SOM-C350 ADVANTECH | Alldatasheet
Document overview
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Technical content
Features
Intel® 12th Gen Core Processors (Code Name: Alder Lake S) COM-HPC® Client Size C ModuleSOM-C350 COM-HPC® client size C module pin out High scalability with socket type LGA 1700 CPU + R680E PCH 4 SODIMM DDR5 w/ ECC/non-ECC, max. 128GB High performance iRIS Xe graphic engine and PCIe x16 Gen5 High speed Ethernet 2.5GbE and USB 3.2 Gen2x2 Supports iManager, WISE-PaaS/DeviceOn and embedded software APIs Specifications Form Factor Form Factor COM-HPC® Size C Module Pin-out Type Client pin out Processor System CPU Intel Alder Lake-S Desktop CPU Core Number Up to 16C/24T/32EU/30M Socket Type LGA 1700 Platform Controller Hub Intel R680E BIOS AMI UEFI 256Mbit Memory Technology DDR5 3600 MT/s
1 DIMM 1R/2R - 4000
2 DIMMs 1R - 4000
2 DIMMs 2R - 3600
ECC Support ECC or non-ECC Max. Capacity up to 128GB Memory Type 4 SODIMM sockets Display Interface 3 PORT DDI Resolution Up to 8k Expansion PCI Express x16 1 PCIe x16 Gen5, and bifurcatable to 2 x8 PCI Express x1 (Gen4) 1 port PCIe x4 Gen4 (from CPU) and 12 ports PCIe x1 Gen4 (from PCH) PCI Express x1 (Gen3) 9 ports PCIe x1 Gen3 and 1port PCIe x1 Gen3 reserved for BMC Serial Bus SMBus Yes I2C Bus Yes. 1 port from EC (100kb/s & 400kb/s master mode support) and 1 port from PCH Ethernet 2.5GbE 2 port 2.5GbE I/O SATA 2 ports support SATA III 6.0Gb/s USB3.2 Gen2x2 2 ports (Option) USB3.2 Gen2x1 4 ports SPI Bus 2 ports (for BIOS ROM and GP_SPI) GPIO 4 ports GPI and 4 ports GPO Watchdog 65536 level, 0 ~ 65535 sec COM Port 2 Ports (2-Wire) TPM Optional TPM 2.0 (Infineon 9670) Smart Fan 2 Ports (for COM Module and carrier board. support 12V Fan) Power Type ATX: Vin, VSB, AT: Vin Supply Voltage Vin: 12V, VSB: 5V±5%, RTC Battery: 2.0-3.3V Power Consumption (Max.) N/A Power Consumption (Idle) N/A Environment Temperature Operating Standard: 0 ~ 60° C (32 ~ 140° F), Extend: -40 ~ 85° C (-40 ~ 185° F) with 0.7m/s air flow. Storage: 0 ~ 60° C (32 ~ 140° F) Humidity Operating: 40 °C @ 95% relative humidity, non-condensing Storage: 60 °C @ 95%relative humidity, non-condensing Vibration Resistance 3.5 Grms Mechanical Dimensions 160 x 120 mm (6.30" x 4.73") Software APIs: Utilities: All product specifications are subject to change without notice. Last updated: 29-Jul-2022
www.advantech.com/productsOnline Download Block Diagram SOM-C350
Ordering Information
Part No. CPU Cores (P+E) CPU TDP CPU Threads P-Cores Freq. E-Cores Freq. Graphic Execution Units Temp. SOM-C350C9R-U3A1 i9-12900E 16C (8+8) 65W 24 2.3GHz/5.0GHz 1.7GHz/3.8GHz 32 EU 0~60 °C SOM-C350C7R-U1A1 i7-12700E 12C (8+4) 65W 20 2.1GHz/4.8GHz 1.6GHz/3.6GHz 32 EU 0~60 °C SOM-C350C5R-U9A1 i5-12500E 6C (6+0) 65W 12 2.9GHz/4.5GHz NA 32 EU 0~60 °C SOM-C350C3R-H2A1 i3-12100E 4C (4+0) 60W 8 3.2GHz/4.2GHz NA 24 EU 0~60 °C SOM-C350PTR-H6A1 G7400E 2C (2+0) 46W 4 3.6GHz NA 16 EU 0~60 °C Packing List Part No. Description Quantity - SOM-C350 CPU Module 1 1970005474T001 Heatspreader of SOM-C350 1 Development Board Part No. Description SOM-DH3000-00A1 COM-HPC Development Board for Client Pinout with 5mm High Board to Board Connector Optional Accessories Part No. Description 1970005475T001 Semi-Cooler 120*120* 34mm 1970005473T001 QFCS 2.0 120 *143 *29mm Embedded OS OS Part No. Description Win10 (VL) 20706WX9VS0040 Img Win10 IoT Ent_LTSB 64 bit Ubuntu SOM-C350 Intel Alder Lake-S Processor 65W Connector Row Primary J2 Connector Row Primary J1 Intel Alder Lake-S PCH R680E DMI
1 DDI Port
2 DDI Ports
1x USB3.2 Gen2x1 8x USB 2.0 2x SATA III 2x Soundwire; 1x HDA 9 lanes PCIe Gen3 1x PCIe Gen3 PCIe_BMC (option) 2.5G LAN1 PCIe Gen3 eSPI, GP_SPI 2x I2C, SMBus (option), 2x COM, 12x GPIO, IPMB, Smart fan, WDT 1 eDP 4x USB3.2 Gen2x1 12 lanes PCIe Gen4 1x PCIe Gen32.5G LAN 2CH DDR5-4000, 4 SODIMMs: CHA: SODIMMx2 Max. 64GB CHB: SODIMMx2 Max. 64GB I225 I225 EIO-201 SPITPM2.0 (SLB9670) SPI BIOS Boot SPI SMBus 2x I2C (option)