MC33275 ONSEMI | Alldatasheet
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Semiconductor Components Industries, LLC, 2000 March, 2000 – Rev. 4
1 Publication Order Number:
/C0077/C0067/C0051/C0051/C0050/C0055/C0053 /C0076/C0111/C0119 /C0068/C0114/C0111/C0112/C0111/C0117/C0116 /C0051/C0048/C0048 /C0109/C0065 /C0086/C0111/C0108/C0116/C0097/C0103/C0101 /C0082/C0101/C0103/C0117/C0108/C0097/C0116/C0111/C0114 The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, DPAK, SOT–223, and SOP–8 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33275 is available as a MC33375 which includes an On/Off control. Due to the low input–to–output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. Features:
- Low Quiescent Current (125 /C0109A)
- Low Input–to–Output V oltage Differential of 25 mV at IO = 10 mA, and 260 mV at IO = 300 mA
- Extremely Tight Line and Load Regulation
- Stable with Output Capacitance of only 0.33 /C0109F for 2.5 V Output V oltage
- Internal Current and Thermal Limiting Simplified Block Diagram Vin Thermal & Anti–sat Protection 54 K Rint This device contains 41 active transistors 1.23 V V. Ref. Vout Gnd LOW DROPOUT MICROPOWER VOLTAGE REGULATOR
ORDERING INFORMATION
http://onsemi.com PLASTIC ST SUFFIX CASE 318E PLASTIC DT SUFFIX CASE 369A Gnd Vin Vout 123 MC33375 Gnd Input Gnd Gnd Gnd Output Gnd Gnd N/C MC33375 Pins 4 and 5 Not Connected Gnd Vin Vout 12 3 MC33275 Gnd See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
http://onsemi.com MAXIMUM RATINGS (TA = 25°C, for min/max values TJ = –40°C to +125°C) Rating Symbol Value Unit Input Voltage VCC 13 Vdc Power Dissipation and Thermal Characteristics TA = 25°C Maximum Power Dissipation Case 751 (SOP–8) D Suffix Thermal Resistance, Junction–to–Ambient Thermal Resistance, Junction–to–Case Case 369A (DPAK) DT Suffix Thermal Resistance, Junction–to–Air Thermal Resistance, Junction–to–Case Case 318E (SOT–223) ST Suffix Thermal Resistance, Junction–to–Air Thermal Resistance, Junction–to–Case PD R θJA R θJC R θJA R θJC R θJA R θJC Internally Limited 160 6.0 245 W °C/W °C/W °C/W °C/W °C/W °C/W Output Current IO 300 mA Maximum Junction Temperature TJ 150 °C Operating Junction Temperature Range TJ – 40 to +125 °C Storage Temperature Range Tstg – 65 to +150 °C ELECTRICAL CHARACTERISTICS (CL = 1.0µF, TA = 25°C, for min/max values TJ = –40°C to +125°C, Note 1) Characteristic Symbol Min Typ Max Unit Output Voltage I O = 0 mA to 250 mA
2.5 V Suffix T A = 25°C, Vin = [VO + 1] V
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
2.5 V Suffix V in = [VO + 1] V, 0 < IO < 100 mA
3.0 V Suffix 2% Tolerance from T J = –40 to +125°C
2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 2.50 3.00 3.30 5.00 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 Vdc Line Regulation V in = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25°C Reg line – 2.0 10 mV Load Regulation V in = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25°C Reg load – 5.0 25 mV Dropout Voltage IO = 10 mA T J = –40°C to +125°C IO = 100 mA IO = 250 mA IO = 300 mA Vin – VO 115 220 260 100 200 400 500 mV Ripple Rejection (120 Hz) Vin(peak–peak) = [VO + 1.5] V to [VO + 5.5] V — 65 75 — dB Output Noise Voltage C L = 1 /C0109FI O = 50 mA (10 Hz to 100 kHz) C L = 200 /C0109F Vn 160 /C0109Vrm s CURRENT PARAMETERS Characteristic Symbol Min Typ Max Unit Quiescent Current On Mode V in = [VO + 1] V, IO = 0 mA On Mode SAT V in = [VO – 0.5] V, IO = 0 mA, Note 2 IQ 125 1100 200 1500 /C0109A Current Limit V in = [VO + 1], VO shorted ILIMIT — 450 — mA THERMAL SHUTDOWN Characteristic Symbol Min Typ Max Unit Thermal Shutdown — — 150 — °C NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO – 0.5] V guarantees this condition.
http://onsemi.com DEFINITIONS Load Regulation – The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage – The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage – The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation – The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current – Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation – The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation – The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150°C. The junction temperature is rising while the difference between the input power (V CC X ICC ) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: Pd /C0043 TJ –T A R /C0113JA The maximum operating junction temperature TJ is specified at 150°C, if TA = 25°C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as: Iout/C0043 PD VCC –V out The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150°C for MC33275) and ambient temperature. R /C0113JA /C0043 TJ –T A PD
http://onsemi.com Temperature Range, Tolerance Case Package MC33275DT–2.5RK 25V 369A DPAK MC33275ST–2.5T3 2.5 V (Fixed Voltage) 318E SOT–223 MC33275D–2.5R2 (Fixed Voltage) 751–5 SOP–8 MC33275DT–3.0RK 30V 1% T l 369A DPAK MC33275ST–3.0T3 3.0 V (Fixed Voltage) 1% Tolerance at TA = 25°C 318E SOT–223 MC33275D–3.0R2 (Fixed Voltage) at TA 25 C 751–5 SOP–8 MC33275DT–3.3RK 33V 2% T l t 369A DPAK MC33275ST–3.3T3 3.3 V (Fixed Voltage) 2% Tolerance at TJ from –40 to +125°C 318E SOT–223 MC33275D–3.3R2 (Fixed Voltage) TJ from 40 to +125 C 751–5 SOP–8 MC33275DT–5.0RK 50V 369A DPAK MC33275ST–5.0T3 5.0 V (Fixed Voltage) 318E SOT–223 MC33275D–5.0R2 (g ) 751–5 SOP–8 DEVICE MARKING Device Version Marking (1st line) MC33275 2.5V 27525 MC33275 3.0V 27530 MC33275 3.3V 27533 MC33275 5.0V 27550 TAPE AND REEL SPECIFICATIONS Device Reel Size Tape Width Quantity MC33275DT 13” 16mm embossed tape 2500 units MC33275D 13” 12mm embossed tape 2500 units MC33275S 13” 8mm embossed tape 4000 units
http://onsemi.com PACKAGE DIMENSIONS D SUFFIX PLASTIC PACKAGE CASE 751–06 (SOP–8) ISSUE T ST SUFFIX PLASTIC PACKAGE CASE 318E–04 (SOT–223) ISSUE J H S F A B D G L 12 3 0.08 (0003) C M K J DIM A MIN MAX MIN MAX MILLIMETERS 0.249 0.263 6.30 6.70 INCHES B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1.05 M 0 10 0 10 S 0.264 0.287 6.70 7.30 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. /C0095/C0095 /C0095 /C0095 SEATING PLANE A0.25 M CB SS
0.25 M B M
h /C0113 C X 45/C0095 L DIM MIN MAX MILLIMETERS A 1.35 1.75 A1 0.10 0.25 B 0.35 0.49 C 0.19 0.25 D 4.80 5.00 E
1.27 BSCe
3.80 4.00 H 5.80 6.20 h 0 7 L 0.40 1.25 /C0113 0.25 0.50 /C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. D E H A B e BA1 C A 0.10
http://onsemi.com PACKAGE DIMENSIONS DT SUFFIX PLASTIC PACKAGE CASE 369A–13 (DPAK) ISSUE Z D A K B RV S F L G 2 PL M0.13 (0.005) T E C U J H –T– SEATING PLANE Z DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.235 0.250 5.97 6.35 B 0.250 0.265 6.35 6.73 C 0.086 0.094 2.19 2.38 D 0.027 0.035 0.69 0.88 E 0.033 0.040 0.84 1.01 F 0.037 0.047 0.94 1.19 G 0.180 BSC 4.58 BSC H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.102 0.114 2.60 2.89 L 0.090 BSC 2.29 BSC R 0.175 0.215 4.45 5.46 S 0.020 0.050 0.51 1.27 V 0.030 0.050 0.77 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 12 3
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