MRFE6S9045NR1 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- Characterized with Series Equivalent Large-Signal Impedance Parameters
- Integrated ESD Protection
- 225°C Capable Plastic Package
- RoHS Compliant
- In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel.
Table 1. Maximum Ratings Table 2. Thermal Characteristics
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf . Select Tools (Software & Tools)/Calculators to access MTTF calculators
Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2007. All rights reserved.
Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted)
Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued)
Figure 1. MRFE6S9045NR1 Test Circuit Schematic Table 6. MRFE6S9045NR1 Test Circuit Component Designations and Values
Figure 2. MRFE6S9045NR1 Test Circuit Component Layout
Figure 14. Single-Carrier CCDF N-CDMA
1.2288 MHz
Figure 15. Single-Carrier N-CDMA Spectrum
Figure 16. Series Equivalent Source and Load Impedance
Refer to the following documents to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Oct. 2007 • Initial Release of Data Sheet
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