STL24NM60N STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 14

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 3 Test circuits
  • 4 Package mechanical data
  • 5 Revision history

Features

■ 100% avalanche tested ■ Low input capacitance and gate charge ■ Low gate input resistance

Applications

■ Switching applications

Description

This device is an N-channel Power MOSFET developed using the second generation of MDmesh™ technology. This revolutionary Power MOSFET associates a vertical structure to the company’s strip layout to yield one of the world’s lowest on-resistance and gate charge. It is therefore suitable for the most demanding high efficiency converters. Figure 1. Internal schematic diagram

  1. The value is rated according to R thj-case

Table 1. Device summary

1 Electrical ratings

Table 2. Absolute maximum ratings

  1. The value is rated according to R thj-case
  2. When mounted on FR-4 board of inch², 2oz Cu
  3. Pulse width limited by safe operating area
  4. I SD ≤ 16 A, di/dt ≤ 400 A/µs, VDSpeak ≤ V(BR)DSS, VDD = 80% V(BR)DSS

Table 3. Thermal data

  1. When mounted on 1inch² FR-4 board, 2 oz Cu

2 Electrical characteristics

Table 4. On /off states Table 5. Dynamic

  1. C oss eq. is defined as a constant equivalent capac itance giving the same charging time as C oss when VDS

increases from 0 to 80% VDS. Table 6. Switching times

Table 7. Source drain diode

  1. Pulse width limited by safe operating area.
  2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%

3 Test circuits

Figure 2. Switching times test circuit for Figure 3. Gate charge test circuit Figure 4. Test circuit for inductive load Figure 5. Unclamped inductive load test Figure 6. Unclamped inductive waveform Figure 7. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

Table 8. PowerFLAT™ 8x8 HV mechanical data

Figure 8. PowerFLAT™ 8x8 HV drawing mechanical data

Figure 9. PowerFLAT™ 8x8 HV recommended footprint (1)

5 Packaging mechanical data

Figure 10. PowerFLAT™ 8x8 HV tape Figure 11. PowerFLAT™ 8x8 HV package orientation in carrier tape

Figure 12. PowerFLAT™ 8x8 HV reel

6 Revision history

Table 9. Document revision history 05-Jan-2011 1 First release. 10-Nov-2011 2 Section 4: Package mechanical data has been updated.