ICS2304NZ-1 IDT | Alldatasheet

Document overview

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Technical content

Features

  • Packaged in 8-pin TSSOP (4.4 mm body)
  • Frequency range of 0 to 140 MHz
  • Less than 100 ps skew between outputs
  • Distribute one clock input to one bank of four outputs
  • Operating voltage of 3.3 V ±10%
  • Available in commercial and industrial temperature ranges Block Diagram Logic ControlOE CLK_IN CLK2 CLK1 CLK0 CLK3

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 2 ICS2304NZ-1 REV G 110110 Pin Assignment Functionality Table Pin Descriptions CLK_IN OE CLK0 CLK2 GND VDD CLK1 CLK31 Inputs Outputs CLK_IN OE CLK(3:0) 0 0 Tristate 01 0 1 0 Tristate 11 1 Pin Number Pin Name Pin Type Pin Description 1 CLK_IN Input Input reference frequency. 2 OE Input Output Enable. When OE is low, it tri-states clock outputs. 3 CLK0 Output Buffered clock output. 4 GND Power Connect to ground. 5 CLK1 Output Buffered clock output. 6 VDD Power Power supply for 3.3 V. 7 CLK2 Output Buffered clock output. 8 CLK3 Output Buffered clock output.

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 3 ICS2304NZ-1 REV G 110110 Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS2304NZ-1. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Notes: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51. Recommended Operation Conditions Timing Requirements Over Recommended Ranges of Supply Voltage and Operating Free-air Temperature Item Rating Supply Voltage Range, VDD -0.5 V to 4.3 V Input Voltage Range, VI (see notes 1 and 2) -0.5 V to V DD + 0.5 V Output Voltage Range, VO (see notes 1 and 2) -0.5 V to V DD + 0.5 V Input Clamp Current, IIK (VI<0 or VI>VDD)± 50 mA Output Clamp Current, IIK (VO<0 or VO)± 50 mA Continuous Total Output Current, IO (VO = 0 to VDD)± 50 mA Package Thermal Impedance, θ JA (see note 3): PW Package 230.5° C/W Storage Temperature Range, Tstg -65° C to 150° C Parameter Min. Typ. Max. Units Supply Voltage, VDD 33 .3 3 .6 V High-level Input Voltage, VIH 0.7 x VDD V Low-level Input Voltage, VIL 0.3 x VDD V Input Voltage, VI 0V DD V High-level Output Current, IOH -24 mA Low-level Output Current, IOL 24 mA Operating Free-air Temperature, TA -40 – +85 ° C Min. Typ. Max. Units Clock Frequency, fCLK 0 140 MHz

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 4 ICS2304NZ-1 REV G 110110 Electrical Characteristics at 3.3 V over Recommended Free-air Temperature Range VDD = 3.3 V ±10%, TA = -40°C to +85°C (unless stated otherwise) Note 1: Guaranteed by design, not 100% tested in production. Parameter Symbol Conditions Min. Typ. Max. Units Input Voltage V IK VDD at 3.3 V, II = -18 mA -1.2 V High-level Output Voltage V OH VDD = min to max, IOH = -1 mA VDD-0.2 3.3 VVDD = 3 V, IOH = -24 mA 2 2.3 VDD = 3 V, IOH = -12 mA 2.4 2.7 Low-level Output Voltage V OL VDD = min to max, IOH = 1 mA 0.222 0.2 VVDD = 3 V, IOL = 24 mA 0.61 0.8 VDD = 3 V, IOL = 12 mA 0.31 0.55 High-level Output Current I OH VDD = 3 V, VO = 1 V -53 -40 mA VDD = 3.3 V, VO = 1.65 V -54 Low-level Output Current I OL VDD = 3 V, VO = 2 V 40 53 mA VDD = 3.3 V, VO = 1.65 V 57 Input Current I I V = VDD or VO 0.1 50 µA Dynamic Supply Current I DD Unloaded outputs at

66.67 MHz

(Note 1) CI VDD = 3.3 V, VI = 0V or 3.3 V 35 p F Output Capacitance (Note 1) CO VDD = 3.3 V, VI = 0V or 3.3 V 3.2 pF

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 5 ICS2304NZ-1 REV G 110110 Switching Characteristics at 3.3 V over Recommended Ranges of Supply Voltage and Operating Free-air Temperature VDD = 3.3 V ±10%, TA = -40°C to 85°C (unless stated otherwise) Note 1: Guaranteed by design, not 100% tested in production. Parameter Symbol Conditions Min. Typ. Max. Units High-to-Low Propagation Delay (Note 1) t PLH VO = VDD/2 1.8 3.1 3.8 ns Low-to-High Propagation Delay (Note 1) t PHL VO = VDD/2 1.8 2.9 3.8 ns Output Skew Window (Note 1) T SK(o) V O = VDD/2 50 100 ps Pulse Skew = | tPLH - tPHL | (Note 1) T SK(p) V O = VDD/2 300 ps Process Skew (Note 1) T SK(pr) V O = VDD/2 500 ps CLKIN High Time (Note1) T high

66 MHz 6 ns

140 MHz 3 ns

CLKIN Low Time (Note1) T low Rise Time (Note 1) T r VOL=0.8 V, VOH=2.0 V 1.2 2.0 ns Fall Time (Note 1) T f VOH=2.0 V, VOL=0.8 V 1.2 2.0 ns Cycle-to-Cycle Jitter T cyc-cyc Loaded outputs 200 ps Jitter, 1-Sigma T j1s 10,000 cycles 14 40 ps

Figure 2. Voltage Thresholds for Propagation Delay (tpd) Measurements Figure 3. Output Skew Figure 4. Clock Waveform

0.2 VDD

0.5 VDD

0.4 VDD

0.35 VDD

Figure 7. Low-level Output Voltage vs. Low-level Output Current

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 9 ICS2304NZ-1 REV G 110110 Marking Diagram (commercial) Marking Diagram (industrial) Notes: 2. YYWW is the last two digits of the year and week that the part was assembled. 3. “L ” denotes Pb (lead) free package. BOTTOMTOP YYWW 304NL #### BOTTOMTOP #### YYWW 04NIL

LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER IDT® LOW SKEW PCI/PCI-X BUFFER 10 ICS2304NZ-1 REV G 110110 Package Outline and Package Dimensions (8-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch) Package dimensions are kept current with JEDEC Publication No. 95, MO-153

Ordering Information

“LF” suffix to the part number are the Pb-Free configuration, RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, IDT assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature 2304NZG-1LF see page 9 Tubes 8-pin TSSOP 0 to +70 ° C 2304NZG-1LFT Tape and Reel 8-pin TSSOP 0 to +70 ° C 2304NZGI-1LF Tubes 8-pin TSSOP -40 to +85 ° C 2304NZGI-1LFT Tape and Reel 8-pin TSSOP -40 to +85 ° C INDEX AREA 1 2 D E1 E SEATING PLANE AA2 e - C - b aaa C c L Millimeters Inches Symbol Min Max Min Max A- - 1.20 -- 0.047 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.032 0.041 b 0.19 0.30 0.007 0.012 C 0.09 0.20 0.0035 0.008 D 2.90 3.10 0.114 0.122 E 6.40 BASIC 0.252 BASIC E1 4.30 4.50 0.169 0.177 e 0.65 Basic 0.0256 Basic L 0.45 0.75 0.018 0.030 α 0° 8° 0° 8°

© 2010 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA Corporate Headquarters Integrated Device Technology, Inc. www.idt.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Innovate with IDT and accelerate your future networks. Contact: w w w.IDT.com ICS2304NZ-1 LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER