18067 ARIES | Alldatasheet
Document overview
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- PDF pages: 1
Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- A c ost-effective means of upgrading to MSOP 0.5mm package SOIC without c hanging your PCB layout.
- A vailable on 0.300 [7.62] centers. GENERAL SPECIFICATIONS
- B OARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
- P INS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- P IN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290
- O PERATING TEMPERATURE: 221ºF [105ºC] MOUNTING CONSIDERATIONS 18067 Rev. AA P/N 1111841-X 0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter
ORDERING INFORMATION
1111841-8 = 8-Pin 1111841-8-P = Panelized Version CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS