24AA01-I/MS

24AA01_07 MICROCHIP | Alldatasheet

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© 2007 Microchip Technology Inc. DS21711G-page 1 24AA01/24LC01B Device Selection Table Features:

• Single supply with operation down to 1.7V for 24AAXX devices, 2.5V for 24LCXX devices
• Low-power CMOS technology: - Read current 1 mA, typical - Standby current 1 μA, typical (I-temp)
• 2-wire serial interface, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz compatibility
• Page write time 3 ms, typical
• Hardware write-protect
• ESD protection >4,000V
• More than 1 million erase/write cycles
• Data retention >200 years
• Factory programmable available
• Packages include 8-lead PDIP, SOIC, TSSOP, DFN, MSOP and 5-lead SOT-23
• Pb-free and RoHS compliant
• Temperature ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Description: The Microchip Technology Inc. 24AA01/24LC01B (24XX01*) is a 1 Kbit Electrically Erasable PROM. The device is organized as one block of 128 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V with standby and active currents of only 1 μA and 1 mA, respectively. The 24XX01 also has a page write capability for up to 8 bytes of data. The 24XX01 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package. Package Types Block Diagram Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA01 1.7-5.5 400 kHz(1) I 24LC01B 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V VSS VCC WP SCL SDA PDIP, MSOP SOIC, TSSOP VSS VCC WP SCL SDA DFN VSS WP SCL SDA VCC SOT-23-5 SCL Vss SDA WP Vcc Note: Pins A0, A1 and A2 are not used by the 24XX01 (no internal connections). HV Generator EEPROM Array Page Latches YDEC XDEC Sense Amp. Memory Control Logic I/O Control Logic I/O WP SDA SCL VCC VSS R/W Control 1K I2C™ Serial EEPROM

© 2007 Microchip Technology Inc. 1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings (†) TABLE 1-1: DC CHARACTERISTICS † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Param. No. Sym. Characteristic Min. Typ. Max. Units Conditions VIH WP, SCL and SDA pins High-level input voltage

0.7 VCC

V VIL Low-level input voltage

0.3 VCC

V VHYS Hysteresis of Schmitt Trigger inputs

0.05 VCC

V (Note) VOL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 2.5V ILI Input leakage current μA VIN = VSS or VCC ILO Output leakage current μA VOUT = VSS or VCC CIN, COUT Pin capacitance (all inputs/outputs) pF VCC = 5.0V (Note) TA = 25°C, FCLK = 1 MHz ICC write Operating current 0.1 mA VCC = 5.5V, SCL = 400 kHz D10 ICC read 0.05 mA D11 ICCS Standby current 0.01 μΑ μΑ Industrial Automotive SDA = SCL = VCC WP = VSS Note: This parameter is periodically sampled and not 100% tested.

© 2007 Microchip Technology Inc. DS21711G-page 3 24AA01/24LC01B TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Param. No. Sym. Characteristic Min. Typ. Max. Units Conditions FCLK Clock frequency 400 100 kHz 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) THIGH Clock high time 600 4000 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC <2.5V (24AA01) TLOW Clock low time 1300 4700 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TR SDA and SCL rise time (Note 1) 300 1000 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TF SDA and SCL fall time 300 ns (Note 1) THD:STA Start condition hold time 600 4000 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TSU:STA Start condition setup time 600 4700 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) THD:DAT Data input hold time ns (Note 2) TSU:DAT Data input setup time 100 250 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TSU:STO Stop condition setup time 600 4000 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TAA Output valid from clock (Note 2) 900 3500 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TBUF Bus free-time: Time the bus must be free before a new transmission can start 1300 4700 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TOF Output fall time from VIH minimum to VIL maximum 20+0.1CB 250 250 ns 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) TSP Input filter spike suppression (SDA and SCL pins) ns (Notes 1 and 3) TWC Write cycle time (byte or page) ms Endurance cycles 25°C, (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.

© 2007 Microchip Technology Inc. DS21711G-page 5 24AA01/24LC01B 2.0 FUNCTIONAL DESCRIPTION The 24XX01 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while defining a device receiving data as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX01 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. 3.0 BUS CHARACTERISTICS The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 3-1). 3.1 Bus Not Busy (A) Both data and clock lines remain high. 3.2 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 3.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between the Start and Stop conditions is determined by the master device and is, theoretically, unlimited (although only the last sixteen will be stored when doing a write operation). When an overwrite does occur, it will replace data in a first-in first-out (FIFO) fashion. 3.5 Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge-related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX01) will leave the data line high to enable the master to generate the Stop condition. FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS Note: The 24XX01 does not generate any Acknowledge bits if an internal programming cycle is in progress. SCL SDA (A) (B) (D) (D) (A) (C) Start Condition Address or Acknowledge Valid Data Allowed to Change Stop Condition

© 2007 Microchip Technology Inc. 3.6 Device Addressing A control byte is the first byte received following the Start condition from the master device. The control byte consists of a four-bit control code. For the 24XX01, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are “don’t cares” for the 24XX01. The last bit of the control byte defines the operation to be performed. When set to ‘1’, a read operation is selected. When set to ‘0’, a write operation is selected. Following the Start condition, the 24XX01 monitors the SDA bus, checking the device type identifier being transmitted. Upon receiving a ‘1010’ code, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX01 will select a read or write operation. FIGURE 3-2: CONTROL BYTE ALLOCATION Operation Control Code Block Select R/W Read 1010 Block Address Write 1010 Block Address x x x R/W ACK Start Bit Read/Write Bit x = “don’t care” S Slave Address Acknowledge Bit Control Code Block Select Bits

© 2007 Microchip Technology Inc. 5.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for a flow diagram of this operation. FIGURE 5-1: ACKNOWLEDGE POLLING FLOW 6.0 WRITE PROTECTION The WP pin allows the user to write-protect the entire array (00-7F) when the pin is tied to VCC. If tied to VSS, the write protection is disabled. Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? Next Operation No Yes

© 2007 Microchip Technology Inc. DS21711G-page 9 24AA01/24LC01B 7.0 READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 7.1 Current Address Read The 24XX01 contains an address counter that maintains the address of the last word accessed, internally incremented by ‘1’. Therefore, if the previous access (either a read or write operation) was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with R/W bit set to ‘1’, the 24XX01 issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX01 discontinues transmission (Figure 7-1). 7.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX01 as part of a write operation. Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the inter- nal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a ‘1’. The 24XX01 will then issue an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX01 discontinues transmission (Figure 7-2). 7.3 Sequential Read Sequential reads are initiated in the same way as a random read, except that once the 24XX01 transmits the first data byte, the master issues an acknowledge (as opposed to a Stop condition in a random read). This directs the 24XX01 to transmit the next sequentially addressed 8-bit word (Figure 7-3). To provide sequential reads the 24XX01 contains an internal Address Pointer which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. 7.4 Noise Protection The 24XX01 employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 1.5V at nominal conditions. The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus. FIGURE 7-1: CURRENT ADDRESS READ S P Bus Activity Master SDA Line Bus Activity S T O P Control Byte Data (n) A C K N o A C K S T A R T Block Select Bits x = “don’t care” 0 x x x

© 2007 Microchip Technology Inc. DS21711G-page 11 24AA01/24LC01B 8.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 8-1. TABLE 8-1: PIN FUNCTION TABLE 8.1 A0, A1, A2 The A0, A1 and A2 pins are not used by the 24XX01. They may be left floating or tied to either VSS or VCC. 8.2 Serial Address/Data Input/Output (SDA) The SDA input is a bidirectional pin used to transfer addresses and data into and out of the device. Since it is an open-drain terminal, the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions. 8.3 Serial Clock (SCL) The SCL input is used to synchronize the data transfer to and from the device. 8.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, normal memory operation is enabled (read/write the entire memory 00-7F). If tied to VCC, write operations are inhibited. The entire memory will be write-protected. Read operations are not affected. This feature allows the user to use the 24XX01 as a serial ROM when WP is enabled (tied to VCC). Name PDIP SOIC TSSOP DFN MSOP SOT23

Description

+1.7V to 5.5V Power Supply

© 2007 Microchip Technology Inc. 9.0 PACKAGING INFORMATION 9.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (3.90 mm) Example: XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24LC01B I/P 13F 0527 24LC01BI SN 0527 13F 8-Lead MSOP Example: XXXX TYWW NNN XXXXT YWWNNN 4L1B I527 13F 4L1BI 52713F 5-Lead SOT-23 Example: XXNN M13F e e 8-Lead 2x3 DFN XXX YWW NN 214 527 Example:

© 2007 Microchip Technology Inc. DS21711G-page 13 24AA01/24LC01B Part Number 1st Line Marking Codes TSSOP MSOP SOT-23 DFN I Temp. E Temp. I Temp. E Temp. 24AA01 4A01 4A01T B1NN 211 24LC01B 4L1B 4L1BT M1NN N1NN 214 215 Note: T = Temperature grade (I, E) NN = Alphanumeric traceability code Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

© 2007 Microchip Technology Inc. 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness .115 .130 .195 Base to Seating Plane .015 Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430 N NOTE 1 D A L b e E eB c Microchip Technology Drawing C04-018B

© 2007 Microchip Technology Inc. DS21711G-page 15 24AA01/24LC01B 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

1.27 BSC

A 1.75 Molded Package Thickness 1.25 Standoff § 0.10 0.25 Overall Width E

6.00 BSC

3.90 BSC

D

4.90 BSC

Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint

1.04 REF

φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15° D N e E NOTE 1 b A L c h h φ β α Microchip Technology Drawing C04-057B

© 2007 Microchip Technology Inc. 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.65 BSC

A 1.20 Molded Package Thickness 0.80 1.00 1.05 Standoff 0.05 0.15 Overall Width E

6.40 BSC

4.30 4.40 4.50 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint

1.00 REF

φ Lead Thickness c 0.09 0.20 Lead Width b 0.19 0.30 D N E NOTE 1 b e c A L φ Microchip Technology Drawing C04-086B

© 2007 Microchip Technology Inc. DS21711G-page 17 24AA01/24LC01B 8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e A 1.10 Molded Package Thickness 0.75 0.85 0.95 Standoff 0.00 0.15 Overall Width E

3.00 BSC

D L 0.40 0.60 0.80 Footprint

0.95 REF

φ Lead Thickness c 0.08 0.23 Lead Width b 0.22 0.40 D N E NOTE 1 e b A c L φ Microchip Technology Drawing C04-111B

© 2007 Microchip Technology Inc. 5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Lead Pitch e

0.95 BSC

1.90 BSC

A 0.90 1.45 Molded Package Thickness 0.89 1.30 Standoff 0.00 0.15 Overall Width E 2.20 3.20 Molded Package Width 1.30 1.80 Overall Length D 2.70 3.10 Foot Length L 0.10 0.60 Footprint 0.35 0.80 Foot Angle φ 30° Lead Thickness c 0.08 0.26 Lead Width b 0.20 0.51 φ N b E D e A c L Microchip Technology Drawing C04-091B

© 2007 Microchip Technology Inc. DS21711G-page 19 24AA01/24LC01B 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.50 BSC

A 0.80 0.90 1.00 Standoff 0.00 0.02 0.05 Contact Thickness

0.20 REF

D

2.00 BSC

E 1.30 1.75 Exposed Pad Width 1.50 1.90 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 D N E NOTE 1 EXPOSED PAD NOTE 1 K L N e b A NOTE 2 BOTTOM VIEW TOP VIEW Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc. APPENDIX A:

REVISION HISTORY

Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC01B standard marking code. Revision D Added DFN package. Revision E Revised Figure 3-2 Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 7- 2 Random Read; Figure 7-3 Sequential Read. Revision F (01/2007) Revised Device Selection Table; Revised Features Section; Changed 1.8V to 1.7V; Revised Table 1-1, 1-2, 8-1; Replaced Package Drawings; Revised Product ID System. Revision G (03/2007) Replaced Package Drawings (Rev. AM).

© 2007 Microchip Technology Inc. DS21711G-page 21 24AA01/24LC01B THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

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© 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21711G 24AA01/24LC01B What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2007 Microchip Technology Inc. DS21711G-page23 24AA01/24LC01B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Package Temperature Range Device Device: 24AA01: 1.7V, 1 Kbit I2C™ Serial EEPROM 24AA01T: 1.7V, 1 Kbit I2C Serial EEPROM (Tape and Reel) 24LC01B: 2.5V, 1 Kbit I2C Serial EEPROM 24LC01BT: = 2.5V, 1 Kbit I2C Serial EEPROM (Tape and Reel) Temperature Range: I = -40°C to +85°C E = -40°C to +125°C Package: MC = 2x3 DFN, 8-lead P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead OT = SOT-23, 5-lead (Tape and Reel only) Examples: 24AA01-I/P: Industrial Temperature,1.7V PDIP package 24AA01-I/SN: Industrial Temperature, 1.7V, SOIC package 24AA01T-I/OT: Industrial Temperature, 1.7V, SOT-23 package, tape and reel 24LC01B-I/P: Industrial Temperature, 2.5V, PDIP package 24LC01B-E/SN: Extended Temperature, 2.5V, SOIC package 24LC01BT-I/OT: Industrial Temperature, 1.7V, SOT-23 package, tape and reel

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21711G-page 25 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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