2064600000-PS MOLEX | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 23
Technical content
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 1 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A MICRO-FIT + SOLUTION WIRE TO BOARD CONNECTOR SYSTEM Female Crimp Terminal Receptacle Housing Series: 206460 Series: 206461 Vertical Header Assembly Right Angle Header Assembly Series: 206832 Series: 212528
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 2 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A TPA Right Angle Header Single Row Assembly Series: 206462 Series: 215760 Vertical Header Single Row Assembly Receptacle Single Row Housing Series: 216571 Series: 215759
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 3 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Header Single Row Assembly Header Single Row Assembly Series: 218989 Series: 218216
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 4 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Table of Contents ITEMS PAGE
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 5 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
1.0 SCOPE
This Product SPEC covers the Micro-Fit Plus 3.00 mm (.118 inch) centerline (pitch) Wire to Board connector system with gold and tin plating. Receptacle are terminated with 16 to 30 AWG wire using crimp technology.
2.0 PRODUCT DESCRIPTION
2.1 DESCRIPTION, SERIES NUMBER, AND LINKS
Female Crimp Terminal 206460 Receptacle Housing, Dual Row 206461 TPA 206462 Vertical Header Assembly, Dual Row 206832 Right Angle Header Assembly, Dual Row 212528 Receptacle Housing, Single Row 215759 Vertical Header Assembly, Single Row 216571 Right Angle Header Assembly, Single Row 215760 Header Assembly, Single Row -Right Angle, Nail，SMT - Right Angle, Clip, SMT -Vertical, Nail, SMT -Vertical, Clip, SMT 218989 Header Assembly, Dual Row -Right Angle, Nail, SMT - Right Angle, Clip, SMT -Vertical, Nail, SMT -Vertical, Clip, SMT - Right Angle, Clip, Through Hole 218216
2.2 DIMENSIONS, MATERIALS, PLATINGS
See the appropriate sales drawings for the information on dimensions, materials, plating and markings.
2.3 ENVIRONMENTAL CONFORMANCE
To find product compliance information: a. Go to molex.com b. Enter the part number in the search field. c. At the bottom of the page go to “Environmental” to see compliance status.
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 6 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
2.4 SAFETY AGENCY LISTINGS
UL File Number: E29179* *Series 218216 and Series 218989 is in process.
3.0 APPLICABLE DOCUMENTS AND SPECIFICATION
3.1 MOLEX DOCUMENTS
Micro-Fit Plus Connector System Test summary 2064600000-TS Micro-Fit Plus Connector System Application Summary 2064600000-AS Molex Quality Crimping Handbook Order No. 63800-0029 Molex Solderability Specification SMES-152 Molex Heat Resistance Specification AS-40000-5013 Molex Moisture Technical Advisory AS-45499-001 Molex Package Handling Specification 454990100-PK Molex Micro-Fit Plus Connector System Test Summary SR 2157590005-TS ATS – Application Tooling Specification* *Application Tooling Specification for terminals is not provided in this document. ATS for terminals can be available from respective terminal part number page in Molex.com
3.2 INDUSTRY DOCUMENTS
4.0 ELECTRICAL PERFORMANCE RATINGS
4.1 VOLTAGE
600 Volts AC (RMS) or DC. * This connector voltage meets the connector level provided by the safety agency. For application voltage requirements per UL-60950 or other standards, the creepage & clearance also needs to be determined based upon pads/traces on the PCB.
4.2 APPLICABLE WIRES
WIRE GAUGE INSULATION DIAMETER 16 AWG 2.00mm (.079 inch) MAXIMUM 18 AWG 1.85 mm (.073 inch) MAXIMUM 20 AWG 1.85 mm (.073 inch) MAXIMUM 22 AWG 1.85 mm (.073 inch) MAXIMUM 24 AWG 1.85 mm (.073 inch) MAXIMUM 26 AWG 1.27 mm (.050 inch) MAXIMUM 28 AWG 1.27 mm (.050 inch) MAXIMUM 30 AWG 1.27 mm (.050 inch) MAXIMUM
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 7 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
4.3 CURRENT RATINGS
Dual Row Wire to Board Current Rating (Amp Max.) As tested with tinned copper wire and Tin plated terminals Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Dual Row) 2 4 6 8 10 12 14 16 18 20 22 24 Dual Row Wire to Board Current Rating (Amp Max.) (As tested with tinned copper wire and gold plated terminals) Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Dual Row) 2 4 6 8 10 12 14 16 18 20 22 24
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 8 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Single Row Wire to Board Current Rating (Amp Max.) As tested with tinned copper wire and Tin plated terminals Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Single Row) 2 3 4 5 6 7 8 *Interpolated Values Single Row Wire to Board Current Rating (Amp Max.) (As tested with tinned copper wire and gold plated terminals) Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Single Row) 2 3 4 5 6 7 8
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 9 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Tin Plated Terminals Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire – Dual Row . Gold plated terminals Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire -- Dual Row .
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 10 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Tin Plated Terminals Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire – Single Row . Gold plated terminals Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire -- Single Row . Note: PCB trace design may greatly affect temperature rise results in Wire-to-Board applications. The ratings listed in the chart below are per Molex test method based on a 30 °C maximum temperature rise over ambient temperature and are provided as a guideline. Appropriate de -rating is required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from adjacent modules/components and other factors that influence connector performance. Wire
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 11 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A size, insulation thickness, stranding, tin coated or bare copper, wire length & crimp quality are other factors that influence current rating.
4.4 TEMPERATURE
Operating Temperature Range* (includes T-Rise from applied current): - 40°C to + 105°C Field Temperature and Field Life: 65° C for 10 years (based on EIA-364-1000, table 8) Note: Temperature life test duration (section 6.3 item 1) is based on the assumption that the contact spends its entire life at the rated field maximum temperature (based on EIA-364-1000, table 8)
4.5 DURABILITY
Plating Type Number of Cycles Tin Plated 25 Gold Plated 200 As tested in accordance with EIA-364-1000 test method (see section 6.2 item 5 of this specification). Durability per EIA-364-09
4.6 GLOW WIRE SERIES
5.0 QUALIFICATION
Laboratory condition, sample selection and test sequences are in accordance with EIA-364-1000.
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 12 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.1.1 Initial Contact Resistance (Low Level) Mate connectors: apply a maximum voltage of 20 mV and a current of 100 mA. EIA-364-23. Maximum (Initial): Tin: 10 m Gold: 6 m 6.1.2 Contact Resistance of Wire Termination (Low Level) Terminate the applicable wire to the terminal and measure wire using a voltage of 20 mV and a current of 100 mA. EIA-364-23 Maximum (Initial): Tin: 5 m Gold: 5 m
6.1.3 Insulation
Unmate & unmount connectors: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground. EIA-364-21 1,000 M minimum 6.1.4 Dielectric Withstanding Voltage Unmate connectors: apply a voltage of
2200 VAC for 1 minute between adjacent
terminals and between terminals to ground. EIA-364-20 No breakdown Current leakage < 5 mA 6.1.5 Temperature Rise (Current Profiling) Mate connectors, measure T- Rise @ Rated Current Per EIA-364-70, Method 2 Temperature rise: 30°C maximum (see chart) PASS 6.1.6 Temperature Rise (Via Curent Cycling) Mate connectors: measure the temperature rise at the rated current after: 96 hours (steady state) 240 hours (45 minutes ON and 15 minutes OFF per hour) 96 hours (steady state) Steady state per EIA-364-70, Method 2. Current cycling per EIA-364-55, Test Condition A, Test Method 4 Temperature rise: +30°C MAXIMUM [Over ambient]
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 13 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
6.2 MECHANICAL PERFORMANCE
ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.2.1 Connector Mate and Un-mate Forces [Initial cycle] Latch disabled Mate and un-mate connector (male to female) at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. EIA-364-13E, Method A Tin: 7.0 N (1.57 lbf) MAXIMUM mate force per circuit & 1.4 N (0.31 lbf) MINIMUM un-mate force per circuit; Gold: 1.0 N (0.45 lbf) MAXIMUM mate force per circuit & 0.2 N (0.16 lbf) MINIMUM un-mate force per circuit. 6.2.2 Crimp Terminal Retention Force (in housing) Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. EIA-364-29C, Method C 24.5 N (5.5 lbf) MINIMUM retention force 6.2.3 Crimp Terminal Insertion Force (into Housing) Apply an axial insertion force on the terminal at a rate of 25 ± 6 mm (1 ± ¼ inch). Per EIA-364-05 14.7 N (3.3 lbf) MAXIMUM insertion force
6.2.4 Housing Locking
Exert an axial force at a rate of 13 mm per minute (0.5 inch per minute) to separate the housing halves EIA-364-98 58 N MIN.
6.2.5 Durability Mate connectors up to 25 cycles at a maximum
rate of 10 cycles per minute Per EIA-364-09 Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) 6.2.6 Vibration (Random) Shock (Mechanical) EIA-364-1000 Test Group 3 (See section 7.0) Mate connectors and vibrate per EIA 364-28, test condition VII, Letter D. Test Duration: 15 minutes each axis. Mate connectors and shock at 50 g's with ½ sine wave (11 milliseconds) shocks in the ±X, ±Y, ±Z axes (18 shocks total). EIA-364-27, Test Condition H Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) Discontinuity < 1 microsecond
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 14 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A 6.2 MECHANICAL PERFORMANCE (CONT.) ITEM DESCRIPTION TEST CONDITION REQUIREMENT
6.2.7 Wire Pullout Force
(Axial) Apply an axial pullout force on the wire at a rate of 25 ± 6 mm (1 ± ¼ inch). Per EIA-364-08 Wire Size Min. pullout force 16 AWG 89 N (20.0 lbf) 18 AWG 89 N (20.0 lbf) 20 AWG 57.8 N (13.0 lbf) 22 AWG 35.6 N (8.0 lbf) 24 AWG 22.2 N (5.0 lbf) 26 AWG 13.3 N (3.0 lbf) 28 AWG 8.9 N (2.0 lbf) 30 AWG 6.6 N (1.5 lbf) 6.2.8 Header Pin Retention Force (From Header Housing) Apply an axial pullout force to pin at a rate of 25 ± 6 mm (1 ± ¼ inch). 13.7 N (3.1 lbf) MINIMUM retention force 6.2.9 Header Retention Force (From PCB) Apply an axial pullout force to Header at a rate of 25 ± 6 mm (1 ± ¼ inch). 20.0 N (4.49 lbf) per circuit MINIMUM
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 15 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
6.3 ENVIRONMENTAL PERFORMANCE
ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.3.1 Temperature life EIA-364-1000 Test group 1 (See section 7.0) Mate connectors; expose to : 240 hours at 105 ± 2 °C. Per EIA-364-17, Method A Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) & Visual: No Damage 6.3.2 Shock (Thermal) EIA-364-1000 Test group 2A & 2B (See section 7.0) Mate connectors; expose to 5 cycles of: Temperature °C Duration(Minutes) -4 + 0/-3 30 +25 ± 10 5 MAXIMUM +105 + 3/-0 30 +25 ± 10 5 MAXIMUM EIA-364-32, Test Condition VIII Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) & Visual: No Damage 6.3.3 Cyclic Temperature & Humidity EIA-364-1000 Test group 2A & 2B (See section 7.0) Mate connectors: cycle per EIA-364-31: 24 cycles at temperature 25 ± 3 °C at 80 ± 5% relative humidity and 65 ± 3 °C at 50 ± 5% relative humidity; dwell time of 1.0 hour; ramp time of 0.5 hours. Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) & Dielectric Withstanding Voltage: No Breakdown at 500 VAC & Insulation Resistance:
1000 Megohms MINIMUM &
Visual: No Damage 6.3.4 Thermal Cycling EIA-364-1000 Test group 5 (See section 7.0) Cycle the connector between 15 ± 3 °C and 85 ± 3 °C. Ramps time :14minutes Dwell time:15 minutes, and dwell times should ensure contacts reach the temperature extremes. Humidity is not controlled. 500 cycles. Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) & Visual: No Damage
6.3.5 Salt Spray
Mate connectors: Duration: 48 hours exposure; Atmosphere: salt spray from a 5% solution; Temperature: 35 +1/-2 °C Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) Visual: No Damage
6.3.6 Cold Resistance
Mate connectors: Duration: 96 hours; Temperature: -40 ± 3 °C Tin: 20 milliohms MAXIMUM Gold: 10 milliohms MAXIMUM (change from initial) Visual: No Damage
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 16 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A 6.3 ENVIRONMENTAL PERFORMANCE (CONT.) ITEM DESCRIPTION TEST CONDITION REQUIREMENT
6.3.7 Solderability Per SMES-152
Solder coverage: 95% MINIMUM (per SMES-152)
6.3.8 Solder
A) Wave Solder Process Dip connector terminal tails in solder; Solder Duration: 10 seconds MAX Solder Temperature: 260°C MAX Per AS-40000-5013 B) Convection Reflow Solder Process 260°C MAX Per AS-40000-5013 Visual: No Damage to insulator material
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 17 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
7.0 TEST SEQUENCE
Reliability Test Sequences Per EIA-364-1000 Group I Temperature Life Group II Thermal Shock Group II B Dielectric Withstand & Insulation Resistance Group III Vibration Group V Thermal Cycling Group VII Durability Initial Contact Resistance (Low Level) Initial Contact Resistance (Low Level) Dielectric Withstand & Insulation Resistance Initial Contact Resistance (Low Level) Initial Contact Resistance (Low Level) Dielectric Withstand Voltage Durability (Pre-conditioning) Durability (Pre-conditioning) Durability (Pre-conditioning) Durability (Pre-conditioning) Durability (Pre-conditioning) Initial Contact Resistance (Low Level) Contact Resistance (Low Level) Contact Resistance (Low Level) Thermal Shock Contact Resistance Contact Resistance Durability Temperature Life 105 °C for 1008 hrs or 240 hrs Thermal Shock Dielectric Withstand & Insulation Resistance Temperature Life (Pre-conditioning) Temperature Life (Pre-conditioning) Initial Contact Resistance (Low Level) Contact Resistance (Low Level) Contact Resistance (Low Level) Cyclic Temperature and Humidity Contact Resistance (Low Level) Contact Resistance (Low Level) Dielectric Withstand Voltage Reseating Cyclic Temperature and Humidity Dielectric Withstand & Insulation Resistance Vibration Thermal Cycling Contact Resistance (Low Level) Contact Resistance (Low Level) Reseating Contact Resistance (Low Level) Contact Resistance (Low Level) | | | | Reseating Dielectric Withstand & Insulation Resistance Mechanical shock Reseating | | Contact Resistance (Low Level) Contact Resistance (Low Level) Contact Resistance (Low Level) Thermal Disturbance Contact Resistance Reseating 3 cycles Contact Resistance
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 18 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A Temperature Rise T-Rise Profiling Steady State Temperature Rise Connector Mate and Un-mate Forces Crimp Terminal Insertion Force Crimp Terminal Retention Force Housing Locking Mechanism Strength Wire Crimp Pullout Force Individual Tests Header Pin Retention Force
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 19 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
8.0 SOLDER INFORMATION
Per SMES-152 and AS-40000-5013 *These specifications establish standard solderability test methods used to evaluate a products ability to accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on application, equipment, solder paste, PCB thickness, etc.
8.1 SOLDER PROCESS TEMPERATURES *
Wave Solder Temperature: 260°C Maximum Reflow Solder Temperature: 260°C Maximum
8.2 SOLDERING PROFILE
(This profile is per JEDEC J-STD-020D.1 and it is for guideline only; please see notes for additional information) Molex Solderability Specification SMES-152 (Click Here) Molex Connector Heat Resistance Specification AS-40000-5013 (Click Here)
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 20 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
9.0 PACKAGING
Parts shall be packaging to protect the parts from damage during standard shipping, storage, and handling. Refer Molex.com specific part number webpage to get the exact packaging document for that item. Description Requirement Average Ramp Rate 3°C/sec Max Preheat Temperature 150°C Min to 200°C Max Preheat Time 60 to 180 sec Ramp to Peak 3°C/sec Max Time over Liquids (217°C) 60 to 150 sec Peak Temperature 260 +0/-5°C Time within 5°C of Peak 20 to 40 sec Ramp - Cool Down 6°C/sec Max Time 25°C to Peak 8 min Max
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 21 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
10.0 CABLE TIE AND / OR TWIST TIE LOCATION
CKT Size Dim T Min. 2 4 6 0.50” (12.7mm) 8 0.75” (19.1mm) 10 12 1.00” (25.40mm) 14 16 1.25” (31.75mm) 18 20 1.50” (38.09mm) 22 24 1.75” (44.45mm) The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to significant bias by external factors such as a wire tie, wire twisting, or other means of bending or deforming of the wires that repositions them from their natural relaxed state or location where they enter the housing. Wires are to be dressed in such a manner to allow the terminals to float freely in the pocket. This dimensi on is general recommendation and may need to be adjusted for different wire gauges and wire type and insulation thickness and insulation material.
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 22 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A
11.0 POLARIZATION AND KEYING OPTIONS
11.1 Dual Row Receptacle (Series: 206461)
11.2 Vertical Header Assembly (Series: 206832)
11.3 Right Angle Header Assembly (Series:212528)
11.4 Single Row Receptacle (Series:215759)
Micro-Fit + Connector System Web Page TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: MICRO-FIT + WTB PRODCUT SPEC WIRE TO BOARD CONNECTOR SYSTEM SHEET No. EC No: 646943 23 of 23 DATE: 10/12/2020202 2/10/17 DOCUMENT NUMBER: DOC TYPE: DOC PART: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 2064600000-PS PS 000 ZIXUAQ NCSR NCSR TEMPLATE FILENAME: 1703070003 REV A