FDW2502P_03 FAIRCHILD | Alldatasheet

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Technical content

Features

  • –4.4 A, –20 V. R DS(ON) = 35 mΩ @ VGS = –4.5 V R DS(ON) = 57 mΩ @ VGS = –2.5 V.
  • Extended V GSS range (±12V) for battery applications.
  • High performance trench technology for extremely low RDS(ON) .
  • Low profile TSSOP-8 package. TSSOP-8 Pin 1 Absolute Maximum Ratings TA=25oC unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage –20 V VGSS Gate-Source Voltage ±12 V ID Drain Current – Continuous (Note 1a) –4.4 A – Pulsed –30 PD Power Dissipation for Single Operation (Note 1a) 1.0 W (Note 1b) 0.6 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 125 °C/W (Note 1b) 208 Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 2502P FDW2502P 13’’ 12mm 3000 units FDW2502P

FDW2502P Rev. F (W) Electrical Characteristics TA = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆TJ Breakdown Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C –14 mV/°C IDSS Zero Gate Voltage Drain Current V DS = –16 V, V GS = 0 V –1 µA IGSS Gate–Body Leakage VGS = ±12 V, V DS = 0 V ±100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.9 –1.5 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C 3.2 mV/°C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, I D = –4.4 A VGS = –4.5 V, ID = –4.4 ,TJ=125°C VGS = –2.5 V, I D = –3.3 A mΩ ID(on) On–State Drain Current V GS = –4.5 V, V DS = –5 V –30 A gFS Forward Transconductance V DS = –5 V, I D = –4.4 A 18 S Dynamic Characteristics Ciss Input Capacitance 1465 pF Coss Output Capacitance 310 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 155 pF RG Gate Resistance V GS = 15 mV, f = 1.0 MHz 7.7 Ω Switching Characteristics (Note 2) td(on) Turn–On Delay Time 14 25 ns tr Turn–On Rise Time 8 16 ns td(off) Turn–Off Delay Time 51 82 ns tf Turn–Off Fall Time VDD = –10 V, I D = –1 A, VGS = –4.5 V, R GEN = 6 Ω 29 47 ns Qg Total Gate Charge VDS = –5 V, I D = –4.4 A, VGS = –5 V 15 21 nC Qgs Gate–Source Charge 2.9 nC Qgd Gate–Drain Charge 3.5 nC Drain–Source Diode Characteristics and Maximum Ratings trr Diode Reverse Recovery Time 21 ns Qrr Diode Reverse Recovery Charge IF = –4.4 A, diF/dt = 100 A/µs 8.1 nC IS Maximum Continuous Drain–Source Diode Forward Current –0.83 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, I S = –0.83 A (Note 2) –0.7 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) R θJA is 125°C/W (steady state) when mounted on a 1 inch² copper pad on FR-4. b) R θJA is 208°C/W (steady state) when mounted on a minimum copper pad on FR-4. 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% FDW2502P

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ FACT Quiet Series™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ ImpliedDisconnect™ Rev. I7 ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT ™ DOME™ EcoSPARK™ E 2CMOS TM EnSignaTM FACT™ POP™ Power247™ PowerTrench QFET  QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™Across the board. Around the world.™ The Power Franchise™ Programmable Active Droop™