25AA010AT-I/MC

25AA010A MICROCHIP | Alldatasheet

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Technical content

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 1 25AA010A/25LC010A Device Selection Table Features:

• 10 MHz max. clock frequency
• Low-power CMOS technology: - Max. Write Current: 5 mA at 5.5V, 10 MHz - Read Current: 5 mA at 5.5V, 10 MHz - Standby Current: 5 μA at 5.5V
• 128 x 8-bit organization
• Write Page mode (up to 16 bytes)
• Sequential Read
• Self-timed Erase and Write cycles (5 ms max.)
• Block Write protection: - Protect none, 1/4, 1/2 or all of array
• Built-in Write protection: - Power-on/off data protection circuitry - Write enable latch - Write-protect pin
• High reliability: - Endurance: 1,000,000 Erase/Write cycles - Data retention: > 200 years - ESD protection: > 4000V
• Temperature ranges supported:
• Pb-Free packages available Pin Function Table Description: The Microchip Technology Inc. 25XX010A* is a 1 Kbit Serial Electrically Erasable Programmable Read-Only Memory (EEPROM). The memory is accessed via a simple Serial Peripheral Interface™ (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 25XX010A is available in standard packages including 8-lead PDIP and SOIC, and advanced packages including 8-lead MSOP, 8-lead TSSOP and rotated TSSOP, 8-lead 2x3 DFN, and 6-lead SOT-23. Package Types (not to scale) Part Number VCC Range Page Size Temp. Ranges Packages 25AA010A 1.8-5.5V

16 Bytes

I P, MS, SN, ST, MC, OT 25LC010A 2.5-5.5V I, E P, MS, SN, ST, MC, OT - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Name Function CS Chip Select Input SO Serial Data Output WP Write-Protect VSS Ground SI Serial Data Input SCK Serial Clock Input HOLD Hold Input VCC Supply Voltage CS SO WP VSS VCC HOLD SCK SI (P, SN) VSS VDD CS SO (OT) PDIP/SOIC X-Rotated TSSOP HOLD VCC CS SO SCK SI VSS WP (X/ST) CS SO WP VSS VCC HOLD SCK SI CS SO WP VSS VCC HOLD SCK SI (ST, MS) TSSOP/MSOP SOT-23 SCK SI CS SO WP VSS VCC HOLD SCK SI (MC) DFN 1K SPI Bus Serial EEPROM *25XX010A is used in this document as a generic part number for the 25AA010A and the 25LC010A.

© 2006 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†) TABLE 1-1: DC CHARACTERISTICS † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability. DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Automotive (E): TA = -40°C to +125°C VCC = 2.5V to 5.5V Param. No. Sym. Characteristic Min. Max. Units Test Conditions D001 VIH1 High-level Input Voltage

0.7 VCC

V D002 VIL1 Low-level Input Voltage -0.3

0.3 VCC

V VCC ≥ 2.7V (Note) D003 VIL2 -0.3

0.2 VCC

V VCC < 2.7V (Note) D004 VOL Low-level Output Voltage 0.4 V IOL = 2.1 mA D005 VOL 0.2 V IOL = 1.0 mA, VCC < 2.5V D006 VOH High-level Output Voltage VCC -0.5 V IOH = -400 μA D007 ILI Input Leakage Current μA CS = VCC, VIN = VSS TO VCC D008 ILO Output Leakage Current μA CS = VCC, VOUT = VSS TO VCC D009 CINT Internal Capacitance (all inputs and outputs) pF TA = 25°C, CLK = 1.0 MHz, VCC = 5.0V (Note) D010 ICC Read Operating Current 2.5 mA mA VCC = 5.5V; FCLK = 10.0 MHz; SO = Open VCC = 2.5V; FCLK = 5.0 MHz; SO = Open D011 ICC Write mA mA VCC = 5.5V VCC = 2.5V D012 ICCS Standby Current μA μA CS = VCC = 5.5V, Inputs tied to VCC or VSS, TA = +125°C CS = VCC = 2.5V, Inputs tied to VCC or VSS, TA = +85°C Note: This parameter is periodically sampled and not 100% tested.

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 3 25AA010A/25LC010A TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Automotive (E): TA = -40°C to +125°C VCC = 2.5V to 5.5V Param. No. Sym. Characteristic Min. Max. Units Test Conditions FCLK Clock Frequency MHz MHz MHz 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCSS CS Setup Time 100 150 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCSH CS Hold Time 100 200 250 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCSD CS Disable Time ns Tsu Data Setup Time ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V THD Data Hold Time ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TR CLK Rise Time μs (Note 1) TF CLK Fall Time μs (Note 1) THI Clock High Time 0.05 0.1 0.15 1000 1000 1000 μs μs μs 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TLO Clock Low Time 0.05 0.1 0.15 1000 1000 1000 μs μs μs 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCLD Clock Delay Time ns TCLE Clock Enable Time ns TV Output Valid from Clock Low 100 160 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V THO Output Hold Time ns (Note 1) TDIS Output Disable Time 160 ns ns ns 4.5V ≤ VCC < 5.5V (Note 1) 2.5V ≤ VCC < 4.5V (Note 1) 1.8V ≤ VCC < 2.5V (Note 1) THS HOLD Setup Time ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V Note 1: This parameter is periodically sampled and not 100% tested. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from our web site: www.microchip.com. TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle is complete.

© 2006 Microchip Technology Inc. TABLE 1-3: AC TEST CONDITIONS THH HOLD Hold Time ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V THZ HOLD Low to Output High-Z 160 ns ns ns 4.5V ≤ VCC < 5.5V (Note 1) 2.5V ≤ VCC < 4.5V (Note 1) 1.8V ≤ VCC < 2.5V (Note 1) THV HOLD High to Output Valid 160 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TWC Internal Write Cycle Time (byte or page) ms (NOTE 3) Endurance E/W Cycles (NOTE 2) TABLE 1-2: AC CHARACTERISTICS (CONTINUED) AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Automotive (E): TA = -40°C to +125°C VCC = 2.5V to 5.5V Param. No. Sym. Characteristic Min. Max. Units Test Conditions Note 1: This parameter is periodically sampled and not 100% tested. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from our web site: www.microchip.com. TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle is complete. AC Waveform: VLO = 0.2V VHI = VCC - 0.2V (Note 1) VHI = 4.0V (Note 2) CL = 100 pF Timing Measurement Reference Level Input

0.5 VCC

Note 1: For VCC ≤ 4.0V For VCC > 4.0V

© 2006 Microchip Technology Inc. 2.0 FUNCTIONAL DESCRIPTION 2.1 Principles of Operation The 25XX010A is a 128 byte Serial EEPROM designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today’s popular microcontroller families, including Microchip’s PICmicro® microcontrol- lers. It may also interface with microcontrollers that do not have a built-in SPI port by using discrete I/O lines programmed properly in firmware to match the SPI protocol. The 25XX010A contains an 8-bit instruction register. The device is accessed via the SI pin, with data being clocked in on the rising edge of SCK. The CS pin must be low and the HOLD pin must be high for the entire operation. Table 2-1 contains a list of the possible instruction bytes and format for device operation. All instructions, addresses, and data are transferred MSb first, LSb last. Data (SI) is sampled on the first rising edge of SCK after CS goes low. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input and place the 25XX010A in ‘HOLD’ mode. After releasing the HOLD pin, operation will resume from the point when the HOLD was asserted. 2.2 Read Sequence The device is selected by pulling CS low. The 8-bit READ instruction is transmitted to the 25XX010A followed by an 8-bit address. See Figure 2-1 for more details. After the correct READ instruction and address are sent, the data stored in the memory at the selected address is shifted out on the SO pin. Data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses to the slave. The internal Address Pointer automatically increments to the next higher address after each byte of data is shifted out. When the highest address is reached (7Fh), the address counter rolls over to address 00h allowing the read cycle to be continued indefinitely. The read operation is terminated by raising the CS pin (Figure 2-1). 2.3 Write Sequence Prior to any attempt to write data to the 25XX010A, the write enable latch must be set by issuing the WREN instruction (Figure 2-4). This is done by setting CS low and then clocking out the proper instruction into the 25XX010A. After all eight bits of the instruction are transmitted, CS must be driven high to set the write enable latch. If the write operation is initiated immedi- ately after the WREN instruction without CS driven high, data will not be written to the array since the write enable latch was not properly set. After setting the write enable latch, the user may proceed by driving CS low, issuing a WRITE instruction, followed by the remainder of the address, and then the data to be written. Up to 16 bytes of data can be sent to the device before a write cycle is necessary. The only restriction is that all of the bytes must reside in the same page. Additionally, a page address begins with XXXX 0000 and ends with XXXX 1111. If the internal address counter reaches XXXX 1111 and clock signals continue to be applied to the chip, the address counter will roll back to the first address of the page and over- write any data that previously existed in those locations. For the data to be actually written to the array, the CS must be brought high after the Least Significant bit (D0) of the nth data byte has been clocked in. If CS is driven high at any other time, the write operation will not be completed. Refer to Figure 2-2 and Figure 2-3 for more detailed illustrations on the byte write sequence and the page write sequence, respectively. While the write is in progress, the STATUS register may be read to check the status of the WIP, WEL, BP1 and BP0 bits (Figure 2-6). Attempting to read a memory array location will not be possible during a write cycle. Polling the WIP bit in the STATUS register is recommended in order to determine if a write cycle is in progress. When the write cycle is completed, the write enable latch is reset. Note: Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and, end at addresses that are integer multiples of page size – 1. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 7 25AA010A/25LC010A BLOCK DIAGRAM FIGURE 2-1: READ SEQUENCE SI SO SCK CS HOLD WP STATUS Register I/O Control Memory Control Logic X Dec HV Generator EEPROM Array Page Latches Y Decoder Sense Amp. R/W Control Logic VCC VSS TABLE 2-1: INSTRUCTION SET Instruction Name Instruction Format

Description

Read data from memory array beginning at selected address WRITE 0000 x010 Write data to memory array beginning at selected address WRDI 0000 x100 Reset the write enable latch (disable write operations) WREN 0000 x110 Set the write enable latch (enable write operations) RDSR 0000 x101 Read STATUS register WRSR 0000 x001 Write STATUS register x = don’t care SO SI SCK CS 9 10 X A6 A5 A4 A1 A0 data out high-impedance A3 A2 Address byte 12 13 14 15 16 17 18 19 20 21 22 23 Instruction

© 2006 Microchip Technology Inc. 2.5 Read Status Register Instruction (RDSR) The Read Status Register instruction (RDSR) provides access to the STATUS register. See Figure 2-6 for the RDSR timing sequence. The STATUS register may be read at any time, even during a write cycle. The STA- TUS register is formatted as follows: TABLE 2-2: STATUS REGISTER The Write-In-Process (WIP) bit indicates whether the 25XX010A is busy with a write operation. When set to a ‘1’, a write is in progress, when set to a ‘0’, no write is in progress. This bit is read-only. The Write Enable Latch (WEL) bit indicates the status of the write enable latch and is read-only. When set to a ‘1’, the latch allows writes to the array, when set to a ‘0’, the latch prohibits writes to the array. The state of this bit can always be updated via the WREN or WRDI commands regardless of the state of write protection on the STATUS register. These commands are shown in Figure 2-4 and Figure 2-5. The Block Protection (BP0 and BP1) bits indicate which blocks are currently write-protected. These bits are set by the user issuing the WRSR instruction, which is shown in Figure 2-7. These bits are nonvolatile and are described in more detail in Table 2-3. FIGURE 2-6: READ STATUS REGISTER TIMING SEQUENCE (RDSR) W/R W/R R R X X X X BP1 BP0 WEL WIP W/R = writable/readable. R = read-only. SO SI CS instruction data from STATUS register high-impedance SCK

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 11 25AA010A/25LC010A 2.6 Write Status Register Instruction (WRSR) The Write Status Register instruction (WRSR) allows the user to write to the nonvolatile bits in the STATUS reg- ister as shown in Table 2-2. See Figure 2-7 for the WRSR timing sequence. Four levels of protection for the array are selectable by writing to the appropriate bits in the STATUS register. The user has the ability to write- protect none, one, two or all four of the segments of the array as shown in Table 2-3. TABLE 2-3: ARRAY PROTECTION FIGURE 2-7: WRITE STATUS REGISTER TIMING SEQUENCE (WRSR) BP1 BP0 Array Addresses Write-Protected none upper 1/4 (60h-7Fh) upper 1/2 (40h-7Fh) all (00h-7Fh) SO SI CS instruction data to STATUS register high-impedance SCK Note: An internal write cycle (TWC) is initiated on the rising edge of CS after a valid write STATUS register sequence.

© 2006 Microchip Technology Inc. 2.7 Data Protection The following protection has been implemented to prevent inadvertent writes to the array:

• The write enable latch is reset on power-up
• A write enable instruction must be issued to set the write enable latch
• After a byte write, page write or STATUS register write, the write enable latch is reset
• CS must be set high after the proper number of clock cycles to start an internal write cycle
• Access to the array during an internal write cycle is ignored and programming is continued 2.8 Power-On State The 25XX010A powers on in the following state:
• The device is in low-power Standby mode (CS = 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low-level transition on CS is required to enter active state TABLE 2-4: WRITE-PROTECT FUNCTIONALITY MATRIX WP (pin 3) WEL (SR bit 1) Protected Blocks Unprotected Blocks Status Register 0 (low) x Protected Protected Protected 1 (high) Protected Protected Protected 1 (high) Protected Writable Writable x = don’t care

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 13 25AA010A/25LC010A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Chip Select (CS) A low level on this pin selects the device. A high level deselects the device and forces it into Standby mode. However, a programming cycle which is already initiated or in progress will be completed, regardless of the CS input signal. If CS is brought high during a program cycle, the device will go into Standby mode as soon as the programming cycle is complete. When the device is deselected, SO goes to the high-impedance state, allowing multiple parts to share the same SPI bus. A low-to-high transition on CS after a valid write sequence initiates an internal write cycle. After power- up, a low level on CS is required prior to any sequence being initiated. 3.2 Serial Output (SO) The SO pin is used to transfer data out of the 25XX010A. During a read cycle, data is shifted out on this pin after the falling edge of the serial clock. 3.3 Write-Protect (WP) The WP pin is a hardware write-protect input pin. When it is low, all writes to the array or STATUS reg- ister are disabled, but any other operations function normally. When WP is high, all functions, including nonvolatile writes operate normally. At any time, when WP is low, the write enable reset latch will be reset and programming will be inhibited. However, if a write cycle is already in progress, WP going low will not change or disable the write cycle. See Table 2-4 for the Write-Protect Functionality Matrix. 3.4 Serial Input (SI) The SI pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the serial clock. 3.5 Serial Clock (SCK) The SCK is used to synchronize the communication between a master and the 25XX010A. Instructions, addresses or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin is updated after the falling edge of the clock input. 3.6 Hold (HOLD) The HOLD pin is used to suspend transmission to the 25XX010A while in the middle of a serial sequence without having to retransmit the entire sequence again. It must be held high any time this function is not being used. Once the device is selected and a serial sequence is underway, the HOLD pin may be pulled low to pause further serial communication without resetting the serial sequence. The HOLD pin must be brought low while SCK is low, otherwise the HOLD function will not be invoked until the next SCK high-to- low transition. The 25XX010A must remain selected during this sequence. The SI, SCK and SO pins are in a high-impedance state during the time the device is paused and transitions on these pins will be ignored. To resume serial communication, HOLD must be brought high while the SCK pin is low, otherwise serial communication will not resume. Lowering the HOLD line at any time will tri-state the SO line. Name PDIP, SOIC, MSOP, TSSOP, DFN Rotated TSSOP SOT- Function CS Chip Select Input SO Serial Data Output WP Write-Protect Pin VSS Ground SI Serial Data Input SCK Serial Clock Input HOLD Hold Input VCC Supply Voltage

© 2006 Microchip Technology Inc. 4.0 PACKAGING INFORMATION 4.1 Package Marking Information T/XXXNNN XXXXXXXX YYWW 8-Lead PDIP 8-Lead SOIC XXXXYYWW XXXXXXXT NNN XXXX TYWW 8-Lead TSSOP NNN I/P 1L7 25AA010A 0627 Example: Example: SN 0627 25AA01AI 1L7 1L7 5A1A I627 Example: 1st Line Marking Codes 25AA010A 5A1A 8-Lead MSOP (150 mil) Example: XXXXXT YWWNNN 5L1AI 6271L7 25LC010A A1AX 5L1A L1AX Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e e e Part Number TSSOP Standard Rotated MSOP SOT-23 DFN 5A1AT 5L1AT 12NN 15NN 16NN 401 404 405 I Temp. E Temp. I Temp. E Temp. Note: T = Temperature grade (I, E) NN = Alphanumeric traceability code

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 15 25AA010A/25LC010A Package Marking Information (continued) 6-Lead SOT-23 XXNN Example: 12L7 XXX 8-Lead 2X3 DFN YWW NN Example: 401 627

© 2006 Microchip Technology Inc. 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 § Significant Characteristic

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 17 25AA010A/25LC010A 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

© 2006 Microchip Technology Inc. 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) α A L c β φ D n p B E 10° 10° β Mold Draft Angle Bottom 10° 10° α Mold Draft Angle Top 0.30 0.25 0.19 .012 .010 .007 B Lead Width 0.20 0.15 0.09 .008 .006 .004 c Lead Thickness 0.70 0.60 0.50 .028 .024 .020 L Foot Length 3.10 3.00 2.90 .122 .118 .114 D Molded Package Length 4.50 4.40 4.30 .177 .173 .169 Molded Package Width 6.50 6.38 6.25 .256 .251 .246 E Overall Width 0.15 0.10 0.05 .006 .004 .002 Standoff 0.95 0.90 0.85 .037 .035 .033 Molded Package Thickness 1.10 1.05 1.00 .043 .041 .039 A Overall Height 0.65 .026 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units Foot Angle φ Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. Notes: JEDEC Equivalent: MO-153 Revised 07-21-05 * Controlling Parameter Drawing No. C04-086

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 19 25AA010A/25LC010A 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) D A L c α E p B n φ β F Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. .037 REF F Footprint (Reference) Notes: Revised 07-21-05 * Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness β α c B φ .003 .009 .006 .012 Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L D E .016 .024 .118 BSC .118 BSC .000 .030 .193 BSC .033 MIN p n Units .026 BSC NOM INCHES

0.95 REF

.009 .016 0.08 0.22 0.23 0.40 MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043 .031 .037 .006 0.40 0.00 0.75 MIN MAX NOM 1.10 0.80 0.15 0.95 MAX 15° 15° JEDEC Equivalent: MO-187 15° 15° BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M See ASME Y14.5M Drawing No. C04-111

© 2006 Microchip Technology Inc. 8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated L A TOP VIEW D E EXPOSED PAD METAL BOTTOM VIEW b p n (NOTE 3) EXPOSED TIE BAR PIN 1 (NOTE 1) ID INDEX AREA (NOTE 2) CONFIGURATION CONTACT ALTERNATE DETAIL K 3. Package may have one or more exposed tie bars at ends. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. JEDEC Equivalent MO-229 VCED-2 See ASME Y14.5M See ASME Y14.5M MILLIMETERS*

0.50 BSC

2.00 BSC

0.20 REF.

1. Pin 1 visual index feature may vary, but must be located within the hatched area. .039 .035 .031 0.80 A Overall Height 2. Exposed pad may vary according to die attach paddle size. * Controlling Parameter Contact Length § Notes: Contact Width Standoff Overall Width Overall Length Contact Thickness Exposed Pad Width Exposed Pad Length .010 .008 L b .012 0.20 .001 .008 REF. .079 BSC .118 BSC D .051 .059 E .000 .069 .075 1.30 1.50 .002 0.00 Dimension Limits Pitch Number of Pins INCHES .020 BSC MIN n e NOM Units MAX MIN 1.00 0.90 0.25 0.30 1.75 1.90 0.02 0.05 NOM MAX Contact-to-Exposed Pad .012 K .016 0.40 .020 0.30 0.50 ** Not within JEDEC parameters § Significant Characteristic .008 0.20 DWG No. C04-123 Revised 09-12-05

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 21 25AA010A/25LC010A 6-Lead Plastic Small Outline Transistor (CH or OT) (SOT-23) D B n E L c β φ α A β Mold Draft Angle Bottom α Mold Draft Angle Top 0.50 0.43 0.35 .020 .017 .014 B Lead Width 0.20 0.15 0.09 .008 .006 .004 c Lead Thickness φ Foot Angle 0.55 0.45 0.35 .022 .018 .014 L Foot Length 3.10 2.95 2.80 .122 .116 .110 D Overall Length 1.75 1.63 1.50 .069 .064 .059 Molded Package Width 3.00 2.80 2.60 .118 .110 .102 E Overall Width 0.15 0.08 0.00 .006 .003 .000 Standoff 1.30 1.10 0.90 .051 .043 .035 Molded Package Thickness 1.45 1.18 0.90 .057 .046 .035 A Overall Height

1.90 BSC

.075 BSC Outside lead pitch

0.95 BSC

.038 BSC p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. Notes: JEITA (formerly EIAJ) equivalent: SC-74A * Controlling Parameter Drawing No. C04-120 BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M Revised 09-12-05

© 2006 Microchip Technology Inc. APPENDIX A:

REVISION HISTORY

Corrections to Section 1.0, Electrical Characteristics. Revision C Added Packages SOT-23, DFN and X-rotated TSSOP; Revised AC Char., Params. 9, 10; Revised Package Legend.

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 21 25AA010A/25LC010A THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
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• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
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© 2006 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21832C 25AA010A/25LC010A What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 23 25AA010A/25LC010A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Sales and Support PART NO. X /XX Package Tape & Reel Device Device: 25AA010A 25LC010A 1k-Bit, 1.8V, 16 Byte Page, SPI Serial EEPROM 1k-Bit, 2.5V, 16 Byte Page, SPI Serial EEPROM Tape & Reel: Blank T Standard packaging Tape & Reel Temperature Range: I E -40°C to+85°C -40°C to+125°C Package: MS P SN ST MC OT Plastic MSOP (Micro Small Outline), 8-lead Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead TSSOP, 8-lead 2x3 DFN, 8-lead SOT-23, 6-lead (Tape and Reel only) Examples: 25AA010A-I/MS = 1k-bit, 16-byte page, 1.8V Serial EEPROM, Industrial temp., MSOP package 25AA010AT-I/SN = 1k-bit, 16-byte page, 1.8V Serial EEPROM, Industrial temp., Tape & Reel, SOIC package 25LC010AT-I/SN = 1k-bit, 16-byte page, 2.5V Serial EEPROM, Industrial temp., Tape & Reel, SOIC package 25LC010AT-I/ST = 1k-bit, 16-byte page, 2.5V Serial EEPROM, Industrial temp., Tape & Reel, TSSOP package 25LC010AT-E/SN = 1k-bit, 16-byte page, 2.5V serial EEPROM, Extended temp., Tape & Reel, X Temperature Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

© 2006 Microchip Technology Inc. NOTES:

© 2006 Microchip Technology Inc. Preliminary DS21832C-page 25 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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