: Tamb=25 C C V CC = 6.5V 0.25V, V PP =13.0V 0.25V Parameter Symbol Min. Max. Units Remarks Address Set-Up Time t AS 2— ms Data Set-Up Time t DS 2— ms Data Hold Time t DH 2— ms Address Hold Time t AH 0— ms Float Delay (2) t DF 0 130 ns VCC Set-Up Time t VCS 2— ms Program Pulse Width (1) t PW 95 105 ms 100 ms typical CE Set-Up Time t CES 2— ms OE Set-Up Time t OES 2— ms VPP Set-Up Time t VPS 2— ms Data Valid from OE tOE — 100 ns Note 1: For express algorithm, initial programming width tolerance is 100 ms –5%. 2: This parameter is only sampled and not 100% tested. Output float is defined as the point where data is no longer driven (see timing diagram).
Ó 1996 Microchip Technology Inc. DS11020F-page 5 27LV256 FIGURE 1-2: PROGRAMMING WAVEFORMS TABLE 1-6: MODES Operation Mode CE OE VPP A9 O0 - O7 Read V IL VIL VCC XD OUT Program V IL VIH VH XD IN Program Verify V IH VIL VH XD OUT Program Inhibit V IH VIH VH X High Z Standby V IH XV CC X High Z Output Disable V IL VIH VCC X High Z Identity V IL VIL VCC VH Identity Code X = Don’t Care VIH VIL VIH VIL 13.0V(2) 5.0V 6.5V(2) 5.0V V IH VIL VIH VIL Address Data VPP VCC CE OE tDF and tOE are characteristics of the device but must be accommodated by the programmer VCC = 6.5V –0.25V, VPP = VH = 13.0V –0.25V for express algorithm tPW tOPW tOES Address Stable tAH tDS tVPS tDF (1)tDH tOE (1) tAS Program Data Stable Data Out Valid Verify tVCS Notes: (1) (2) High Z
1.2 Read Mode
(See Timing Diagrams and AC Characteristics) Read Mode is accessed when: a) the CE pin is low to power up (enable) the chip b) the OE pin is low to gate the data to the output pins For Read operations, if the addresses are stable, the address access time (tACC ) is equal to the delay from CE to output (tCE ). Data is transferred to the output after a delay from the falling edge of OE (tOE ).
DS11020F-page 6 Ó 1996 Microchip Technology Inc.
1.3 Standb y Mode
The standby mode is defined when the CE pin is high (VIH) and a program mode is not defined. Output Dis- able
1.4 Output Enab le
This feature eliminates bus contention in multiple bus microprocessor systems and the outputs go to a high impedance when the following condition is true:
- The OE pin is high and program mode is not defined.
1.5 Pr ogramming Mode
The Express algorithm has been developed to improve on the programming throughput times in a production environment. Up to 10 100-microsecond pulses are applied until the byte is verified. No over-programming is required. A flowchart of the express algorithm is shown in Figure 1. Programming takes place when: a) V CC is brought to the proper voltage b) V PP is brought to the proper VH level c) the OE pin is high d) the CE pin is low Since the erased state is “1” in the array, programming of “0” is required. The address to be programmed is set via pins A0-A14 and the data to be programmed is pre- sented to pins O0-O7. When data and address are sta- ble, a low-going pulse on the CE line programs that location.
1.6 V erify
After the array has been programmed it must be veri- fied to ensure that all the bits have been correctly pro- grammed. This mode is entered when all of the following conditions are met: a) V CC is at the proper level b) V PP is at the proper VH level c) the CE pin is high d) the OE line is low
1.7 Inhibit
When Programming multiple devices in parallel with different data, only CE needs to be under separate con- trol to each device. By pulsing the CE line low on a par- ticular device, that device will be programmed, and all other devices with CE held high will not be pro- grammed with the data although address and data are available on their input pins.
1.8 Identity Mode
In this mode specific data is outputted which identifies the manufacturer as Microchip Technology Inc. and device type. This mode is entered when Pin A9 is taken to V H (11.5V to 12.5V). The CE and OE lines must be at VIL. A0 is used to access any of the two non-erasable bytes whose data appears on O0 through O7. Pin Input Output Identity A0 0 O O O O O O O H e x Manufacturer Device Type* V IL VIH * Code subject to change.
Ó 1996 Microchip Technology Inc. DS11020F-page 7 27LV256 FIGURE 1-3: PROGRAMMING EXPRESS ALGORITHM Start ADDR = First Location VCC = 6.5V VPP = 13.0V X = 0 Program one 100 ms pulse Increment X Verify Byte Pass Fail X = 10? No Yes Device Failed Last Address? No Increment Address Conditions: Tamb = 25+/-5C VCC = 6.5+/-0.25V VPP = 13.0+/-0.25V Yes VCC = VPP = 4.5V, 5.5V Device Passed All bytes = original data? Device Failed NoYes
DS11020F-page 8 Ó 1996 Microchip Technology Inc. NOTES:
Ó 1996 Microchip Technology Inc. DS11020F-page 9 27LV256 NOTES:
DS11020F-page 10 Ó 1996 Microchip Technology Inc. NOTES:
Ó 1996 Microchip Technology Inc. DS11020F-page 11 27LV256 Product Identification System To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices. Package: L = Plastic Leaded Chip Carrier P = Plastic DIP (600 Mil) SO = Plastic SOIC (300 Mil) VS = Very Small Outline Package (VSOP) 8X13.4mm Temperature Blank = 0˚C to +70˚C Range: I = -40˚C to +85˚C Access 20 = 200 ns Time: 25 = 250 ns 30 = 300 ns (SOIC only) Device: 27LV256 256K (32K x 8) Low-Voltage CMOS EPROM 27LV256 – 25 I /P
DS11020F-page 12 Ó 1996 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre- sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not autho- rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. W ORLDWIDE SALES & SERVICE ASIA/PACIFIC China Microchip Technology Unit 406 of Shanghai Golden Bridge Bldg.
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