24C01C-E/ST

24C01C_07 MICROCHIP | Alldatasheet

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© 2007 Microchip Technology Inc. DS21201G-page 1 24C01C Features:

• Single supply with operation from 4.5 to 5.5V
• Low-power CMOS technology: - Read current 1 mA, typical - Standby current 10 μA, typical
• 2-wire serial interface, I2C™ compatible
• Cascadable up to eight devices
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Fast page and byte write time 1 ms, typical
• Self-timed erase/write cycle
• 16-byte page write buffer
• ESD protection > 4,000V
• More than 1 million erase/write cycles
• Data retention > 200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP, DFN and MSOP
• Pb-free and RoHS compliant
• Temperature ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Description: The Microchip Technology Inc. 24C01C is a 1K bit Serial Electrically Erasable PROM with a voltage range of 4.5V to 5.5V. The device is organized as a single block of 128 x 8-bit memory with a 2-wire serial interface. Low-current design permits operation with typical standby and active currents of only 10 μA and 1 mA, respectively. The device has a page write capabil- ity for up to 16 bytes of data and has fast write cycle times of only 1 ms for both byte and page writes. Func- tional address lines allow the connection of up to eight 24C01C devices on the same bus for up to 8K bits of contiguous EEPROM memory. The device is available in the standard 8-pin PDIP, 8-pin SOIC (3.90 mm), 8- pin 2x3 DFN, 8-pin MSOP and TSSOP packages. Package Types Block Diagram Pin Function Table Name Function VSS Ground SDA Serial Data SCL Serial Clock VCC +4.5V to 5.5V Power Supply A0, A1, A2 Chip Selects Test Test Pin: may be tied high, low or left floating VSS VCC Test SCL SDA PDIP, MSOP SOIC, TSSOP VSS VCC Test SCL SDA DFN VSS Test SCL SDA VCC I/O Control Logic Memory Control Logic XDEC HV Generator EEPROM Array YDEC VCC VSS Sense Amp. R/W Control SDA SCL A0 A1 A2 1K 5.0V I2C™ Serial EEPROM I2C is a trademark of Philips Corporation.

© 2007 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†) † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS All parameters apply across the specified operating ranges unless otherwise noted. VCC = +4.5V to +5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Parameter Symbol Min. Max. Units Conditions SCL and SDA pins: High-level input voltage VIH

0.7 VCC

V Low-level input voltage VIL .3 VCC V Hysteresis of Schmitt Trigger inputs VHYS

0.05 VCC

V (Note) Low-level output voltage VOL .40 V IOL = 3.0 mA, VCC = 4.5V Input leakage current ILI μA VIN = VSS or VCC, WP = Vss Output leakage current ILO μA VOUT = VSS or VCC Pin capacitance (all inputs/outputs) CIN, COUT pF VCC = 5.0V (Note) TA = 25°C, f = 1 MHz Operating current ICC Read mA VCC = 5.5V, SCL = 400 kHz ICC Write mA VCC = 5.5V Standby current ICCS μA VCC = 5.5V, SDA = SCL = VCC WP = VSS Note: This parameter is periodically sampled and not 100% tested.

© 2007 Microchip Technology Inc. DS21201G-page 3 24C01C TABLE 1-2: AC CHARACTERISTICS FIGURE 1-1: BUS TIMING DATA All parameters apply across the specified operating ranges unless otherwise noted. Vcc = 4.5V to 5.5V Industrial (I): TA- = -40°C to +85°C Automotive (E): TA- = -40°C to +125°C Parameter Symbol Tamb > +85°C -40°C ≤ Tamb ≤ +85°C Units Remarks Min. Max. Min. Max. Clock frequency FCLK 100 400 kHz Clock high time THIGH 4000 600 ns Clock low time TLOW 4700 1300 ns SDA and SCL rise time TR 1000 300 ns (Note 1) SDA and SCL fall time TF 300 300 ns (Note 1) Start condition hold time THD:STA 4000 600 ns After this period the first clock pulse is generated Start condition setup time TSU:STA 4700 600 ns Only relevant for repeated Start condition Data input hold time THD:DAT ns (Note 2) Data input setup time TSU:DAT 250 100 ns Stop condition setup time TSU:STO 4000 600 ns Output valid from clock TAA 3500 900 ns (Note 2) Bus free time TBUF 4700 1300 ns Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum TOF 250 20 +0.1 CB 250 ns (Note 1), CB ≤ 100 pF Input filter spike suppression (SDA and SCL pins) TSP ns (Note 3) Write cycle time TWR 1.5 ms Byte or Page mode Endurance cycles 25°C, VCC = 5.0V, Block mode (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com. SCL SDA IN TSU:STA SDA OUT THD:STA TLOW THIGH TR TBUF TAA THD:DAT TSU:DAT TSU:STO TSP TF

© 2007 Microchip Technology Inc. 2.0 PIN DESCRIPTIONS 2.1 SDA Serial Data This is a bidirectional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 2.2 SCL Serial Clock This input is used to synchronize the data transfer from and to the device. 2.3 A0, A1, A2 The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. Up to eight 24C01C devices may be connected to the same bus by using different Chip Select bit combina- tions. These inputs must be connected to either VCC or VSS. 2.4 Test This pin is utilized for testing purposes only. It may be tied high, tied low or left floating. 2.5 Noise Protection The 24C01C employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 3.8 volts at nominal conditions. The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus. 3.0 FUNCTIONAL DESCRIPTION The 24C01C supports a bidirectional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access, and generates the Start and Stop conditions, while the 24C01C works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.

© 2007 Microchip Technology Inc. 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code; for the 24C01C this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24C01C devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are in effect the three Most Significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to a ‘1’ a read operation is selected, and when set to a ‘0’ a write operation is selected. Following the Start condition, the 24C01C monitors the SDA bus checking the control byte being transmitted. Upon receiving a ‘1010’ code and appro- priate Chip Select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24C01C will select a read or write operation. FIGURE 5-1: CONTROL BYTE FORMAT 5.1 Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1, A0 can be used to expand the contiguous address space for up to 8K bits by adding up to eight 24C01C devices on the same bus. In this case, software can use A0 of the control byte as address bit A8, A1 as address bit A9, and A2 as address bit A10. It is not possible to write or read across device boundaries. S ACK R/W Control Code Chip Select Bits Slave Address Acknowledge Bit Start Bit Read/Write Bit

© 2007 Microchip Technology Inc. FIGURE 8-3: SEQUENTIAL READ Bus Activity Master SDA Line Bus Activity Control Byte Data n Data n + 1 Data n + 2 Data n + X N O A C K A C K A C K A C K A C K S T O P P

© 2007 Microchip Technology Inc. DS21201G-page 11 24C01C 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (3.90 mm) Example: XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24C01C I/P 13F 0527 24C01CI SN 0527 13F 8-Lead MSOP Example: XXXX TYWW NNN 4C1C I527 13F 4C1CI 52713F e e 8-Lead 2x3 DFN XXX YWW NN 2N7 527 Example: XXXXT YWWNNN

© 2007 Microchip Technology Inc. Part Number 1st Line Marking Codes TSSOP MSOP DFN I Temp. E Temp. 24C01C 4C1C 4C1CT 2N7 2N8 Note: T = Temperature grade (I, E) Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

© 2007 Microchip Technology Inc. DS21201G-page 13 24C01C 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness .115 .130 .195 Base to Seating Plane .015 Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430 N NOTE 1 D A L b e E eB c Microchip Technology Drawing C04-018B

© 2007 Microchip Technology Inc. 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

1.27 BSC

A 1.75 Molded Package Thickness 1.25 Standoff § 0.10 0.25 Overall Width E

6.00 BSC

3.90 BSC

D

4.90 BSC

Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint

1.04 REF

φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15° D N e E NOTE 1 b A L c h h φ β α Microchip Technology Drawing C04-057B

© 2007 Microchip Technology Inc. DS21201G-page 15 24C01C 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.65 BSC

A 1.20 Molded Package Thickness 0.80 1.00 1.05 Standoff 0.05 0.15 Overall Width E

6.40 BSC

4.30 4.40 4.50 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint

1.00 REF

φ Lead Thickness c 0.09 0.20 Lead Width b 0.19 0.30 D N E NOTE 1 b e c A L φ Microchip Technology Drawing C04-086B

© 2007 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e A 1.10 Molded Package Thickness 0.75 0.85 0.95 Standoff 0.00 0.15 Overall Width E

3.00 BSC

D L 0.40 0.60 0.80 Footprint

0.95 REF

φ Lead Thickness c 0.08 0.23 Lead Width b 0.22 0.40 D N E NOTE 1 e b A c L φ Microchip Technology Drawing C04-111B

© 2007 Microchip Technology Inc. DS21201G-page 17 24C01C 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.50 BSC

A 0.80 0.90 1.00 Standoff 0.00 0.02 0.05 Contact Thickness

0.20 REF

D

2.00 BSC

E 1.30 1.75 Exposed Pad Width 1.50 1.90 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 D N E NOTE 1 EXPOSED PAD NOTE 1 K L N e b A NOTE 2 BOTTOM VIEW TOP VIEW Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc. APPENDIX A:

REVISION HISTORY

Corrections to Section 1.0, Electrical Characteristics. Revision E Added DFN package. Revision F (01/2007) Revised Features Section; Deleted Commercial Temp; Replaced Package Drawings; Replaced On-Line Support page; Revised Product ID System. Revision G (03/2007) Replaced Package Drawings (Rev. AM).

© 2007 Microchip Technology Inc. DS21201G-page 19 24C01C THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com

© 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21201G 24C01C What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2007 Microchip Technology Inc. DS21201G-page 21 24C01C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Package Temperature Range Device Device: 24C01C 1K I2C Serial EEPROM 24C01CT 1K I2C Serial EEPROM (Tape and Reel) Temperature Range: I = -40°C to +85°C E = -40°C to +125°C Package: P Plastic DIP (300 mil Body), 8-lead SN Plastic SOIC, (3.90 mm Body), 8-lead ST TSSOP (4.4 mm Body), 8-lead MS Plastic Micro Small Outline (MSOP), 8-lead MC 2x3 DFN, 8-lead

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21201G-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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