2225B0R5F101CT

2220B104K500CT WALSIN | Alldatasheet

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Multilayer Ceramic Capacitors Approval Sheet Page 1 of 10 ASC_1825 2220 2225_025I_DS May. 2019 *Contents in this sheet are subject to change without prior notice. MULTILAYER CERAMIC CAPACITORS 1825, 2220 & 2225 Sizes NP0, X7R Dielectrics Halogen Free & RoHS Compliance

Multilayer Ceramic Capacitors Approval Sheet Page 2 of 10 ASC_1825 2220 2225_025I_DS May. 2019 1. HOW TO ORDER

2220 B 104 K 500 C T

Inch (mm) 1825 (4563) 2220 (5750) 2225 (5763) Dielectric N =NP0 B =X7R Capacitance Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: 0R5=0.5pF 1R0=1.0pF 104=10x10 =100nF Tolerance F=±1% G =±2% J=±5% K =±10% M =±20% Rated voltage Two significant digits followed by no. of zeros. And R is in place of decimal point. 250 = 25 VDC 500 = 50 VDC 101 = 100 VDC 251= 250 VDC 501= 500 VDC 631 = 630 VDC 102= 1000 VDC 152= 1500 VDC 202= 2000 VDC 252= 2500 VDC 302= 3000 VDC 402= 4000 VDC Termination C =Cu/Ni/Sn Packaging style T=7” reeled 2. EXTERNAL DIMENSIONS 3. GENERAL ELECTRICAL DATA Dielectric NP0 X7R Size 1825, 2220, 2225 Capacitance* 10pF to 0.1µF 1000pF to 10uF Capacitance tolerance F (±1%), G (±2%), J (±5%), K (±10%) J (±5%), K (±1 0%), M (±20%) Rated voltage (WVDC) 25V, 50V, 100V, 200V, 250V, 500V, 630V, 1000V, 1500V, 2000V, 2500V, 3000V, 4000V Tan δ* Cap<30pF: Q ≥400+20C Cap ≥30pF: Q ≥1000 ≤2.5% Operating temperature -55 to +125° C Capacitance characteristic ±30ppm ±15% Termination Ni/Sn (lead-free termination) temperature for NP0. temperature for X7R. ** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° C for 1 hour, then leave in ambient condition for 24±2 hours before measurement. T W L MB MB Fig. 1 The outline of MLCC Size Inch (mm) L (mm) W (mm) T(mm) (Symbol) M B min (mm) 2.00±0.20 (K) 2.50±0.30 (M) 2.80±0.30 (U) 0.75±0.35 # Reflow soldering only is recommended.

Multilayer Ceramic Capacitors Approval Sheet Page 3 of 10 ASC_1825 2220 2225_025I_DS May. 2019 4. CAPACITANCE RANGE 4-1 NP0 Dielectric DIELECTRIC NP0 SIZE 1825 2220 2225 RATED VOLTAGE (VDC) 50 100 200 250 500 630 1000 2000 3000 4000 50 100 200 250 500 630 1000 2000 3000 4000 50 100 200 250 500 630 1000 2000 3000 4000 Capacitance 10pF (100) K K K K K K K K K K K K K K K K K K K K K K K K K K K 12pF (120) K K K K K K K K K K K K K K K K K K K K K K K K K K K 15pF (150) K K K K K K K K K K K K K K K K K K K K K K K K K K K 18pF (180) K K K K K K K K K K K K K K K K K K K K K K K K K K K 22pF (220) K K K K K K K K K K K K K K K K K K K K K K K K K K K 27pF (270) K K K K K K K K K K K K K K K K K K K K K K K K K K K 33pF (330) K K K K K K K K K K K K K K K K K K K K K K K K K K K 39p F (390) K K K K K K K K K K K K K K K K K K K K K K K K K K K 47pF (470) K K K K K K K K K K K K K K K K K K K K K K K K K K K 56pF (560) K K K K K K K K K K K K K K K K K K K K K K K K K K K 68pF (680) K K K K K K K K K K K K K K K K K K K K K K K K K K K 82pF (820) K K K K K K K K K K K K K K K K K K K K K K K K K K K 100pF (101) K K K K K K K K K K K K K K K K K K K K K K K K K K K 120pF (121) K K K K K K K K K K K K K K K K K K K K K K K K 150pF (151) K K K K K K K K K K K K K K K K K K K K K K K K 180pF (181) K K K K K K K K K K K K K K K K K K K K K K K K 220pF (221) K K K K K K K K K K K K K K K K K K K K K K K K 270pF (271) K K K K K K K K K K K K K K K K K K K K K K K K 330pF (331) K K K K K K K K K K K K K K K M K K K K K K K K 390pF (391) K K K K K K K K K K K K K K K M K K K K K K K K 470pF (471) K K K K K K K K K K K K K K K M K K K K K K K K 560pF (561) K K K K K K K K K K K K K K K M K K K K K K K K 680pF (681) K K K K K K K M K K K K K K K M K K K K K K K K 820pF (821) K K K K K K K M K K K K K K K M K K K K K K M M 1,000pF (102) K K K K K K K M K K K K K K K M K K K K K K M M 1,200pF (122) K K K K K K K K K K K K M M M K K K K K K M 1,500pF (152) K K K K K K M K K K K K M M M K K K K K K M 1,800pF (182) K K K K K K M K K K K K M M K K K K K K M 2,200pF (222) K K K K K K M K K K K K M M K K K K K K M 2,700pF (272) K K K K K K M K K K K K M M K K K K K K M 3,300pF (332) K K K K K K M K K K K K M M K K K K K K M 3,900pF (392) K K K K K M M K K K K K M M K K K K K K M 4,700pF (472) K K K K K M M K K K K K M M K K K K K K M 5,600pF (562) K K K K K M K K K K K M K K K K K M M 6,800pF (682) K K K K K M K K K K K M K K K K K M M 8,200pF (822) K K K K K M K K K K K M K K K K K M M 0.010uF (103) K K K K K M K K K K K M K K K K K M M 0.012 µF (123) K K K K K K K K K K K K K K K 0.015 µF (153) K K K K K K K K K K K K K K K 0.018 µF (183) K K K K K K K K K K K K K K K 0.022 µF (223) K K K K K K K K K K K K K K K 0.027 µF (273) K K K K K K K K K K K K K K 0.033 µF (333) K K K K K K K K K K K K K K 0.039 µF (393) K K K M M K K K M K K K K K 0.0 47 µF ( 47 3) K K K K K M M K K K K K 0.0 56 µF ( 56 3) K K M K K M K K M M M 0.0 68 µF ( 68 3) K K M K K M K K M M M 0.0 82 µF ( 82 3) K M M M K K M M 0. 1µF ( 104 ) M M M M K M M 0.12 µF (12 4) 0. 15 µF (15 4) 0. 18 µF (18 4) 0.22 µF (22 4) 0.27 µF (27 4) 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 4 of 10 ASC_1825 2220 2225_025I_DS May. 2019 4-2 X7R Dielectric DIELECTRIC X7R SIZE 1825 2220 RATED VOLTAGE (VDC) 50 100 200 250 500 630 1000 1500 2000 3000 4000 25 50 100 200 250 500 630 1000 1500 2000 2500 3000 4000 Capacitance 1,000pF (102) K K K K K K K K K K K K K K K K K K K K K K K 1,200pF (122) K K K K K K K K K K M K K K K K K K K K K K M 1,500pF (152) K K K K K K K K K K M K K K K K K K K K K K M 1,800pF (182) K K K K K K K K K K M K K K K K K K K K K K M 2,200pF (222) K K K K K K K K K K K K K K K K K K K K K 2,700pF (272) K K K K K K K K K K K K K K K K K K K K K 3,300pF (332) K K K K K K K K K K K K K K K K K K K K K 3,900pF (392) K K K K K K K K K K K K K K K K K K K K K 4,700pF (472) K K K K K K K K K K K K K K K K K K K K K 5,600pF (562) K K K K K K K K K M K K K K K K K K K K K 6,800pF (682) K K K K K K K K K M K K K K K K K K K M M 8,200pF (822) K K K K K K K K K M K K K K K K K M M M M 0.010 µF (103) K K K K K K K K K M K K K K K K K M M M M 0.012 µF (123) K K K K K K K M M U K K K K K K K M M U U 0.015 µF (153) K K K K K K K M M U K K K K K K K M M U U 0.018 µF (183) K K K K K K K M M U K K K K K K K U U U U 0.022 µF (223) K K K K K K K M M K K K K K K K U U 0.027 µF (273) K K K K K K K U U K K K K K K K U U 0.033 µF (333) K K K K K K K U U K K K K K K K U U 0.039 µF (393) K K K K K K K U U K K K K K K K U U 0.047 µF (473) K K K K K K K U U K K K K K K K U U 0.056 µF (563) K K K K K K K K K K K K K K U U 0.068 µF (683) K K K K K K K K K K K K K M 0.082 µF (823) K K K K K K M K K K K K K M 0.10 µF (104) K K K K K K M K K K K K K M 0.12 µF (124) K K K K K K K K K K K K M 0.15 µF (154) K K K K K K K K K K K K U 0.18 µF (184) K K K K K K K K K K K K U 0.22 µF (224) K K K K K K K K K K K K U 0.27 µF (274) K K K K K K K K K K K K 0.33 µF (334) K K K K K K K K K K K K 0.39 µF (394) K K K K K K K K K K K K 0.47 µF (474) K K K K K K K K K K K K 0.56 µF (564) K K K K M M K K K K M M 0.68 µF (684) K K K K K K K K M M 0.82 µF (824) K K K K K K K K U U 1.0 µF (105) K K K K K K K K U U 1.5 µF (155) K K K K K M 2.2 µF (225) K K K K K M 3.3 µF (335) K K K K K 4.7 µF (475) K K K K M 6.8 µF (685) M M U 10 µF (106) U U U 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 5 of 10 ASC_1825 2220 2225_025I_DS May. 2019 DIELECTRIC X7R SIZE 2225 RATED VOLTAGE (VDC) 25 50 100 200 250 500 630 1000 1500 2000 3000 4000 Capacitance 1,000pF (102) K K K K K K K K K K K K 1,200pF (122) K K K K K K K K K K K M 1,500pF (152) K K K K K K K K K K K M 1,800pF (182) K K K K K K K K K K K M 2,200pF (222) K K K K K K K K K K K 2,700pF (272) K K K K K K K K K K K 3,300pF (332) K K K K K K K K K K K 3,900pF (392) K K K K K K K K K K K 4,700pF (472) K K K K K K K K K K K 5,600pF (562) K K K K K K K K K K M 6,800pF (682) K K K K K K K K K K M 8,200pF (822) K K K K K K K K K K M 0.010 µF (103) K K K K K K K K K K M 0.012 µF (123) K K K K K K K K M M M 0.015 µF (153) K K K K K K K K M M M 0.018 µF (183) K K K K K K K K M M U 0.022 µF (223) K K K K K K K K M M 0.027 µF (273) K K K K K K K K M M 0.033 µF (333) K K K K K K K K M M 0.039 µF (393) K K K K K K K K U U 0.047 µF (473) K K K K K K K K U U 0.056 µF (563) K K K K K K K K U U 0.068 µF (683) K K K K K K K K 0.082 µF (823) K K K K K K K K 0.10 µF (104) K K K K K K K M 0.12 µF (124) K K K K K K K U 0.15 µF (154) K K K K K K K U 0.18 µF (184) K K K K K K K U 0.22 µF (224) K K K K K K K U 0.27 µF (274) K K K K K K K 0.33 µF (334) K K K K K K K 0.39 µF (394) K K K K K K K 0.47 µF (474) K K K K K K K 0.56 µF (564) K K K K K K K 0.68 µF (684) K K K K K 0.82 µF (824) K K K K K 1.0 µF (105) K K K K K 1.5 µF (155) K K K M M 2.2 µF (225) K K K M M 3.3 µF (335) K K K 4.7 µF (475) K K 6.8 µF (685) M M 10 µF (106) U U 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative. 5. PACKAGING STYLE AND QUANTITY Size Thickness/Symbol (mm) Plastic tape 7” reel 13” reel 1825 (4563) 2220 (5750) 2225 (5763) 2.00±0.20 K 1000 - 2.50±0.30 M 500 - 2.80±0.30 U 500 - Unit: pieces

Multilayer Ceramic Capacitors Approval Sheet Page 6 of 10 ASC_1825 2220 2225_025I_DS May. 2019 6. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Condition Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance Class I: (NP0) C ≤1000pF, 1.0±0.2Vrms ，1MHz±10% C>1000pF, 1.0±0.2Vrms ，1KHz±10% Class II: (X7R) C ≤10µF, 1.0±0.2Vrms ，1KHz±10% C>10µF, 0.5±0.2Vrms ，120Hz±20% At 25° C ambient temperature. * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) * Q/DF: NP0: Cap ≥30pF, Q ≥1000; Cap<30pF,Q ≥400+20C. X7R: ≤2.5%. 4. Dielectric Strength *To apply voltage ( ≤100V) 250%. *Duration: 1 to 5 sec. *Charge & discharge current less than 50mA. * No evidence of damage or flash over during test. *To apply voltage: 200V ~ 300V ≥ 2 times V DC 500V ~ 999V ≥ 1.5 times V DC 1000V ~ 3000V ≥ 1.2 times V DC 4000V ≥ 1.1 times V DC *Duration: 1 to 5 sec. *Charge & discharge current less than 50mA. 5. Insulation Resistance U R ≤100V: To apply voltage at U R for max. 120 sec. U R >100V: To apply voltage at U R (500V max.) for 60 sec. * ≥10G Ω or R•C ≥100 Ω-F whichever is smaller. 6. Temperature Coefficient With no electrical load. T.C. Operating Temp NP0 -55~125° C at 25° C X7R -55~125° C at 25° C * Capacitance change: NP0: Within ±30ppm/° C. X7R: Within ±15%. 7. Adhesive Strength of Termination * Pressurizing force ：10N * Test time: 10±1 sec. * No remarkable damage or removal of the terminations. Vibration Resistance * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * No remarkable damage. * Cap change and Q/D.F.: To meet initial spec. 9. Solderability * Solder temperature: 235±5° C * Dipping time: 2±0.5 sec. 75% min. coverage of all metalized area. 10. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: NP0: within ±5% or 0.5pF whichever is larger. X7R: within ±12.5%. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to Soldering Heat * Solder temperature: 260±5° C * Dipping time: 10±1 sec * Preheating: 120 to 150° C for 1 minute before imme rse the capacitor in a eutectic solder. * Before initial measurement (Class II only): Perform 150+0/- 10° C for 1 hr and then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: NP0: within ±2.5% or 0.25pF whichever is larger. X7R: within ±7.5%. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * 25% max. leaching on each edge. 12. Temperature Cycle * Conduct the five cycles according to the temperatures and time. Step Temp. (° C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 * Before initial measurement (Class II only): Perform 150+0/-10° C for 1 hr and then set for 24±2 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change ： NP0: within ±2.5% or 0.25pF whichever is larger. X7R: within ±7.5%. * Q/D.F.: NP0: To meet initial requirements. X7R: ≤1.5 × Initial requirements. * I.R: To meet initial requirements.

Multilayer Ceramic Capacitors Approval Sheet Page 7 of 10 ASC_1825 2220 2225_025I_DS May. 2019 No. Item Test Condition Requirements 13. Humidity (Damp Heat) Steady State * Test temp.: 40±2° C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: NP0: within ±5% or 0.5pF whichever is larger. X7R: within ±12.5%. * Q/D.F.: NP0: More than 30pF Q ≥350, 10pF ≤C ≤30pF, Q ≥275+2.5C. Less than 10pF Q ≥200+10C. X7R: ≤2 × Initial requirements. * I.R.: ≥1G Ω or R•C ≥50 Ω-F whichever is smaller. 14. Humidity (Damp Heat) Load *Test temp. ：40±2° C *Humidity ：90~95%RH *Test time ：500+24/-0 hrs. *To apply voltage ： Rated voltage (MAX. 500V) *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: NP0: ±7.5% or 0.75pF whichever is larger. X7R: within ±12.5% * Q/D.F.: NP0: More than 30pF,Q ≥200;C<30pF, Q ≥100+10/3C X7R: ≤2 × Initial requirements. * I.R.: ≥500M Ω or R•C ≥5Ω-F whichever is smaller. 15. High Temperature Load (Endurance) * Test temp.:125±3° C * To apply voltage: (1) Cap. ≥1µF: 150% of rated voltage. (2) Ur ≤250V: 200% of rated voltage. (3) 250V<Ur ≤500V : 150% of rated voltage. (4) 500V<Ur ≤3000V: 120% of rated voltage. (5) 4000V: 110% of rated voltage. *Test time: 1000+24/-0 hrs. *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: NP0: within ±3% or 0.3pF whichever is larger. X7R: within ±12.5%. * Q/D.F.: NP0: More than 30pF Q ≥350, 10pF ≤C ≤30pF, Q ≥275+2.5C Less than 10pF Q ≥200+10C X7R: ≤2 × Initial requirements. * I.R.: ≥1G Ω or R•C ≥50 Ω-F whichever is smaller.

Multilayer Ceramic Capacitors Approval Sheet Page 8 of 10 ASC_1825 2220 2225_025I_DS May. 2019 APPENDIXES ◙ Constructions ◙ Tape & reel dimensions Size 1825 2220 2225 Chip Thickness K(2.00) M(2.50) U(2.80) T 0.30 +/-0.1 0.30 +/-0.1 0.30 +/-0.1 0.30 +/-0.1 0.30 +/-0.1 0.30 +/-0.1 W 12.00 +/-0.30 12.00 +/-0.30 12.00 +/-0.30 12.00 +/-0.30 12.00 +/-0.30 12.00 +/-0.30 P0 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 10xP 0 40.00 +/-0.20 40.00 +/-0.20 40.0 +/-0.20 40.0 +/-0.20 40.0 +/-0.20 40.0 +/-0.20 P1 8.00 +/-0.10 8.00 +/-0.10 8.00 +/-0.10 8.00 +/-0.10 8.00 +/-0.10 8.00 +/-0.10 P2 2.00 +/-0.10 2.00 +/-0.10 2.00 +/-0.10 2.00 +/-0.10 2.00 +/-0.10 2.00 +/-0.10 D 0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 D 1 1.50 +/-0.10 1.50 +/-0.10 1.50 +/-0.10 1.50 +/-0.10 1.50 +/-0.10 1.50 +/-0.10 E 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 F 5.50 +/-0.05 5.50 +/-0.05 5.50 +/-0.05 5.50 +/-0.05 5.50 +/-0.05 5.50 +/-0.05 Fig. 3 The dimension of plastic tape Fig. 4 The dimension of reel Size 1825, 2220, 2225 Reel size 7” C 13.0+0.5/-0.2 W 1 12.4+2.0/-0 A 178.0±1.0 N 60.0+1.0/-0 No. Name NPO X7R

1 Ceramic material CaZrO 3 based BaTiO 3 based

2 Inner electrode Ni

4 Middle layer Ni

5 Outer layer Sn

Fig. 2 The construction of MLCC

Multilayer Ceramic Capacitors Approval Sheet Page 9 of 10 ASC_1825 2220 2225_025I_DS May. 2019 APPLICATION NOTES ◙ Storage To prevent the damage of solderability of terminations, the following storage conditions are recommended: Indoors under 5 ~ 40° C and 20% ~ 70% RH. No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine. Packaging should not be opened until the capacitors are required for use. If opened, the pack should be re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesion performance. The capacitors should be used within 6 months and checked the solderability before use. ◙ Handling Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. ◙ Preheat In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required. The rate of preheat should not exceed 4° C per second and the final preheat temperature should be within 100° C of the soldering temperature for small chips such as 0402, 0603, 0805 and 1206, within 50° C of the soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. ◙ Soldering Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and substrate. Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2 mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron should be set to not more than 260° C. For bigger chips such as 1210, 1808, 1812, 2220 and 2225, etc. wave soldering and hand soldering are no recommended. Refer IPC/JEDEC J-STD-020D Method recommended soldering profiles: Reflow not sooner than 15 minutes and not longer th an 4 hrs after removal from the temperature/humidity chamber, subject the sample to 3 cycle of the appropriate reflow conditions as defined as blow Table description. Profile Feature Pb-Free Assembly Preheat/Soak Temperature Min.(T S min ) Temperature Max.(T S max ) Time(t S) from (T S min to TS max ) 150° C 200° C 60 to 120 seconds Ramp-up rate(T L to T P) 3° C/second max. Liquidous temperature(T L) Time(t L) maintained above T L 217° C 60 to 150 seconds Peak package body temperature(T P) For user T P must not exceed the Classification temp 260° C For suppliers T P must equal or exceed the Classification temp 260° C Time(T P)* within 5° C of the specified classification temperature(T C ) 30* second Ramp-down rate (T P to T L) 6° C/second max. Time 25° C to peak temperature 260° C 8 minutes max.

Multilayer Ceramic Capacitors Approval Sheet Page 10 of 10 ASC_1825 2220 2225_025I_DS May. 2019 Lead-free: Soldering temperature = 235 to 260° C, depending on product. Maximum temperature = Minimum temperature (235° C)+ /uni2206T+ Tolerance for oven process and measurement(5 ~ 7° C) Time at peak temperature = 10sec, Dwell above 217° C = 90sec, Ramping rate = 3° C/sec (heating) and 6° C/sec (heating). Classification Reflow Profiles Note: For example, T C is 260° C and time tP is 15 seconds. For user: The peak temperature must not exceed 260° C. The time above 255° C must not exceed 15 seconds. ◙ Cooling After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize stress in the solder joint. A cooling rate not exceeding 4° C per second should be used when forced cooling is necessary. ◙ Cleaning All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove flux residues and contamination from under the chips is very important. Chip Size ∆T 0805,1206 100 ° C 1210, 1808, 1812, 1825, 2211, 2220, 2225 50° C Soldering Solder Temp.(T C ) Soldering Time (t P) Reflow 235 – 260 ° C < 15 sec.