2110304-7

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 4

Technical content

0 PLC

1 PLC

2 PLC

3 PLC

4 PLC

DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity 2.00 2110304-8 2.80 2110304-6 D1 REVISED PER ECO-13-014703 22SEP2013 PP SH D2 REVISED PER ECO-14-008091 13MAY2014 PP SH D3 REVISED PER ECO-15-000306 08JAN2015 PP SH D4 REVISED PER ECO-15-013454 16SEP2015 pp SH Customer Drawing 2110304 C.ROHLER 13FEB2009 M. SCHMITT 13FEB2009 B. WERTZ 13FEB2009 1:1 1 4 D4 114-13120 -- - mm 0.1 0.5 0.5 0.13 0.13 GP 00 SFP+ 1X1 CAGE ASSEMBLY, SOLDER TAIL, EMI SPRINGS - - 00779 BY - ( )9.7 (A) TYP 8.95#0.15 PORT OPENING PORT OPENING 14.00 0.10 ( )11.5 ( )14.5 ( )48.7 1.20 2110304-7 2.80 2110304-5 2.00 2110304-3 2.80 2110304-1 DIM A PART NUMBER PRILIMINARY MATERIAL: CAGE - NICKEL SILVER ALLOY 0.25 THK. EMI SPRINGS - COPPER ALLOY FINISH: 2110304-5 CAGE - 1.27um MIN TIN OF SOLDER TAIL EMI SPRINGS - 0.8um MIN MATTE TIN OVER 0.8um MIN NICKEL NON-PLATED EDGES PERMISSIBLE. 3. MATES WITH SFP MSA COMPLIANT TRANSCEIVERS. PADS AND VIAS CHASSIS GROUND. DATUM AND BASIC DIMENSION ESTABLISHED BY CUSTOMER. 6. MINIMUM PC BOARD THICKNESS: SINGLE SIDED = 1.50 mm. 7. NOTE DELETED PACKAGE TYPE IS TAPE AND REEL. FOR ESD PROTECTION TAPE AND REEL PACKAGE ONLY. MATERIALS(COVER TAPE,EMBOSS TAPE,REEL,INNER LABEL ON REEL) USED WITH AN EPA AREA MUST PRIMARILY BE ELECTROSTATIC CONDUCTIVE OR ELECTROSTATIC DISSIPATIVE. NO MATERIAL SHOULD BE CHARGED UP TO MORE THAN 100 VOLTS. ALL SOLDER PIN SHOULD BE TIN DIPPED. EMI SPRINGS CAGE ASSEMBLY 1 2 910 910

DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity Customer Drawing 2110304 C.ROHLER 13FEB2009 M. SCHMITT 13FEB2009 B. WERTZ 13FEB2009 1:1 2 4 D4 114-13120 -- - mm 0.1 0.5 0.5 0.13 0.13 GP 00 SFP+ 1X1 CAGE ASSEMBLY, SOLDER TAIL, EMI SPRINGS - - 00779 BY - - SEE SHEET 1 - - - 2110304-1/-5/-6 2110304-3/-8 2110304-7 WITH LOCATE PIN WITH SOLDER PINS

DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity 34.5 10.0 5.0 10.0 PLATING REQUIRED -B- 1.05 0.05

2 HOLES

1.55 0.05 20X 0.50 0.03 20X 2.00 0.05 26.8 3X 42.3 6X 41.3 - SEE SHEET 1 - - - Customer Drawing 2110304 C.ROHLER 13FEB2009 M. SCHMITT 13FEB2009 B. WERTZ 13FEB2009 1:1 3 4 D4 114-13120 -- - mm 0.1 0.5 0.5 0.13 0.13 GP 00 SFP+ 1X1 CAGE ASSEMBLY, SOLDER TAIL, EMI SPRINGS - - 00779 BY - 5.68 8.58 11.08 14.25 16.25 Y.YY 11X o2.00 PLATING REQUIRED 1.05 0.05 4.8 9.6 9X n PLATING OPTIONAL 0.95 0.05 2.5 2.5 7.2 PLATING REQUIRED -A- 0.85 0.05 2.80 11.925 3.33 8.13 2.80 10.525 7.13.2 0.90 10.925 ( )11.93 ( )9.6 18X 0.8 10.010.0 10.05.0 15.45 MIN16.25 4X R MAX EACH CUTOUT 0.30 10.40 FROM THE TOP OF PCB TO INSIDE OF BEZEL CUT-OUT 0.23 +0.10 -0.14 38.90 0.30 ( )35.4 -X- 2110304-1/-5/-6/-7 RECOMMENDED PCB LAYOUT SCALE 8:1 SEE DETAIL A CROSS-HATCHED AREA DENOTES COMPONENT AND TRACE KEEP-OUT (EXCEPT CHASSIS GROUND) THIS AREA DENOTES COMPONENT KEEP-OUT (TRACES ALLOWED) DETAIL A SCALE 8:1 PIN #20 PIN #11 PIN #10 PIN #1 RECOMMENDED BEZEL CUTOUT SCALE 3:1 GUIDE PINS

DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity 26.80 41.30 42.30 3.33 - SEE SHEET 1 - - - Customer Drawing 2110304 C.ROHLER 13FEB2009 M. SCHMITT 13FEB2009 B. WERTZ 13FEB2009 2:1 4 4 D4 114-13120 -- - mm 0.1 0.5 0.5 0.13 0.13 GP 00 SFP+ 1X1 CAGE ASSEMBLY, SOLDER TAIL, EMI SPRINGS - - 00779 BY - 15.45 MIN16.25 10.40 BACK OF BEZEL TO PC BOARD CUTOUT 3.50 0.30 TOP OF PC BOARD TO INSIDE OF BEZEL 0.23 +0.10 -0.14 ( )10.40 BACK OF BEZEL TO FRONT OF PC BOARD 1.02 0.30 4X R MAX EACH CUTOUT 0.30 11.93 9.6 4.8 9X n PLATING OPTIONAL 0.95 0.05 3X 10 6X n PLATING REQUIRED 1.05 0.05 11X 2.00 2.48 PLATING REQUIRED -A- 0.85 0.05 2.5 2.5 7.2 3X 10 PLATING REQUIRED -B- 1.05 0.05 34.5 14.25 16.25 MIN CUTOUT 16.50 Y.YY 11X 2.00 20X 2.00 0.05 5 7.13.2 10.53 0.9 2X n1.55 0.05 18X 0.80 9.6 10.93 11.93 20X 0.50 0.03 8.13 2.80 2.80 Y X RECOMMENDED BEZEL CUTOUT SCALE 4:1 RECOMMENDED BEZEL AND PC BOARD ORIENTATION SCALE 4:1 2110304-3/-8 RECOMMENDED PCB LAYOUT SCALE 8:1 SEE DETAIL A THIS AREA DENOTES COMPONENT KEEP-OUT (TRACES ALLOWED) CROSS HATCHED AREA DENOTES COMPONENT AND TRACE KEEP-OUT (EXCEPT CHASSIS GROUND) DETAIL A SCALE 8:1 PIN #10 PIN #11 PIN #20 PIN #1