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DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity W/O INSULATING TAPE 13.5 PCI 2007464-9 W/ INSULATING TAPE 22.8 NETWORKING 2007464-8 W/O INSULATING TAPE 22.8 NETWORKING 2007464-7 W/O INSULATING TAPE 15.8 SAN 2007464-6 W/O INSULATING TAPE 13.5 PCI 2007464-5 W/ INSULATING TAPE 22.8 NETWORKING W/O INSULATING TAPE W/O INSULATING TAPE E1 ADD PART NUMBER WITH TAPE 27JUL2012 TX AC F REVISED PER ECO-12-021462 10DEC2012 TX AC F1 REVISED PER ECO-13-014600 11OCT2013 PP SH F2 REVISED PER ECO-14-000741 16JAN2014 PP SH Customer Drawing 2007464 Z.M.REAM 20NOV2007 M.R.SCHMITT 20NOV2007 R.H.WERTZ 20NOV2007 2 1 4 F2 108-2364 114-13120 mm 0.1 0.1 0.1 0.05 0.05 GP 00 SFP+ 1X1 CAGE ASSEMBLY, PRESS-FIT PRESS-FIT, EMI SPRINGS WITH HEATSINK 00779 BY - PORT OPENING 14 0.1 PORT OPENING 8.95 0.15 H MAX ( )14.5 ( ) TYP3 ( )11.5 ( )48.7 -C- -C- -C- 2007464-4
22.8 NETWORKING 2007464-3
15.8 SAN 2007464-2
W/O INSULATING TAPE 13.5 PCI 2007464-1 DESCRIPTION H MAX APPLICATION PART NUMBER MATERIAL: CAGE - 0.25mm THICK NICKEL SILVER ALLOY HEATSINK - ALUMINUM HEATSINK CLIP - STAINLESS STEEL EMI SPRING(S) - COPPER ALLOY FINISH: HEATSINK - ELECTROLESS NICKEL HEATSINK CLIP - PASSIVATE EMI SPRING(S) - 0.8um MIN MATTE TIN OVER 0.8um MIN NICKEL, NON-PLATED EDGES PERMISSIBLE. 3. MATES WITH SFP MSA COMPLIANT TRANSCEIVERS. PADS AND VIAS CHASSIS GROUND. DATUM AND BASIC DIMENSION ESTABLISHED BY CUSTOMER. 6. MINIMUM PC BOARD THICKNESS: SINGLE SIDED = 1.50mm DOUBLE SIDED = 3.00mm REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR RECOMMENDED DRILL HOLE DIAMETER AND PLATING THICKNESS. REFERENCE APPLICATION SPEC. 114-13120, HOLE C, FOR RECOMMENDED DRILL HOLE DIAMETER AND PLATING THICKNESS. DIMENSION APPLIES PRIOR TO INSERTION OF SFP MODULE. 10. CAGE ASSEMBLY, HEATSINK CLIP AND HEATSINK SHIPPED ASSEMBLED. HEAT SINK REFERENCE PART NUMBERS: 1829903-2 = 4.2 HIGH - PCI,PIN TYPE 1829904-2 = 6.5 HIGH - SAN,PIN TYPE 1829905-2 = 13.5 HIGH - NETWORKING,PIN TYPE 2170426-4 = 4.2 HIGH - PCI,PIN TYPE 2170427-4 = 6.5 HIGH - SAN,PIN TYPE 2170428-4 = 13.5 HIGH - NETWORKING,PIN TYPE 12. REMOVED 2007464-1 2007464-5 APPROXIMATE LOCATION OF DATE CODE HEATSINK CLIP PIN TYPE HEATSINK CAGE ASSEMBLY HEATSINK CLIP FIN TYPE HEATSINK CAGE ASSEMBLY 1 2
DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity - SEE SHEET 1 - - - Customer Drawing 2007464 Z.M.REAM 20NOV2007 M.R.SCHMITT 20NOV2007 R.H.WERTZ 20NOV2007 2 2 4 F2 108-2364 114-13120 mm 0.1 0.1 0.1 0.05 0.05 GP 00 SFP+ 1X1 CAGE ASSEMBLY, PRESS-FIT PRESS-FIT, EMI SPRINGS WITH HEATSINK 00779 BY - 2007464-4 AS SHOWN WITH INSULATING TAPE,PIN TYPE HEAT SINK 2007464-1,2,3 WITHOUT INSULATING TAPE,TAPE,PIN TYPE HEAT SINK 2007464-8 AS SHOWN WITH INSULATING TAPE,WITH FIN TYPE HEAT SINK 2007464-5,6,7 WITHOUT INSULATING TAPE,WITH FIN TYPE HEAT SINK 2007464-9 AS SHOWN
DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity 34.5 ( ) PLATING REQUIRED 1.05 2 HOLES 1.55 0.05 20X 0.5 0.03 20X 2 0.05 26.8 3X 42.3 6X 41.3 - SEE SHEET 1 - - - Customer Drawing 2007464 Z.M.REAM 20NOV2007 M.R.SCHMITT 20NOV2007 R.H.WERTZ 20NOV2007 2 3 4 F2 108-2364 114-13120 mm 0.1 0.1 0.1 0.05 0.05 GP 00 SFP+ 1X1 CAGE ASSEMBLY, PRESS-FIT PRESS-FIT, EMI SPRINGS WITH HEATSINK 00779 BY - 15.45 5.68 8.58 11.08 14.25 16.25 Y.YY 11X o2 11X 2 10X ( ) PLATING REQUIRED 1.05 4.8 9.6 9X n PLATING OPTIONAL 0.95 0.05 2.5 2.5 7.2 ( ) PLATING REQUIRED 0.85 2.8 11.925 3.33 8.13 2.8 10.525 7.13.2 0.9 10.925 ( )11.93 ( )9.6 18X 0.8 MIN16.25 4X R MAX EACH CUTOUT 0.3 10.4 TOP OF PC BOARD TO INSIDE OF BEZEL 0.23 +0.10 -0.14 BACK OF BEZEL TO FRONT OF PC BOARD 3.5 0.3 ( )10.17 Y AB X RECOMMENDED PCB LAYOUT SCALE 7:1 SEE DETAIL A CROSS-HATCHED AREA DENOTES COMPONENT AND TRACE KEEP-OUT (EXCEPT CHASSIS GROUND) THIS AREA DENOTES COMPONENT KEEP-OUT (TRACES ALLOWED) DETAIL A SCALE 8:1 PIN #20 PIN #11 PIN #10 PIN #1 RECOMMENDED BEZEL CUTOUT SCALE 4:1 RECOMMENDED BEZEL AND PC BOARD ORIENTATION SCALE 4:1 5 4
DIMENSIONS: TOLERANCES UNLESS OTHERWISE SPECIFIED: DWN CHK APVD MATERIAL FINISH PRODUCT SPEC APPLICATION SPEC WEIGHT P LTR DATE APVDDWNDESCRIPTION LOC DIST 5678 34 2 1 D B AA B C C D ALL RIGHTS RESERVED. RELEASED FOR PUBLICATION C COPYRIGHT THIS DRAWING IS UNPUBLISHED. 4805 (3/11) RESTRICTED TO THIS DRAWING IS A CONTROLLED DOCUMENT. TE Connectivity - SEE SHEET 1 - - - Customer Drawing 2007464 Z.M.REAM 20NOV2007 M.R.SCHMITT 20NOV2007 R.H.WERTZ 20NOV2007 2 4 4 F2 108-2364 114-13120 mm 0.1 0.1 0.1 0.05 0.05 GP 00 SFP+ 1X1 CAGE ASSEMBLY, PRESS-FIT PRESS-FIT, EMI SPRINGS WITH HEATSINK 00779 BY - 4X R MAX EACH CUTOUT 0.3 15.45 10.4
16.25 TOP OF PC BOARD
0.23 +0.10 -0.14 ( )10.17 16.25 14.25 12.625 11.08 10.325 8.58 6.825 5.68 1.625 Y.YY 34.5 7.2 2.5 2.5 ( ) PLATING REQUIRED 0.85( ) PLATING REQUIRED 1.05 4.8 9.6 11.925 PLATING OPTIONAL 0.95 0.05 3.325 8.825 26.8 6X 41.3 4X 42.3 10X ( ) PLATING REQUIRED 1.05 11X o2 11X o2 BACK OF BEZEL TO FRONT OF PC BOARD 3.5 0.3 20X 0.5 0.03 20X 2 0.05 18X 0.8 10.925 ( )11.93 ( )9.6 3.2 7.1
0.92 HOLES
1.55 0.05 3.33 2.8 8.13 2.8 10.525 Y A B X THIS AREA DENOTES COMPONENT KEEP-OUT (TRACES ALLOWED) RECOMMENDED BEZEL CUTOUT SCALE 4:1 RECOMMENDED BEZEL AND PC BOARD ORIENTATION SCALE 4:1 RECOMMENDED PCB LAYOUT FOR WITH INSULATING TAPE PART SCALE 8:1 SEE DETAIL B DETAIL B SCALE 8:1 PIN #11 PIN #20 PIN #10 PIN #1 4 7 4 8 4 7