24FC256-E/MF

24AA256_05 MICROCHIP | Alldatasheet

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Technical content

© 2005 Microchip Technology Inc. DS21203N-page 1 24AA256/24LC256/24FC256 Device Selection Table Features:

• Low-power CMOS technology: - Maximum write current 3 mA at 5.5V - Maximum read current 400 μA at 5.5V - Standby current 100 nA, typical at 5.5V
• 2-wire serial interface bus, I2C™ compatible
• Cascadable for up to eight devices
• Self-timed erase/write cycle
• 64-byte Page Write mode available
• 5 ms max. write cycle time
• Hardware write-protect for entire array
• Output slope control to eliminate ground bounce
• Schmitt Trigger inputs for noise suppression
• 1,000,000 erase/write cycles
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP, SOIC, TSSOP, MSOP and DFN packages, 14-lead TSSOP package
• Pb-free finishes available
• Temperature ranges: Description: The Microchip Technology Inc. 24AA256/24LC256/ 24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.8V to 5.5V). It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device also has a page write capability of up to 64 bytes of data. This device is capable of both random and sequential reads up to the 256K boundary. Functional address lines allow up to eight devices on the same bus, for up to 2 Mbit address space. This device is available in the standard 8-pin plastic DIP, SOIC, TSSOP, MSOP and DFN packages. Block Diagram Package Types *24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices. Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA256 1.8-5.5V 400 kHz(1) I 24LC256 2.5-5.5V 400 kHz I, E 24FC256 1.8-5.5V

1 MHz(2)

I Note 1: 100 kHz for VCC < 2.5V. 400 kHz for VCC < 2.5V. - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C HV Generator EEPROM Array Page Latches YDEC XDEC Sense Amp. R/W Control Memory Control Logic I/O Control Logic I/O A0 A1A2 SDA SCL VCC VSS WP VSS VCC WP SCL SDA 24XX256 PDIP/SOIC TSSOP/MSOP* VSS VCC WP SCL SDA 24XX256 DFN VSS WP SCL SDA 24XX256 VCC Note: * Pins A0 and A1 are no connects for the MSOP package only. 256K I2C™ CMOS Serial EEPROM

© 2005 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†) TABLE 1-1: DC CHARACTERISTICS † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to +125°C Param. No. Sym. Characteristic Min. Max. Units Conditions A0, A1, A2, SCL, SDA and WP pins: VIH High-level input voltage

0.7 VCC

V VIL Low-level input voltage

0.3 VCC

0.2 VCC

V V VCC ≥ 2.5V VCC < 2.5V VHYS Hysteresis of Schmitt Trigger inputs (SDA, SCL pins)

0.05 VCC

V VCC ≥ 2.5V (Note) VOL Low-level output voltage 0.40 V IOL = 3.0 ma @ VCC = 4.5V IOL = 2.1 ma @ VCC = 2.5V ILI Input leakage current μA VIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC ILO Output leakage current μA VOUT = VSS or VCC CIN, COUT Pin capacitance (all inputs/outputs) pF VCC = 5.0V (Note) TA = 25°C, FCLK = 1 MHz ICC Read Operating current 400 μA VCC = 5.5V, SCL = 400 kHz ICC Write mA VCC = 5.5V D10 ICCS Standby current μA TA = -40°C to +85°C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS μA TA = -40°C to +125°C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS Note: This parameter is periodically sampled and not 100% tested.

© 2005 Microchip Technology Inc. DS21203N-page 3 24AA256/24LC256/24FC256 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to +125°C Param. No. Sym. Characteristic Min. Max. Units Conditions FCLK Clock frequency 100 400 400 1000 kHz 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 THIGH Clock high time 4000 600 600 500 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 TLOW Clock low time 4700 1300 1300 500 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 TR SDA and SCL rise time (Note 1) 1000 300 300 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 24FC256 TF SDA and SCL fall time (Note 1) 300 100 ns All except, 24FC256 1.8V ≤ VCC ≤ 5.5V 24FC256 THD:STA Start condition hold time 4000 600 600 250 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 TSU:STA Start condition setup time 4700 600 600 250 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 THD:DAT Data input hold time ns (Note 2) TSU:DAT Data input setup time 250 100 100 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 24FC256 TSU:STO Stop condition setup time 4000 600 600 250 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 TSU:WP WP setup time 4000 600 600 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 24FC256 THD:WP WP hold time 4700 1300 1300 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 24FC256 Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com.

© 2005 Microchip Technology Inc. FIGURE 1-1: BUS TIMING DATA TAA Output valid from clock (Note 2) 3500 900 900 400 ns 1.8 V ≤ VCC < 2.5V 2.5 V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5 V ≤ VCC ≤ 5.5V 24FC256 TBUF Bus free time: Time the bus must be free before a new transmission can start 4700 1300 1300 500 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC256 2.5V ≤ VCC ≤ 5.5V 24FC256 TOF Output fall time from VIH minimum to VIL maximum CB ≤ 100 pF 10 + 0.1CB 250 250 ns All except, 24FC256 (Note 1) TSP Input filter spike suppression (SDA and SCL pins) ns All except, 24FC256 (Notes 1 and 3) TWC Write cycle time (byte or page) ms Endurance 1,000,000 cycles 25°C (Note 4) AC CHARACTERISTICS (Continued) Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to +125°C Param. No. Sym. Characteristic Min. Max. Units Conditions Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. (unprotected) (protected) SCL SDA IN SDA OUT WP

© 2005 Microchip Technology Inc. DS21203N-page 5 24AA256/24LC256/24FC256 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE 2.1 A0, A1, A2 Chip Address Inputs The A0, A1 and A2 inputs are used by the 24XX256 for multiple device operations. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. For the MSOP package only, pins A0 and A1 are not connected. Up to eight devices (two for the MSOP package) may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. In most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic ‘0’ or logic ‘1’. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ‘0’ or logic ‘1’ before normal device operation can proceed. 2.2 Serial Data (SDA) This is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open drain terminal. Therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz and 1 MHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 2.3 Serial Clock (SCL) This input is used to synchronize the data transfer to and from the device. 2.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, write operations are enabled. If tied to VCC, write operations are inhibited but read operations are not affected. 3.0 FUNCTIONAL DESCRIPTION The 24XX256 supports a bidirectional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data as a receiver. The bus must be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions while the 24XX256 works as a slave. Both master and slave can operate as a transmitter or receiver, but the master device determines which mode is activated. Name 8-pin PDIP 8-pin SOIC 8-pin TSSOP 8-pin MSOP 8-pin DFN Function User Configurable Chip Select User Configurable Chip Select (NC) 1, 2 Not Connected User Configurable Chip Select VSS Ground SDA Serial Data SCL Serial Clock (NC) Not Connected WP Write-Protect Input VCC +1.8V to 5.5V (24AA256) +2.5V to 5.5V (24LC256) +1.8V to 5.5V (24FC256)

© 2005 Microchip Technology Inc. 4.0 BUS CHARACTERISTICS The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line, while the clock line is high, will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). 4.1 Bus Not Busy (A) Both data and clock lines remain high. 4.2 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high, determines a Start condition. All commands must be preceded by a Start condition. 4.3 Stop Data Transfer (C) A low-to-high transition of the SDA line, while the clock (SCL) is high, determines a Stop condition. All operations must end with a Stop condition. 4.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one bit of data per clock pulse. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the master device. 4.5 Acknowledge Each receiving device, when addressed, is obliged to generate an Acknowledge signal after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by NOT generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX256) will leave the data line high to enable the master to generate the Stop condition. Note: The 24XX256 does not generate any Acknowledge bits if an internal programming cycle is in progress.

© 2005 Microchip Technology Inc. 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code. For the 24XX256, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX256 devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are, in effect, the three Most Significant bits of the word address. For the MSOP package, the A0 and A1 pins are not connected. During device addressing, the A0 and A1 Chip Select bits (Figures 5-1 and 5-2) should be set to ‘0’. Only two 24XX256 MSOP packages can be connected to the same bus. The last bit of the control byte defines the operation to be performed. When set to a one, a read operation is selected. When set to a zero, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 5-2). Because only A14…A0 are used, the upper address bits are a “don’t care.” The upper address bits are transferred first, followed by the Less Significant bits. Following the Start condition, the 24XX256 monitors the SDA bus checking the device type identifier being transmitted. Upon receiving a ‘1010’ code and appro- priate device select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX256 will select a read or write operation. FIGURE 5-1: CONTROL BYTE FORMAT 5.1 Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 2 Mbit by adding up to eight 24XX256 devices on the same bus. In this case, software can use A0 of the control byte as address bit A15; A1 as address bit A16; and A2 as address bit A17. It is not possible to sequentially read across device boundaries. For the MSOP package, up to two 24XX256 devices can be added for up to 512 Kbit of address space. In this case, software can use A2 of the control byte as address bit A17. Bits A0 (A15) and A1 (A16) of the control byte must always be set to a logic ‘0’ for the MSOP. FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS S ACK R/W Control Code Chip Select Bits Slave Address Acknowledge Bit Start Bit Read/Write Bit A A A

0 R/W

x A A A A A A A Control Byte Address High Byte Address Low Byte Control Code Chip Select Bits x = “don’t care” bit A A

© 2005 Microchip Technology Inc. 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition, followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be resent. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for flow diagram. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? Next Operation NO YES

© 2005 Microchip Technology Inc. DS21203N-page 11 24AA256/24LC256/24FC256 8.0 READ OPERATION Read operations are initiated in much the same way as write operations, with the exception that the R/W bit of the control byte is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24XX256 contains an address counter that main- tains the address of the last word accessed, internally incremented by ‘1’. Therefore, if the previous read access was to address ‘n’ (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to ‘1’, the 24XX256 issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX256 discontinues transmission (Figure 8-1). FIGURE 8-1: CURRENT ADDRESS READ 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX256 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master gener- ates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a one. The 24XX256 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer, though it does generate a Stop condition, which causes the 24XX256 to discon- tinue transmission (Figure 8-2). After a random Read command, the internal address counter will point to the address location following the one that was just read. 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the 24XX256 transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX256 to transmit the next sequentially addressed 8-bit word (Figure 8-3). Following the final byte transmitted to the master, the master will NOT generate an acknowledge, but will generate a Stop condition. To provide sequen- tial reads, the 24XX256 contains an internal Address Pointer which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address 7FFF to address 0000 if the master acknowledges the byte received from the array address 7FFF. FIGURE 8-2: RANDOM READ FIGURE 8-3: SEQUENTIAL READ Bus Activity Master SDA Line Bus Activity P S S T O P Control Byte S T A R T Data A C K N O A C K

0 A A A 1

x Bus Activity Master SDA Line Bus Activity A C K N O A C K A C K A C K A C K S T O P S T A R T Control Byte Address High Byte Address Low Byte Control Byte Data Byte S T A R T x = “don’t care” bit S 1 0 1 0 A A A 0 2 1 0 S 1 0 1 0 A A A 1 2 1 0 P Bus Activity Master SDA Line Bus Activity Control Byte Data (n) Data (n + 1) Data (n + 2) Data (n + x) N O A C K A C K A C K A C K A C K S T O P P

© 2005 Microchip Technology Inc. 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX T/XXYYWW NNN 8-Lead SOIC (208 mil) Example: 24LC256 0510017 I/SM 24AA256 I/P 017 0510 XXXXXXXX YYWWNNN T/XXXXXX 24LC256I SN 0510 017 e e e *Standard device marking consists of Microchip part number, year code, week code, and traceability code. For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2005 Microchip Technology Inc. DS21203N-page 13 24AA256/24LC256/24FC256 Package Marking Information (Continued) 8-Lead MSOP Example: XXXXXT YWWNNN 4L256I 510017 8-Lead DFN-S Example: XXXXXXX T/XXXXX YYWW 24LC256 I/MF 0510 017 NNN First Line Marking Codes Part No. 24AA256 4AD 4A256T 24LC256 4LD 4L256T 24FC256 4FD 4F256T 8-Lead TSSOP Example: XXXX TYWW NNN 4LD I510 017 e

© 2005 Microchip Technology Inc. 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) B A L p α E eB β c n D Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α Mold Draft Angle Bottom β * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001 Drawing No. C04-018 .010” (0.254mm) per side. § Significant Characteristic

© 2005 Microchip Technology Inc. DS21203N-page 15 24AA256/24LC256/24FC256 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.62 0.48 .030 .025 .019 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 5.00 4.90 4.80 .197 .193 .189 D Overall Length 3.99 3.91 3.71 .157 .154 .146 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 Standoff 1.55 1.42 1.32 .061 .056 .052 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units D n p B E h L β c 45° φ α A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 § Significant Characteristic

© 2005 Microchip Technology Inc. 8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) Foot Angle φ β Mold Draft Angle Bottom α Mold Draft Angle Top 0.51 0.43 0.36 .020 .017 .014 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 0.76 0.64 0.51 .030 .025 .020 L Foot Length 5.33 5.21 5.13 .210 .205 .202 D Overall Length 5.38 5.28 5.11 .212 .208 .201 Molded Package Width 8.26 7.95 7.62 .325 .313 .300 E Overall Width 0.25 0.13 0.05 .010 .005 .002 Standoff 1.98 .078 Molded Package Thickness 2.03 .080 A Overall Height 1.27 .050 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units α A L c β φ D n p B E .070 .075 .069 .074 1.78 1.75 1.97 1.88 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. Drawing No. C04-056 § Significant Characteristic

© 2005 Microchip Technology Inc. DS21203N-page 17 24AA256/24LC256/24FC256 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) β Mold Draft Angle Bottom α Mold Draft Angle Top 0.30 0.25 0.19 .012 .010 .007 B Lead Width 0.20 0.15 0.09 .008 .006 .004 c Lead Thickness 0.70 0.60 0.50 .028 .024 .020 L Foot Length 3.10 3.00 2.90 .122 .118 .114 D Molded Package Length 4.50 4.40 4.30 .177 .173 .169 Molded Package Width 6.50 6.38 6.25 .256 .251 .246 E Overall Width 0.15 0.10 0.05 .006 .004 .002 Standoff 0.95 0.90 0.85 .037 .035 .033 Molded Package Thickness 1.10 .043 A Overall Height 0.65 .026 p Pitch n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units α A L c β φ D n p B E Foot Angle φ * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 § Significant Characteristic

© 2005 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) D A L c (F) α E p B n φ β Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not .037 REF F Footprint (Reference) exceed .010" (0.254mm) per side. Notes: Drawing No. C04-111 *Controlling Parameter Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness β α c B φ .003 .009 .006 .012 Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L D E .016 .024 .118 BSC .118 BSC .000 .030 .193 TYP. .033 MIN p n Units .026 BSC NOM INCHES

0.95 REF

.009 .016 0.08 0.22 0.23 0.40 MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043 .031 .037 .006 0.40 0.00 0.75 MIN MAX NOM 1.10 0.80 0.15 0.95 MAX 15° 15° JEDEC Equivalent: MO-187 15° 15°

© 2005 Microchip Technology Inc. DS21203N-page 19 24AA256/24LC256/24FC256 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) NOM .050 BSC INCHES .194 BSC .184 BSC .226 BSC .236 BSC .008 REF. D Overall Width JEDEC equivalent: pending Notes: Drawing No. C04-113 Molded Package Width Lead Width *Controlling Parameter Mold Draft Angle Top Tie Bar Width Lead Length R α B L .014 .020 Dimension Limits Molded Package Thickness Pitch Overall Height Overall Length Molded Package Length Base Thickness Standoff Number of Pins E A .000 Units n p MIN TOP VIEW A

5.99 BSC

.019 .030 .014 .016 .024 0.35 0.50 .356 0.40 0.60

5.74 BSC

0.47 0.75 MILLIMETERS* .039 .002 .031 .026 .0004 .033 0.00 MAX MIN

1.27 BSC

0.20 REF.

4.92 BSC

4.67 BSC

0.85 0.01 0.65 0.80 0.05 1.00 MAX NOM BOTTOM VIEW n E PIN 1 p B Exposed Pad Length Exposed Pad Width .085 .091 .097 2.16 2.31 2.46 .152 .158 .163 3.85 4.00 4.15 EXPOSED METAL PADS α L ID D R Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

© 2005 Microchip Technology Inc. APPENDIX A:

REVISION HISTORY

Corrections to Section 1.0, Electrical Characteristics. Revision M Added 1.8V 400 kHz option for 24FC256. Revision N Revised Sections 2.1 and 2.4. Removed 14-Lead

© 2005 Microchip Technology Inc. DS21203N-page 21 24AA256/24LC256/24FC256 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com

© 2005 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21203N 24AA256/24LC256/24FC256 What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2005 Microchip Technology Inc. DS21203N-page 23 24AA256/24LC256/24FC256 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products manufactured before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. PART NO. X /XX Package Temperature Range Device Device: 24AA256: 256 Kbit 1.8V I2C Serial EEPROM 24AA256T: 256 Kbit 1.8V I2C Serial EEPROM Tape and Reel) 24LC256: 256 Kbit 2.5V I2C Serial EEPROM 24LC256T: 256 Kbit 2.5V I2C Serial EEPROM Tape and Reel) 24FC256:

256 Kbit High Speed I2C Serial

24FC256T: EEPROM Tape and Reel) Temperature Range: I -40°C to +85°C E -40°C to +125°C Package: P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (150 mil body), 8-lead SM = Plastic SOIC (208 mil body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead MF = Dual, Flat, No Lead (DFN)(6x5 mm body), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead Lead Finish: Blank= Pb-free – Matte Tin (see Note 1) G = Pb-free – Matte Tin only Examples: 24AA256-I/P: Industrial Temp., 1.8V, PDIP package. 24AA256T-I/SN: Tape and Reel, Industrial Temp., 1.8V, SOIC package. 24AA256-I/ST: Industrial Temp., 1.8V, TSSOP package. 24AA256-I/MS: Industrial Temp., 1.8V, MSOP package. 24LC256-E/P: Extended Temp., 2.5V, PDIP package. 24LC256-I/SN: Industrial Temp., 2.5V, SOIC package. 24LC256T-I/SN: Tape and Reel, Industrial Temp., 2.5V, SOIC package. 24LC256-I/MS: Industrial Temp, 2.5V, MSOP package. 24FC256-I/P: Industrial Temp, 1.8V, High Speed, PDIP package. 24FC256-I/SN: Industrial Temp, 1.8V, High Speed, SOIC package. 24FC256T-I/SN: Tape and Reel, Industrial Temp, 1.8V, High Speed, SOIC package 24LC256T-I/STG: Industrial Temp, 2.5V, TSSOP package, Tape & Reel, Pb-free 24LC256-I/PG: Industrial Temp, 2.5V, PDIP package, Pb-free X Lead Finish

© 2005 Microchip Technology Inc. NOTES:

© 2005 Microchip Technology Inc. DS21203N-page 25 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR- RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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