BQ24780S_15 TI | Alldatasheet
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLUSC93,A]
- PDF pages: 11
Technical content
4.5-24V HOST bq24780S Hybrid Power Boost Charge Controller SYS Battery Pack N-FET Driver N-FET Driver 1S-4SSMBus IADP , ,PROCHOT PMON, IDCHG SMBus Controls V & I with high accuracy Adapter Detection Enhanced Safety: OCP , OVP , FET Short Integration: Loop Compensation; Soft-Start Comparator, BTST Diode RAC Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community bq24780S SLUSC93A –APRIL 2015–REVISED APRIL 2015 bq24780S1-to4-CellHybridPowerBoostModeBatteryChargeController WithPowerandProcessorHotMonitoring
1 Features 2 Applications
1• Industrial Innovative Charge Controller With • Notebook, Ultrabook, Detachable, and Tablet PC Hybrid Power Boost Mode • Handheld Terminal – Adapter and Battery Provides Power to • Industrial and Medical Equipment System Together for Intel® CPU Turbo Mode • Portable Equipment – Ultra-Fast Transient Response of 150 µs to Enter Boost Mode 3 Description – Hybrid Power Boost Mode from 4.5- to 24-V The bq24780S device is a high-efficiency, synchronous battery charger, offering low componentSystem count for space-constrained, multi-chemistry battery– Charge 1- to 4-Cell Battery Pack from 4.5- to charging applications.24-V Adapter The bq24780S device supports hybrid power boost• High Accuracy Power and Current Monitoring for mode (previously called "turbo boost mode"). It allowsCPU Throttling battery discharge energy to system when system– Comprehensive PROCHOT Profile power demand is temporarily higher than adapter – ± 2% Current Monitor Accuracy maximum power level. Therefore, adapter does not crash.– ± 5% System Power Monitor Accuracy (PMON) The bq24780S device uses two charge pumps to separately drive N-channel MOSFETs (ACFET,• Automatic NMOS Power Source Selection from RBFET, and BATFET) for automatic system powerAdapter or Battery source selection.– ACFET Fast Turn on in 100 µs Through SMBus, system power management• Programmable Input Current, Charge Voltage, microcontroller programs input current, chargeCharge and Discharge Current Limit current, discharge current, and charge voltage DACs– ±0.4% Charge Voltage (16-mV step) with high regulation accuracies. – ±2% Input Current (128-mA/step) The bq24780S device monitors adapter current– ±2% Charge Current (64-mA/step) (IADP), battery discharge current (IDCHG), and system power (PMON) for host to throttle back CPU– ±2% Discharge Current (512-mA/step) speed or reduce system power when needed.• High Integration The bq24780S device charges 1-, 2-, 3-, or 4-series– Battery LEARN Function Li+ cells.– Battery Present Monitor – Boost Mode Indicator Device Information(1) – Loop Compensation PART NUMBER PACKAGE BODY SIZE (NOM) – BTST Diode bq24780S WQFN (28) 4.00 × 4.00 mm2
- Enhanced Safety Features for Overvoltage (1) For all available packages, see the orderable addendum at the end of the datasheet.Protection, Overcurrent Protection, Battery, Inductor, and MOSFET Short-Circuit Protection
- Switching Frequency: 600 kHz, 800 kHz, and
1 MHz
- Realtime System Control on ILIM Pin to Limit Charge and Discharge Current
- 0.65 mA Adapter Standby Quiescent Current for Energy Star An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLUSC93A –APRIL 2015–REVISED APRIL 2015 www.ti.com
4 Revision History
Changes from Original (April 2015) to Revision A Page Contact TI via at: bq24780s_request@list.ti.com for full data sheet.
2 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated
www.ti.com SLUSC93A –APRIL 2015–REVISED APRIL 2015
5 Device and Documentation Support
5.1 Community Resources
The following links connect to TI community resources. Linked contents are provided AS IS by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
5.2 Trademarks
E2E is a trademark of Texas Instruments. Intel is a registered trademark of Intel Corporation. All other trademarks are the property of their respective owners.
5.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.4 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3
www.ti.com 23-Apr-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples BQ24780SRUYR ACTIVE WQFN RUY 28 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 24780S BQ24780SRUYT ACTIVE WQFN RUY 28 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 24780S (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 23-Apr-2015 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ24780SRUYR WQFN RUY 28 3000 367.0 367.0 35.0 BQ24780SRUYT WQFN RUY 28 250 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2015 Pack Materials-Page 2
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