24LC00-E/ST

24AA00_07 MICROCHIP | Alldatasheet

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© 2007 Microchip Technology Inc. DS21178G-page 1 24AA00/24LC00/24C00 Device Selection Table Features:

• Single supply with operation down to 1.7V for 24AA00 devices, 2.5V for 24LC00 devices
• Low-power CMOS technology: - Read current 500 μA, typical - Standby current 100 nA, typical
• 2-wire serial interface, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 3 ms, typical
• Self-timed erase/write cycle
• ESD protection >4000V
• More than 1 million erase/write cycles
• Data retention >200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP, DFN and 5-lead SOT-23
• Pb-free and RoHS compliant
• Temperature ranges available: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Description: The Microchip Technology Inc. 24AA00/24LC00/ 24C00 (24XX00*) is a 128-bit Electrically Erasable PROM memory organized as 16 x 8 with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 volts for the 24AA00 version, and every version maintains a maximum standby current of only 1 μA and typical active current of only 500 μA. This device was designed for where a small amount of EEPROM is needed for the storage of calibration values, ID numbers or manufacturing information, etc. The 24XX00 is available in 8-pin PDIP, 8-pin SOIC (3.90 mm), 8-pin TSSOP, 8-pin 2x3 DFN and the 5-pin SOT-23 packages. Package Types Block Diagram Pin Function Table Device VCC Range Temp Range 24AA00 1.7-5.5 I 24LC00 2.5-5.5 I 24C00 4.5-5.5 I,E Name Function VSS Ground SDA Serial Data SCL Serial Clock VCC +1.7V to 5.5V (24AA00) +2.5V to 5.5V (24LC00) +4.5V to 5.5V (24C00) NC No Internal Connection 8-PIN PDIP/SOIC 8-PIN TSSOP 5-PIN SOT-23 NC NC NC Vss VCC NC SCL SDA NC NC NC VSS VCC NC SCL SDA SCL VSS SDA VCC NC DFN NC NC NC VSS NC SCL SDA VCC HV Generator EEPROM Array YDEC XDEC Sense AMP R/W Control Memory Control Logic I/O Control Logic SDA SCL VCC VSS 128-Bit I2C™ Bus Serial EEPROM *24XX00 is used in this document as a generic part number for the 24AA00/24LC00/24C00 devices. I2C is a trademark of Philips Corporation.

© 2007 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†) FIGURE 1-1: BUS TIMING DATA † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS All Parameters apply across the recommended operating ranges unless otherwise noted Industrial (I): TA = -40°C to +85°C, VCC = 1.8V to 5.5V Automotive (E) TA = -40°C to +125°C, VCC = 4.5V to 5.5V Parameter Symbol Min. Max. Units Conditions SCL and SDA pins: High-level input voltage VIH

0.7 VCC

V (Note) Low-level input voltage VIL

0.3 VCC

V (Note) Hysteresis of Schmitt Trigger inputs VHYS .05 VCC V VCC ≥ 2.5V (Note) Low-level output voltage VOL 0.4 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, VCC = 2.5V Input leakage current ILI μA VIN = VCC or VSS Output leakage current ILO μA VOUT = VCC or VSS Pin capacitance (all inputs/outputs) CIN, COUT pF VCC = 5.0V (Note) TA = 25°C, FCLK = 1 MHz Operating current ICC Write mA VCC = 5.5V, SCL = 400 kHz ICC Read mA VCC = 5.5V, SCL = 400 kHz Standby current ICCS μA VCC = 5.5V, SDA = SCL = VCC Note: This parameter is periodically sampled and not 100% tested. TF THIGH TR TSU:STA TLOW THD:DAT TSU:DAT TSU:STO TBUF TAA TSP SCL SDA IN SDA OUT THD:STA

© 2007 Microchip Technology Inc. DS21178G-page 3 24AA00/24LC00/24C00 TABLE 1-2: AC CHARACTERISTICS All Parameters apply across all recommended operating ranges unless otherwise noted Industrial (I): TA = -40°C to +85°C, VCC = 1.8V to 5.5V Automotive (E): TA = -40°C to +125°C, VCC = 4.5V to 5.5V Parameter Symbol Min Max Units Conditions Clock frequency FCLK 100 100 400 kHz 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Clock high time THIGH 4000 4000 600 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Clock low time TLOW 4700 4700 1300 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V SDA and SCL rise time (Note 1) TR 1000 1000 300 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V SDA and SCL fall time TF 300 ns (Note 1) Start condition hold time THD:STA 4000 4000 600 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Start condition setup time TSU:STA 4700 4700 600 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Data input hold time THD:DAT ns (Note 2) Data input setup time TSU:DAT 250 250 100 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Stop condition setup time TSU:STO 4000 4000 600 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Output valid from clock (Note 2) TAA 3500 3500 900 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Bus free time: Time the bus must be free before a new transmis- sion can start TBUF 4700 4700 1300 ns 4.5V ≤ Vcc ≤ 5.5V (E Temp range) 1.7V ≤ Vcc ≤ 4.5V 4.5V ≤ Vcc ≤ 5.5V Output fall time from VIH minimum to VIL maximum TOF 20+0.1 CB 250 ns (Note 1), CB ≤ 100 pF Input filter spike suppression (SDA and SCL pins) TSP ns (Notes 1, 3) Write cycle time TWC ms Endurance cycles (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.

© 2007 Microchip Technology Inc. 2.0 PIN DESCRIPTIONS 2.1 SDA Serial Data This is a bidirectional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 2.2 SCL Serial Clock This input is used to synchronize the data transfer from and to the device. 2.3 Noise Protection The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus. 3.0 FUNCTIONAL DESCRIPTION The 24XX00 supports a bidirectional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, and a device receiving data as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions, while the 24XX00 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. 4.0 BUS CHARACTERISTICS The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). 4.1 Bus Not Busy (A) Both data and clock lines remain high. 4.2 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 4.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. 4.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one bit of data per clock pulse. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the master device and is theoretically unlimited.

© 2007 Microchip Technology Inc. 5.0 DEVICE ADDRESSING After generating a Start condition, the bus master transmits a control byte consisting of a slave address and a Read/Write bit that indicates what type of operation is to be performed. The slave address for the 24XX00 consists of a 4-bit device code ‘1010’ followed by three “don’t care” bits. The last bit of the control byte determines the operation to be performed. When set to a one a read operation is selected, and when set to a zero a write operation is selected (Figure 5-1). The 24XX00 monitors the bus for its corresponding slave address all the time. It generates an Acknowledge bit if the slave address was true and it is not in a programming mode. FIGURE 5-1: CONTROL BYTE FORMAT 6.0 WRITE OPERATIONS 6.1 Byte Write Following the Start signal from the master, the device code (4 bits), the “don’t care” bits (3 bits), and the R/W bit (which is a logic low) are placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmit- ted by the master is the word address and will be written into the Address Pointer of the 24XX00. Only the lower four address bits are used by the device, and the upper four bits are “don’t cares.” The 24XX00 will acknowledge the address byte and the master device will then transmit the data word to be written into the addressed memory location. The 24XX00 acknowl- edges again and the master generates a Stop condition. This initiates the internal write cycle, and during this time the 24XX00 will not generate Acknowl- edge signals (Figure 7-2). After a byte Write command, the internal address counter will not be incremented and will point to the same address location that was just written. If a Stop bit is transmitted to the device at any point in the Write command sequence before the entire sequence is complete, then the command will abort and no data will be written. If more than 8 data bits are transmitted before the Stop bit is sent, then the device will clear the previously loaded byte and begin loading the data buffer again. If more than one data byte is transmitted to the device and a Stop bit is sent before a full eight data bits have been transmitted, then the Write command will abort and no data will be written. The 24XX00 employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00) at nominal conditions. x x x S ACK R/W Device Select Bits Don’t Care Bits Slave Address Acknowledge Bit Start Bit Read/Write Bit

© 2007 Microchip Technology Inc. 8.0 READ OPERATIONS Read operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to one. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24XX00 contains an address counter that main- tains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with the R/W bit set to one, the device issues an acknowledge and transmits the eight-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the device discontinues transmission (Figure 8-1). 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is done by sending the word address to the device as part of a write operation. After the word address is sent, the master generates a Start condition following the acknowledge. This termi- nates the write operation, but not before the internal Address Pointer is set. Then the master issues the control byte again, but with the R/W bit set to a one. The 24XX00 will then issue an acknowledge and trans- mits the eight bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the device discontinues transmission (Figure 8-2). After this command, the internal address counter will point to the address location following the one that was just read. 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the device transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the device to transmit the next sequentially addressed 8-bit word (Figure 8-3). To provide sequential reads the 24XX00 contains an internal Address Pointer which is incremented by one at the completion of each read operation. This Address Pointer allows the entire memory contents to be serially read during one operation. FIGURE 8-1: CURRENT ADDRESS READ BUS ACTIVITY MASTER SDA LINE BUS ACTIVITY P S S T O P Control Byte S T A R T Data A C K N O A C K 0 x x x 1 x = “don’t care” bit

© 2007 Microchip Technology Inc. 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (3.90 mm) Example: XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24LC00 I/P 13F 0527 24LC00I SN 0527 13F XXXX TYWW NNN 4L00 I527 13F 5-Lead SOT-23 Example: XXNN M03F 8-Lead 2x3 DFN Example: 204 527 XXX YWW NN e e

© 2007 Microchip Technology Inc. DS21178G-page 11 24AA00/24LC00/24C00 Part Number 1st Line Marking Codes TSSOP SOT-23 DFN I Temp. E Temp. I Temp. E Temp. 24AA00 4A00 B0NN 201 24LC00 4L00 M0NN 204 24C00 4C00 D0NN E0NN 207 208 Note: NN = Alphanumeric traceability code Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

© 2007 Microchip Technology Inc. 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness .115 .130 .195 Base to Seating Plane .015 Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430 N NOTE 1 D A L b e E eB c Microchip Technology Drawing C04-018B

© 2007 Microchip Technology Inc. DS21178G-page 13 24AA00/24LC00/24C00 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

1.27 BSC

A 1.75 Molded Package Thickness 1.25 Standoff § 0.10 0.25 Overall Width E

6.00 BSC

3.90 BSC

D

4.90 BSC

Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint

1.04 REF

φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15° D N e E NOTE 1 b A L c h h φ β α Microchip Technology Drawing C04-057B

© 2007 Microchip Technology Inc. 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.65 BSC

A 1.20 Molded Package Thickness 0.80 1.00 1.05 Standoff 0.05 0.15 Overall Width E

6.40 BSC

4.30 4.40 4.50 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint

1.00 REF

φ Lead Thickness c 0.09 0.20 Lead Width b 0.19 0.30 D N E NOTE 1 b e c A L φ Microchip Technology Drawing C04-086B

© 2007 Microchip Technology Inc. DS21178G-page 15 24AA00/24LC00/24C00 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.50 BSC

A 0.80 0.90 1.00 Standoff 0.00 0.02 0.05 Contact Thickness

0.20 REF

D

2.00 BSC

E

3.00 BSC

1.30 1.75 Exposed Pad Width 1.50 1.90 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 D N E NOTE 1 EXPOSED PAD NOTE 1 K L N e b A NOTE 2 BOTTOM VIEW TOP VIEW Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc. 5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Lead Pitch e

0.95 BSC

1.90 BSC

A 0.90 1.45 Molded Package Thickness 0.89 1.30 Standoff 0.00 0.15 Overall Width E 2.20 3.20 Molded Package Width 1.30 1.80 Overall Length D 2.70 3.10 Foot Length L 0.10 0.60 Footprint 0.35 0.80 Foot Angle φ 30° Lead Thickness c 0.08 0.26 Lead Width b 0.20 0.51 φ N b E D e A c L Microchip Technology Drawing C04-091B

© 2007 Microchip Technology Inc. DS21178G-page 17 24AA00/24LC00/24C00 APPENDIX A:

REVISION HISTORY

Added DFN package. Revision F (02/2007) Revised Device Selection Table; Features Section; Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2; Revised Product ID System; Replaced Package Drawings; Replaced On-line Support page. Revision G (03/2007) Replaced Package Drawings (Rev. AM).

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21178G-page 19 24AA00/24LC00/24C00 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
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• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
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• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com

© 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21178G 24AA00/24LC00/24C00 What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2007 Microchip Technology Inc. DS21178G-page21 24AA00/24LC00/24C00 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Package Temperature Range Device Device: 24AA00: 1.7V, 128 bit I2C™ Serial EEPROM 24AA00T: 1.7V, 128 bit I2C Serial EEPROM (Tape and Reel) 24LC00: 2.5V, 128 bit I2C Serial EEPROM 24LC00T: 2.5V, 128 bit I2C Serial EEPROM (Tape and Reel) 24C00: 5V, 128 bit I2C™ Serial EEPROM 24C00T: 5V, 128 bit I2C™ Serial EEPROM (Tape and Reel) Temperature Range: I -40°C to +85°C E -40°C to +125°C Package: P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead OT = SOT-23, 5-lead (Tape and Reel only) MC = 2x3 DFN, 8-lead Examples: 24AA00-I/P: Industrial Temperature,1.8V PDIP package 24AA00-I/SN: Industrial Temperature, 1.8V, SOIC package 24AA00T-I/OT: Industrial Temperature, 1.8V, SOT-23 package, tape and reel 24LC00-I/P: Industrial Temperature, 2.5V, PDIP package 24C00-E/SN: Extended Temperature, 5V, SOIC package 24LC00T-I/OT: Industrial Temperature, 2.5V, SOT-23 package, tape and reel

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21178G-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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