2301210-2

1-1773707-6 TEC | Alldatasheet

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DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT ZSFP+ PLUGGABLE I/O INTERCONNECT The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28 Gbps NRZ and 56 Gbps PAM-4. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is hotswappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+ connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm cost savings as this would eliminate the need to fully redesign for higher performance. The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire product family is offered as a dual source option with Molex. LLC.

PAGE 2DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT zSFP+ Pluggable I/O Interconnect 20-Pin Surface-Mount Connector Electrical

• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC between contacts Mechanical
• Mating Force: 25N
• Unmating Force: 11.5N
• Durability (min.): 250 cycles Physical
• High-temperature thermoplastic housing (glass-filled, UL 94V-0 black)
• High-performance copper alloy contacts
• Plating: - Nickel underplating; Tin plating on solder tail area; Gold plating on mating area - Plating options: 15 and 30ȝ” Gold or Palladium Nickel
• Operating Temperature: -40 to +85 o C

FEATURES

• Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10
• Gbps Ethernet and 16 Gbps Fibre Channel
• Surface-mount connector design for single high 1xN cages
• Press-fit 1xN cages and stacked assemblies (connector and cage) for one-step, easy PCB placement
• Coupled, narrow-edged, blanked- and formed-contact beam geometry and insert molding for superior signal integrity, mechanical and electrical performance
• Backwards-compatibility: Shares same mating interface and cage dimensions with the SFP+ connector (connector/single high cages are also PCB footprint-compatible)
• Elastomeric gasket or spring finger options for EMI containment
• Single high cages (1xN) for design flexibility; accommodates belly-to-belly applications for increased density and PCB space savings; available in 1x1, 1x2, 1x3, 1x4 or 1x6 port configurations
• Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12 port
• Heat sinks, LEDs and plating choices offered
• Additional light pipe configurations available

APPLICATIONS

• Telecommunications: Cellular infrastructure, central office uplink equipment, optical transport equipment, switches/ routers, access equipment (CMTS, PON, DSL, etc)
• Data Center: Data center switches and routers, servers, storage
• Medical: Medical diagnostic equipment
• Networking: Network interface, switches, routers
• Test and Measurement Equipment No light pipes All 4 light pipes (shown left) Inner light pipes Outer light pipes [standard] Three light pipes Outer light pipes [reversed] Light pipe options include: Follow IEEE802.3 cd (including trace)

PAGE 3DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT zSFP+ Pluggable I/O Interconnect Ganged 1xN Cages Mechanical

• Transceiver insertion force (max.): 34 N without heat sink and clip; 45.37 N with heat sink and clip
• Transceiver extraction force (max.): 12.5 N without heat sink and clip; 14.36 N with heat sink and clip
• SFP+ module to surface-mount connector and zSFP+ cage.
• Cage press fit insertion force (max.): 44.5 N for single port cage, 54.3 N for ganged cage
• Cage press fit extraction force (min.): 8.9 N for single port and ganged cages
• Durability (min.): 100 cycles EMI Suppression Light Pipe Option Heat Sink Option 1X1 1X2 1x3 1X4 1X6 1X8 EMI Spring Fingers No No 2274001-1 2291579-1 (PCI) 2227728-1 2349050-1 2227730-1 2227732-1 2304921-1 2295325-6 Yes No 2274000-1 2227727-1 TBD 2227729-1 2227731-1 TBD Yes Yes TBD* TBD TBD 2304342-X 2293156-X 2294408-X Physical
• Cage material: Nickel Silver
• PCB thickness (min.): 1.50mm in single sided applications; 2.25mm (EMI springs) or 3.0mm (elastomeric gasket) in belly-to-belly applications
• Operating Temperature: -40 to +85 o C GHz Radiated source RF leakage (dB) -10 -20 -30 -40 -50 -60 -70 -80 0 5 10 15 20 25 30 Ganged SFP+ 1x4 — Ganged zSFP+ 1x4 — Ganged SFP+ 1x4 vs. zSFP+ 1x4 Connector P/N Description 2170088-1 30ȝ” in Au or Au Flash Over PdNi 2170088-2 15ȝ” in Au or Au Flash Over PdNi Cages with Elastomeric Gaskets EMI Suppression Light Pipe Option 1X1 1X2 1X4 1X6 1X8 EMI gasket No 2198709-1* 2198720-1 2198722-1 2198724-1 TBD** Yes 2198708-1* 2198719-1 2198721-1 2198723-1 TBD** Cages with EMI Springs *Tooling in process **Not yet tooled, but planned Follow IEEE802.3 cd ( including trace) Configuration 1X2 1x4 Part Number 2317010-1 2300275-1 zSFP+ 3 Row Belly-to-Belly Application

• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC between contacts Mechanical
• Durability (min.): 100 cycles Physical
• Cage material: Nickel Silver - High-temperature thermoplastic housing (glass-filled, UL 94V-0 black) - High-performance copper alloy contacts - Plating: Nickel underplating; Tin plating on solder tail area; 30ȝ ” Gold plating on mating area
• PCB thickness (min.): 1.57mm
• Operating Temperature: -40 to +85 o C Stacked 2xN Assemblies Stacked SFP+ vs. zSFP+ Radiated source RF leakage (dB) -10 -20 -30 -40 -50 -60 -70 -80 Stacked SFP+ — Stacked zSFP+ — 0 5 10 15 20 25 30 GHz Upper contact row — Lower contact row — EMI Suppression Performance Light Pipe Configuration 2 x 1 2x2 2x4 2x6 2x8 2x12 EMI gasket Standard None 2198318-1 2198325-1 2180324-1 2198339-1 2198346-1 2288172-1 All 4 2198318-2 2198325-2 2180324-2 2198339-2 2198346-2 2288172-2 Inner 2198318-3 2198325-3 2180324-3 2198339-3 2198346-3 2288172-3 Outer 2198318-4 2198325-4 2180324-4 2198339-4 2198346-4 2288172-4 3 1-2198318-7 1-2198325-7 1-2180324-7 1-2198339-7 1-2198346-7 1-2288172-7 Outer (reversed) 1-2198318-8 1-2198325-8 1-2180324-8 1-2198339-8 1-2198346-8 1-2288172-8 Thermally Enhanced Multiple -- -- 3-2180324-0 -- -- 2227838-8 EMI spring fingers Standard None 2198318-5 2198325-5 2180324-5 2198339-5 2198346-5 2288172-5 All 4 2198318-6 2198325-6 2180324-6 2198339-6 2198346-6 2288172-6 Inner 2198318-7 2198325-7 2180324-7 2198339-7 2198346-7 2288172-7 Outer 2198318-8 2198325-8 2180324-8 2198339-8 2198346-8 2288172-8 3 1-2198318-9 1-2198325-9 1-2180324-9 1-2198339-9 1-2198346-9 1-2288172-9 Outer (reversed) 2-2198318-0 2-2198325-0 2-2180324-0 2-2198339-0 2-2198346-0 2-2288172-0 Thermally Enhanced Multiple -- -- 3-2180324-1 2291491-1 -- 2227838-7 2301210-2 PAGE 4DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT zSFP+ Pluggable I/O Interconnect zSFP+ Stacked Interconnects SFP28 PN list

zSFP+ Stacked Interconnects SFP56 PN list Tooled NOT YET TOOLED, BUT PLANNED EMI Suppression Performance Light Pipe 2 x 1 2x2 2x4 2x6 2x8 2x12 EMI gasket Standard NONE 2349202-1 2343522-1 2339978-1 2347721-1 2340033-1 2349201-1 INNER/OUTER 2349202-2 234522-2 2339978-2 2347721-2 2340033-2 2349201-2 INNER 2349202-3 2343522-3 2339978-3 2347721-3 2340033-3 2349201-3 OUTER 2349202-4 2343522-4 2339978-4 2347721-4 2340033-4 2349201-4 CENTER/ REVERSED OUTER 1-2349202-7 1-2343522-7 1-239978-7 1-2347721-7 1-2340033-7 1-2288172-7 REVERSED OUTER 1-2349202-8 1-2343522-8 1-2339978-8 1-2347721-8 1-2340033-8 1-2349201-7 Airflow Enhanced NONE 3-2339978-0 3-2347721-0 3-2340033-0 1-2349201-8 EMI spring fingers Standard NONE 2349202-5 234522-5 2339978-5 2347721-5 2340033-5 2349201-5 INNER/OUTER 2349202-6 2343522-6 2339978-6 2347721-6 2340033-6 2349201-6 INNER 2349202-7 2343522-7 2339978-7 2347721-7 2340033-7 2349201-7 OUTER 2349202-8 2343522-8 2339978-8 2347721-8 2340033-8 2349201-8 CENTER/ REVERSED OUTER 1-2349202-9 1-2343522-9 12339978-9 1-2347721-9 1-2340033-9 1-2349201-9 REVERSED OUTER 2-2349202-0 2-2343522-0 2-2339978-0 2-2347721-0 2-2340033-0 2-2349201-0 REVERSED Airflow Enhanced NONE - 3-2343522-3 3-2339978-1 3-2347721-1 3-2340033-1 2-2349201-1 CENTER/ REVERSED OUTER REVERSED OUTER - - - - - - Airflow Enhanced & Insulator Tape NONE - - 3-2339978-4 - 3-2340033-3 2-2349201-2 Top Cage Heatsink Opening NONE - - - - 4-2340033-0 - PAGE 5DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT zSFP+ Pluggable I/O Interconnect Configuration 2x4 2x12 Part Number 2357518-1 2357514-1 zSFP+ Stacked Belly-to-Belly 2357514-1 2357518-1

Features and Benefits

• Compatible with IEEE 802.3by and Fibre Channel industry standards
• Supports single lane data rate up to 28 Gbps
• Optimized construction to minimize insertion loss and cross talk
• Customized cable braid termination limits EMI radiation
• Backward compatible with existing SFP+ form factor connectors and cages
• Pull-to-release latch design
• 30AWG through 32AWG cable
• Straight and breakout cable assembly configurations available
• Customizable EEPROM mapping for cable signature
• RoHS compliant Industry Standards
• 25G Ethernet (IEEE 802.3by)
• Fibre Channel
• SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)
• SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28) SFP28 Part Number Detail Base Part Number Description AWG Dash to Length (meters) 0.5 1 1.5 2 3 4 5 2821262 SFP28 to SFP28 Straight Assembly 33 -1 -2 -3 -4 2821222 30 -5 -3 -2 -1 2821223 28 -2 -1 -3 2821224 26 -1 -2 -3 2821033 QSFP28 to 4x SFP28 Breakout Assembly 33 -8 30 -1 -10 -2 28 -4 26 -12 -5 -3 Contact your TE Representative for customized lengths. QSFP28 to 4x SFP28 Breakout Cable Assembly SFP28 to SFP28 Straight Cable Assembly PAGE 6 zSFP+ Pluggable I/O Interconnect DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT SFP28 Direct Attach Copper Cable Assemblies TE’s SFP28 passive copper cable assembly features two differential copper pairs, providing one data transmission channel at speeds up to 28Gbps per channel that meets 25G Ethernet performance requirements. SFP28 is designed for applications in the data center, networking and telecommunications markets that require a high speed, reliable cable assembly, Offered in a broad range of wire gages – from 26AWG through 33AWG – this next generation copper cable assembly features low insertion loss and low cross talk. TE’s SFP28 assemblies share the same mating interface with SFP+ form factors, making it backward compatible with existing SFP+ I/O ports. SFP28 can be used with legacy 10G Ethernet and 16G Fibre Channel applications with substantial signal integrity margin. In addition to SFP28 straight cables, TE offers break out assemblies with a 100G QSFP28 module on one end breaking out to four SFP28 modules on the opposite end of the assembly. In-line SI based production testing ensures that each cable assembly meets the electrical performance requirements of the applicable industry standard specification.

DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT For More Information te.com/products/zsfp+ TE Technical Support Center USA: +1 (800) 522-6752 Canada: +1 (905) 475-6222 Mexico +52 (0) 55-1106-0800 Latin/S. America: +54 (0) 11-4733-2200 Germany: +49 (0) 6251-133-1999 UK: +44 (0) 800-267666 France: +33 (0) 1-3420-8686 Netherlands: +31 (0) 73-6246-999 China: +86 (0) 400-820-6015 Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined www.te.com/leadfree :KLOH7(KDVPDGHHYHU\\UHDVRQDEOHHႇRUWWRHQVXUHWKHDFFXUDF\\RIWKHLQIRUPDWLRQLQWKLVEURFKXUH7(GRHVQRWJXDUDQWHHWKDWLWLV HUURUIUHHQRUGRHV7(PDNHDQ\\RWKHUUHSUHVHQWDWLRQZDUUDQW\\RUJXDUDQWHHWKDWWKHLQIRUPDWLRQLVDFFXUDWHFRUUHFWUHOLDEOHRUFXUUHQW7( UHVHUYHVWKHULJKWWRPDNHDQ\\DGMXVWPHQWVWRWKHLQIRUPDWLRQFRQWDLQHGKHUHLQDWDQ\\WLPHZLWKRXWQRWLFH7(H[SUHVVO\\GLVFODLPVDOOLPSOLHG ZDUUDQWLHVUHJDUGLQJWKHLQIRUPDWLRQFRQWDLQHGKHUHLQLQFOXGLQJEXWQRWOLPLWHGWRDQ\\LPSOLHGZDUUDQWLHVRIPHUFKDQWDELOLW\\RU¿WQHVVIRUD SDUWLFXODUSXUSRVH7KHGLPHQVLRQVLQWKLVEURFKXUHDUHIRUUHIHUHQFHSXUSRVHVRQO\\DQGDUHVXEMHFWWRFKDQJHZLWKRXWQRWLFH6SHFL¿FDWLRQV DUHVXEMHFWWRFKDQJHZLWKRXWQRWLFH&RQVXOW7(IRUWKHODWHVWGLPHQVLRQVDQGGHVLJQVSHFL¿FDWLRQV te.com © 2019 TE Connectivity Ltd. family of companies. All Rights Reserved. 1-1773707-6 DND PDF 11/19 TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology. ZXP is a registered trademark of Molex LLC. Other logos, product and company names mentioned herein may be trademarks of their respective owners. 1-1773707-6 DND PDF 10/20