18106 ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- R educe HDI construction by adapting smaller pitch devices to larger footprints
- C onvert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please con - tact factory for other pitch requirements)
- E nable the use of standard line and trace spacing
- E liminate the need for laster-drilled microvias motherboards GENERAL SPECIFICATIONS
- BOARD MATERIAL : 0.062 thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides
- P ADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
- SOLDER SPHERES : 63/37 Sn/Pb or Pb-free SAC 305
- TRACE WIDTH/SPACE : 0.003 [0.762]
- O PERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free MOUNTING CONSIDERATIONS 1.00mm pitch 18106 Rev. AB BGA Switch-A-Pitch Adapters CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ORDERING INFORMATION
To obtain a quote for a specific adapter, please email a request to info@arieselec.com with the following information:
- Y our name, company name, and telephone number
- A drawing or data sheet of the device to be placed on adapter (top image)
- A drawing or data sheet of the target footprint for the adapter (bottom image)
- A list of any other design parameters or restrictions that must be considered
- T he quantity of adapters to be quoted