M27C512 STMICROELECTRONICS | Alldatasheet
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512 Kbit (64K x8) UV EPROM and OTP EPROM
■ PROGRAMMING TIMES of AROUND 6sec. Figure 1. Packages
organized as 65536 by 8 bits. device by following the programming procedure. TSOP28 (8 x 13.4 mm) packages. (Restriction of Hazardous Substances) directive. Figure 2. Logic Diagram Table 1. Signal Names
Figure 3. DIP Connections Figure 4. LCC Connections Figure 5. TSOP Connections
1 A15
control and should be used for device selection. ble for at least tAVQV -tGLQV . Table 2. Operating Modes Note: X = VIH or VIL, VID = 12V ± 0.5V. Table 3. Electronic Signature
caused by the inductive effects of PCB traces. Figure 6. Programming Flowchart applied to 8 bits in parallel to the data output pins. programming time (typically less than 6 seconds). Algorithm can be used as well. that each cell is programmed with enough margin. MARGIN MODE provides the necessary margin. with its corresponding programming algorithm. Table 3. and can be read-out on outputs Q7 to Q0.
ERASURE OPERATION (APPLIES FOR UV EPROM) The erasure characteristics of the M27C512 is such that erasure begins when the cells are ex- posed to light with wavelengths shorter than ap- proximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C512 in about 3 years, while it would take ap- proximately 1 week to cause erasure when ex- posed to direct sunlight. If the M27C512 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C512 window to prevent unintentional erasure. The recommended erasure procedure for the M27C512 is exposure to short wave ultraviolet light which has wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dos- age is approximately 15 to 20 minutes using an ul- traviolet lamp with 12000 µW/cm2 power rating. The M27C512 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.
Table 4. may cause permanent damage to the de- Table 4. Absolute Maximum Ratings and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
- Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC
voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
Table 5. AC Measurement Conditions Figure 7. Testing Input Output Waveform Figure 8. AC Testing Load Circuit Table 6. Capacitance
- Sampled only, not 100% tested.
Table 7. Read Mode DC Characteristics Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP .
- Maximum DC voltage on Output is VCC +0.5V.
Table 8. Read Mode AC Characteristics Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP .
- Sampled only, not 100% tested.
- Speed obtained with High Speed AC measurement conditions.
Table 9. Read Mode AC Characteristics Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP .
- Sampled only, not 100% tested.
Figure 9. Read Mode AC Waveforms
Table 10. Programming Mode DC Characteristics
- VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP .
Table 11. Margin Mode AC Characteristics
- VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
Figure 10. Margin Mode AC Waveforms Note: A8 High level = 5V; A9 High level = 12V.
Table 12. Programming Mode AC Characteristics
- VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP .
- Sampled only, not 100% tested.
Figure 11. Programming and Verify Modes AC Waveforms
Figure 12. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline Note: Drawing is not to scale. Table 13. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data
Figure 13. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Outline Note: Drawing is not to scale. Table 14. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Mechanical Data
Figure 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline Note: Drawing is not to scale. Table 15. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data
Figure 15. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Outline Table 16. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Mechanical Data
Table 17. Ordering Information Scheme Note: 1. High Speed, see AC Characteristics section for further information.
REVISION HISTORY
Table 18. Revision History 08-Nov-2004 2.0 Details of ECOPACK lead-free package options added.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America