24LC014-I/ST

24AA014 MICROCHIP | Alldatasheet

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© 2005 Microchip Technology Inc. DS21809C-page 1 24AA014/24LC014 Device Selection Table Features:

• Single-supply with operation down to 1.8V
• Low-power CMOS technology: - 1 mA active current, typical - 1 μA standby current, typical at 5.5V
• Organized as a single block of 128 bytes (128 x 8)
• Hardware write protection for entire array
• 2-wire serial interface bus, I2C™ compatible
• 100 kHz and 400 kHz clock compatibility
• Page write buffer for up to 16 bytes
• Self-timed write cycle (including auto-erase)
• 5 ms max. write cycle time
• Address lines allow up to eight devices on bus
• 1,000,000 erase/write cycles
• ESD protection > 4,000V
• Data retention > 200 years
• 8-pin PDIP, SOIC, TSSOP, DFN and MSOP packages
• Available for extended temperature ranges: Description: The Microchip Technology Inc. 24AA014/24LC014 is a

1 Kbit Serial Electrically Erasable PROM with opera-

tion down to 1.8V. The device is organized as a single block of 128 x 8-bit memory with a 2-wire serial inter- face. Low-current design permits operation with typical standby and active currents of only 1 μA and 1 mA, respectively. The device has a page write capability for up to 16 bytes of data. Functional address lines allow the connection of up to eight 24AA014/24LC014 devices on the same bus for up to 8 Kbits of contiguous EEPROM memory. The device is available in the standard 8-pin PDIP, 8-pin SOIC (150 mil), TSSOP, 2x3 DFN and MSOP packages. Package Types Block Diagram Pin Function Table Part Number VCC Range Max Clock Temp. Range 24AA014 1.8V - 5.5V 400 kHz(1) I 24LC014 2.5V - 5.5V 400 kHz I Note 1: 100 kHz for VCC < 2.5V - Industrial (I): -40°C to +85°C Name Function VSS Ground SDA Serial Data SCL Serial Clock VCC Power Supply A0, A1, A2 Chip Selects WP Hardware Write-Protect VSS VCC WP SCL SDA PDIP, MSOP SOIC, TSSOP VSS VCC WP SCL SDA DFN VSS WP SCL SDA VCC I/O Control Logic Memory Control Logic XDEC HV Generator EEPROM Array Write-Protect Circuitry YDEC VCC VSS Sense Amp. R/W Control SDA SCL A0 A1 A2 WP 1K I2C™ Serial EEPROM

© 2005 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings (†) † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS All parameters apply across the specified operating ranges unless otherwise noted. VCC = +1.8V to +5.5V Industrial (I): TA = -40°C to +85°C Parameter Symbol Min. Max. Units Conditions SCL and SDA pins: High-level input voltage VIH

0.7 VCC

V Low-level input voltage VIL

0.3 VCC

V Hysteresis of Schmitt Trigger inputs VHYS

0.05 VCC

V (Note 1) Low-level output voltage VOL 0.40 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, VCC = 2.5V Input leakage current ILI μΑ VIN = VSS or VCC, WP = Vss Output leakage current ILO μA VOUT = VSS or VCC Pin capacitance (all inputs/outputs) CIN, COUT pF VCC = 5.0V (Note 1) TA = 25°C, f = 1 MHz Operating current ICC Read mA VCC = 5.5V, SCL = 400 kHz ICC Write mA VCC = 5.5V Standby current ICCS μA VCC = 5.5V, SDA = SCL = VCC WP = VSS, A0, A1, A2 = VSS Note 1: This parameter is periodically sampled and not 100% tested.

© 2005 Microchip Technology Inc. DS21809C-page 3 24AA014/24LC014 TABLE 1-2: AC CHARACTERISTICS FIGURE 1-1: BUS TIMING DATA All parameters apply across the specified operating ranges unless otherwise noted. Vcc = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Parameter Symbol Vcc = 1.8V - 5.5V STD MODE Vcc = 2.5V - 5.5V FAST MODE Units Remarks Min. Max. Min. Max. Clock frequency FCLK 100 400 kHz Clock high time THIGH 4000 600 ns Clock low time TLOW 4700 1300 ns SDA and SCL rise time TR 1000 300 ns (Note 1) SDA and SCL fall time TF 300 300 ns (Note 1) Start condition hold time THD:STA 4000 600 ns After this period, the first clock pulse is generated Start condition setup time TSU:STA 4700 600 ns Only relevant for repeated Start condition Data input hold time THD:DAT ns (Note 2) Data input setup time TSU:DAT 250 100 ns Stop condition setup time TSU:STO 4000 600 ns Output valid from clock TAA 3500 900 ns (Note 2) Bus free time TBUF 4700 1300 ns Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum TOF 250 20 +0.1 CB 250 ns (Note 1), CB ≤ 100 pF Input filter spike suppression (SDA and SCL pins) TSP ns (Note 3) Write cycle time TWC ms Byte or Page mode Endurance cycles 25°C, (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be downloaded from Microchip’s web site at www.microchip.com. SCL SDA IN TSU:STA SDA OUT THD:STA TLOW THIGH TR TBUF TAA THD:DAT TSU:DAT TSU:STO TSP TF

© 2005 Microchip Technology Inc. 2.0 PIN DESCRIPTIONS 2.1 SDA Serial Data This is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open drain terminal. Therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 2.2 SCL Serial Clock The SCL input is used to synchronize the data transfer to and from the device. 2.3 A0, A1, A2 The levels on the inputs A0, A1 and A2 are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. Up to eight 24AA014/24LC014 devices may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. 2.4 WP WP is the hardware write-protect pin. It must be tied to VCC or VSS. If tied to VCC, the hardware write protection is enabled. If the WP pin is tied to VSS the hardware write protection is disabled. 2.5 Noise Protection The 24AA014/24LC014 employs a VCC threshold detector circuit that disables the internal erase/write logic if the VCC is below 1.5 volts at nominal conditions. The SCL and SDA inputs have Schmitt Trigger and filter circuits that suppress noise spikes to assure proper device operation even on a noisy bus. 3.0 FUNCTIONAL DESCRIPTION The 24AA014/24LC014 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus has to be controlled by a master device that generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions while the 24AA014/ 24LC014 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.

© 2005 Microchip Technology Inc. 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code; for the 24AA014/24LC014 this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24AA014/ 24LC014 devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are in effect the three Most Significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to a ‘1’, a read operation is selected. When set to a ‘0’, a write operation is selected. Following the Start condition, the 24AA014/ 24LC014 monitors the SDA bus, checking the control byte being transmitted. Upon receiving a ‘1010’ code and appropriate Chip Select bits, the slave device out- puts an Acknowledge signal on the SDA line. Depend- ing on the state of the R/W bit, the 24AA014/24LC014 will select a read or write operation. FIGURE 5-1: CONTROL BYTE FORMAT 5.1 Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 8K bits by adding up to eight 24AA014/24LC014 devices on the same bus. In this case, software can use A0 of the control byte as address bit A8, A1 as address bit A9, and A2 as address bit A10. It is not possible to sequentially read across device boundaries. S ACK R/W Control Code Chip Select Bits Slave Address Acknowledge Bit Start Bit Read/Write Bit

© 2005 Microchip Technology Inc. 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for a flow diagram of this operation. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? Next Operation No Yes

© 2005 Microchip Technology Inc. DS21809C-page 9 24AA014/24LC014 8.0 READ OPERATIONS Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24AA014/24LC014 contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with the R/W bit set to ‘1’, the 24AA014/24LC014 issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24AA014/24LC014 discontinues transmission (Figure 8-1). 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24AA014/24LC014 as part of a write operation. Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the control byte again but with the R/W bit set to a ‘1’. The 24AA014/24LC014 will then issue an acknowl- edge and transmits the eight-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24AA014/24LC014 discontin- ues transmission (Figure 8-2). After this command, the internal address counter will point to the address location following the one that was just read. 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the 24AA014/24LC014 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the 24AA014/24LC014 to transmit the next sequentially addressed 8-bit word (Figure 8-3). To provide sequential reads the 24AA014/24LC014 contains an internal Address Pointer which is incremented by one at the completion of each opera- tion. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address 0FFh to address 000h. FIGURE 8-1: CURRENT ADDRESS READ Bus Activity Master SDA Line Bus Activity P S S T O P Control Byte S T A R T Data A C K N O A C K

© 2005 Microchip Technology Inc. DS21809C-page 11 24AA014/24LC014 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24LC014 I/P 12F 0521 24LC014I SN 052I 12F 8-Lead MSOP Example: XXXX TYWW NNN 4L14 I521 12F 4L14I 52112F XXXXT YWWNNN e e 8-Lead 2x3 DFN Example: 2N4 521 XXX YWW NN

© 2005 Microchip Technology Inc. Part Number 1st Line Marking Codes TSSOP MSOP DFN 24AA014 4A14 4A14T 2N1 24LC014 4L14 4L14T 2N4 Note: T = Temperature grade (I, E) Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

© 2005 Microchip Technology Inc. DS21809C-page 13 24AA014/24LC014 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001 Drawing No. C04-018 .010” (0.254mm) per side. § Significant Characteristic

© 2005 Microchip Technology Inc. 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

© 2005 Microchip Technology Inc. DS21809C-page 15 24AA014/24LC014 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) β Mold Draft Angle Bottom α Mold Draft Angle Top 0.30 0.25 0.19 .012 .010 .007 B Lead Width 0.20 0.15 0.09 .008 .006 .004 c Lead Thickness 0.70 0.60 0.50 .028 .024 .020 L Foot Length 3.10 3.00 2.90 .122 .118 .114 D Molded Package Length 4.50 4.40 4.30 .177 .173 .169 Molded Package Width 6.50 6.38 6.25 .256 .251 .246 E Overall Width 0.15 0.10 0.05 .006 .004 .002 Standoff 0.95 0.90 0.85 .037 .035 .033 Molded Package Thickness 1.10 .043 A Overall Height 0.65 .026 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units α A L c β φ D n p B E Foot Angle φ * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 § Significant Characteristic

© 2005 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) D A L c (F) α E p B n φ β Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not .037 REF F Footprint (Reference) exceed .010" (0.254mm) per side. Notes: Drawing No. C04-111 *Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness β α c B φ .003 .009 .006 .012 Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L D E .016 .024 .118 BSC .118 BSC .000 .030 .193 TYP. .033 MIN p n Units .026 BSC NOM INCHES

0.95 REF

.009 .016 0.08 0.22 0.23 0.40 MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043 .031 .037 .006 0.40 0.00 0.75 MIN MAX NOM 1.10 0.80 0.15 0.95 MAX 15° 15° JEDEC Equivalent: MO-187 15° 15°

© 2005 Microchip Technology Inc. DS21809C-page 17 24AA014/24LC014 8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated Exposed Pad Width Exposed Pad Length Contact Length *Controlling Parameter Contact Width Drawing No. C04-123 Notes: Exposed pad dimensions vary with paddle size. Overall Width L b E .016 .012 .008 .047 .055 .010 .118 BSC Number of Pins Standoff Contact Thickness Overall Length Overall Height Pitch p n Units A D Dimension Limits .000 .001 .008 REF. .079 BSC .031 .020 BSC MIN INCHES NOM 0.40 0.25 0.30 .020 .071 .012 .064 0.20 1.20 1.39 0.50 0.30 1.80 1.62 0.02 0.80

2.00 BSC

0.20 REF.

0.50 BSC

MILLIMETERS* .002 .039 0.00 MIN MAX NOM 0.05 1.00 MAX Package may have one or more exposed tie bars at ends. Pin 1 visual index feature may vary, but must be located within the hatched area. 0.90 .035 (Note 3) (Note 3) 4. JEDEC equivalent: MO-229 L A TOP VIEW D E EXPOSED PAD METAL BOTTOM VIEW b p n (NOTE 1) EXPOSED TIE BAR PIN 1 (NOTE 2) ID INDEX AREA Revised 05/24/04

© 2005 Microchip Technology Inc.

REVISION HISTORY

Corrections to Section 1.0, Electrical Characteristics. Revision C Added DFN package.

© 2005 Microchip Technology Inc. DS21809C-page 19 24AA014/24LC014 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

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© 2005 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21809C 24AA014/24LC014 What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2005 Microchip Technology Inc. DS21809C-page 21 24AA014/24LC014 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Sales and Support Device: 24AA014: 1.8V, 1 Kbit Addressable Serial EEPROM 24AA014T: 1.8V, 1 Kbit Addressable Serial EEPROM (Tape and Reel) 24LC014: 2.5V, 1 Kbit Addressable Serial EEPROM 24LC014T: 2.5V, 1 Kbit Addressable Serial EEPROM (Tape and Reel) Temperature Range: I -40°C to +85°C Package: P Plastic DIP, (300 mil Body), 8-lead SN Plastic SOIC, (150 mil Body) ST TSSOP, 8-lead MS MSOP, 8-lead MC 2x3 DFN, 8-lead PART NO. X /XX Package Temperature Range Device Examples: 24AA014-I/P: Industrial Temperature, 1.8V, PDIP package. 24AA014-I/SN: Industrial Temperature, 1.8V, SOIC Package. 24AA014T-I/ST: Industrial Temperature, 1.8V, TSSOP Package, Tape and Reel 24LC014-I/P: Industrial Temperature, 2.5V, PDIP Package. 24LC014T-I/SN: Industrial Temperature, 2.5V, SOIC Package, Tape and Reel 24LC014T-I/MS: Industrial Temperature, 2.5V, MSOP Package, Tape and Reel. Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21808C-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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