2212112-1 TEC | Alldatasheet

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Technical content

DATA AND DEVICES / / / MULTI-BEAM CARD EDGE CONNECTORS TE Connectivity’s (TE) next generation MULTI-BEAM card edge connectors deliver the best overall power and signal density to address server market requirements for performance, profile and cost. MULTI-BEAM card edge connectors are also applicable in global data communication applications to decrease costs. These products are the next generation card edge connectors over the current SEC-II power card edge products and deliver superior current and signal density with a unique design. The scalable and modular features also support greater flexibility in configuration and PCB design. KEY BENEFITS

  • High density
  • Better connectivity tolerance
  • Modular design
  • Better performance

APPLICATIONS

  • Data center
  • Telecommunications
  • Industrial automation devices
  • Power systems

Signal - up to 60% space savings Power - up to 30% space savings

ORDERING INFORMATION

2212112-1 Vertical 2x4 2x4 2214913-1 Vertical 2x13 2x24 2214913-4 Vertical 2x6 2x12 2214913-5 Vertical 2x4 2x4 2204072-1 Vertical 2x3 2x5 2214934-3 Vertical 2x2 2x4 2212078-1 Straddle 2x13 2x24 1-2212115-4 Right Angle 2x1 2x4 2212115-1 Right Angle 2x13 2x24 2214913-7 Vertical 2x2 2x6 1-2214934-4 Vertical 2x2 2x6 Vertical Straddle Right Angle PAGE 2 DATA AND DEVICES / / / MULTI-BEAM CARD EDGE CONNECTORS MULTI-BEAM Card Edge Connectors PRODUCT FEATURES & BENEFITS High Density

  • Highest signal density in the market with 60% signal space savings
  • 30% power density improvement over legacy products
  • Smaller pitch: signal pitch 1.00mm, power pitch 7.26mm
  • Greater power contact, max. 43A Better Connectivity Tolerance
  • Better gatherability for blind-mate applications: +/-2.0mm (X), +/-1.54mm (Y)
  • More clearance between PCB pads for signal contact to prevent solder bridging, and 1.3mm larger pads for easier alignment
  • Support two PCB thickness: 1.57mm and 2.36mm Modular Design
  • Common power and signal contact module
  • Flexible configuration with different contact quantities and positions
  • Better scalability (AC & DC, low power & high power) Better Performance
  • Excellent mechanical and electrical performance
  • Easy mating/un-mating with proper retention force
  • Low level contact resistance PRODUCT CONFIGURATIONS Specifications
  • Current rating:
  • Power contact: up to 43A
  • Signal contact: up to 2A
  • Voltage rating:
  • Power: 100V max.
  • Signal: 60V max.
  • Durability: 200 mating cycles
  • Mechanical shock: EIA-364-27
  • Vibration: EIA-364-28
  • Operating temperature: -55°C to 105°C
  • Low mating force
  • 6N max. per power contact
  • 1.5N max. per signal contact
  • PCB thickness: 1.57mm and 2.36mm
  • Material: high conductivity copper alloy and high temperature resin with RoHS compliance
  • Product spec: 108-32043
  • Application spec: 114-128016 te.com TE Connectivity, TE Connectivity (logo) and Every Connection Counts are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. © 2017 TE Connectivity Ltd. family of companies. All Rights Reserved. 1-1773923-7 06/17 DND